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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 561, Epoxy Film, Assembly LOCTITE® ABLESTIK 561 is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561 adhesive can be debonded by
- Dielectric Constant (Relative Permittivity): 0.0
- Thermal Conductivity: 0.3000 W/m-K
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Description: LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides RF/EMI shielding Electrically conductive in x, y, z axes
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: OEM / Industrial
- Thermal Conductivity: 6.5 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 5025E, Epoxy Film, Die attach LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides
- Features: Thermal / Heat Conductive
- Industry: Military / Government (MIL-SPEC / GG)
- Thermal Conductivity: 6.5 W/m-K
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics,
- Coeff. of Thermal Expansion (CTE): 20 to 51 µin/in-F
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Paper / Paperboard, Plastic, Rubber / Elastomer, Wood / Wood Product
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Description: LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. This product provides high strength over a wider temperature range than is normally
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: OEM / Industrial
- Thermal Conductivity: 1.1 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 563K, Epoxy Film, Assembly LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. This product provides high
- Features: Thermal / Heat Conductive
- Thermal Conductivity: 1.1 W/m-K
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Supplier: Epoxies Etc...
Description: 10-3011 is a two component fast curing epoxy adhesive. This system provides a rapid cure in thin films and at low temperatures.
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.5
- Features: Electrical Insulating / Dielectric
- Industry: OEM / Industrial
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film LOCTITE® ABLESTIK 561KAP is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK
- Adhesive: Epoxy
- Backing: Specialty / Other
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Supplier: Master Bond, Inc.
Description: not contain any solvents or other volatiles. It is especially recommended where a thin layer of epoxy needs to cure very rapidly without adding external heat. Thin films as thin as 0.025" can become tack free in as little as 30 minutes. Another advantage is the
- Coeff. of Thermal Expansion (CTE): 16 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.3
- Dielectric Strength: Over 400 kV/in
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Supplier: Master Bond, Inc.
Description: weight. EP39-2 is very fast curing, even in very thing sections. Films as thin as 5 mil become tack free at ambient temperatures in only 3 hours and fully cure in 6-10 hours. The aforementioned film will even become tack-free at 40°F within 9 hours. Other desirable
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Elongation: 8 %
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Photonics / Optoelectronics, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Porous Surfaces, Other
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Supplier: Hi-Tech Seals, Inc.
Description: . The adhesive base reacts upon contact with the Activator layer to initiate the curing mechanism. The key word is layer – Activator is applied as a thin film or layer to one or both surfaces to be bonded. Adhesive base resin is applied to one surface and parts mated to
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Coeff. of Thermal Expansion (CTE): 3.94E-4 µin/in-F
- Cure Type / Technology: Reactive / Moisture Cured, Two Component System
- Dielectric Constant (Relative Permittivity): 12.34 to 14.92
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Supplier: Master Bond, Inc.
Description: ./minute and more have been obtained for thin films of the UV15X-2 polymer system. no solvents or other volatiles are released during the curing process. Cured coatings, adhesives and/or sealants feature a desirable combination of outstanding durability, toughness and thermal
- Coeff. of Thermal Expansion (CTE): 39 to 44 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
- Dissimilar Substrates: Yes
- Elongation: Over 20 %
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Supplier: Hi-Tech Seals, Inc.
Description: . The adhesive base reacts upon contact with the Activator layer to initiate the curing mechanism. The key word is layer – Activator is applied as a thin film or layer to one or both surfaces to be bonded. Adhesive base resin is applied to one surface and parts mated to
- Applied Thickness / Gap Fill: 0.0200 inch
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Cure Type / Technology: Reactive / Moisture Cured, Two Component System
- Industry: OEM / Industrial
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics,
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Air Setting / Film Drying, Single Component System
- Features: Electrically Insulating / Dielectric, Encapsulating / Potting, Thermal / Heat Conductive
- Thermal Conductivity: 2.31 W/m-K
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Supplier: Custom Fabricating & Supplies
Description: 3M™ Polyester Tape 8992 is a thin and conformable translucent blue polyester tape with a pressure sensitive silicone adhesive. This high-temperature tape is also designed with a thin polyester backing that resists shrinking, curling, tearing and edge lifting, offering reliable
- Adhesive: Acrylic, Pressure Sensitive (PSA), Silicone
- Backing: Plastic / Polymer, PET / Polyester, Specialty / Other
- Features: Removable
- Peel Strength / Adhesion: 1.94 lbs/in
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Supplier: Master Bond, Inc.
Description: ./minute and more have been obtained for thin films of the UV15X-2 polymer system. no solvents or other volatiles are released during the curing process. Cured coatings, adhesives and/or sealants feature a desirable combination of outstanding durability, toughness and thermal
- Chemistry: Epoxy, Resin Base / Polymer Binder
- Features: Protective
- Form: Liquid
- Operating / Use Temperature: -60 to 250 F
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Supplier: Plastonics, Inc.
Description: fluidized bed (dip) method is used when a heavy coating is required. Electrostatic (spray) is used for thin film applications and decorative needs. We have also developed the flow-clad (tumble) method. This is used when small parts with high volume require automation and complete
- Additional Services / Processes: Inspection / Monitoring, On-site / Field (Large Structures), Recoating / Refinishing, Research & Development
- Cleaning / Parts Washing: Burn-off / Thermal Cleaning, Degreasing, Stripping / Coating Removal, Ultrasonic Cleaning
- Coating Process: Dip / Immersion Coating, Painting, Plastic Coating, Powder Coating, Rubber Coating
- Finishing / Surface Treatment: Abrasive / Blasting, Sanding / Grinding
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Supplier: OMEGA Engineering, Inc.
Description: The SA1-RTD is a surface temperature sensor that can be applied to most clean, dry surfaces. Just peel off the release sheet on the bottom of the sensor and the silicone adhesive bonds the sensor to the surface, no cements or epoxies to mix, apply and cure. The thin design of
- Bare or Insulated Lead Wires: Yes
- Basic Element Used: RTD
- Probe Configuration: Flexible Probe, Flat/Ribbon
- Sensed Temperature: -99 to 554 F
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Supplier: FX PCB Co., Ltd.
Description: glass fiber-reinforced epoxy resin. A single-sided rigid PCB has a lower manufacturing cost than a single-sided flexible PCB. Single Layer Flex PCB Manufacturer’s Capability: when you are designing your flexible printed circuit boards, you may need to know the
- Thickness: 0.0157 inches
- Type: Film / Flexible Substrate
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Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
sensitive fabrication processes. By enabling clean, leak-tight electrical transmission, our feedthroughs support critical semiconductor operations such as deposition, etching, lithography, ion implantation, and thin-film processing. We offer highly customizable interconnect systems that combine (read more)
Browse Feedthroughs Datasheets for Douglas Electrical Components -
to a wide variety of substrates including metals, composites, ceramics, glass and many plastics. Supreme 11ANHT-2 provides thermal conductivity because of a small particle size aluminum nitride filler. This allows for the epoxy to be applied in very thin sections, and ultimately lowers the thermal (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Easypoxy®product range of adhesives for industrial applications are versatile epoxy systems that can bond a wide variety of materials. Epoxylite® Hi-Temp adhesives and potting materials have been used in the aerospace industry since the (read more)
Browse Epoxy Adhesives Datasheets for ELANTAS North America LLC -
DLI brand power dividers incorporate low-loss, high-permittivity ceramics, providing miniaturized dimensions and temperature-stable RF performance. The integrated thin film resistors improve phase and amplitude balance over broadband devices. There are two styles: Wilkinson and (read more)
Browse RF Power Dividers and RF Power Combiners Datasheets for Knowles Precision Devices -
applies a thin compatible film to both ends of a joint or seam. The seal is then treated with a conventional heat source and pressure to make the joint. Normally hot film splicing is done with 90° end cuts, but this method can also handle 45° miter cuts. While this method (read more)
Browse Edge Trims and Trim Seals Datasheets for Device Technologies, Inc. -
-4700 boards and a high temperature ambient-cure epoxy adhesive are stacked together to form a bonded block of foam. The bonded blocks are vacuum bagged to ensure thin bond lines, then it is cured, and prepared for machining. 2.Machining A rough cut of the tool is made (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
engineers. The ELANTAS product portfolio includes Thin film conformal coatings (acrylic, alkyd, urethane, silicone) Thick film coatings (VOC-free; urethane, epoxy, silicone) Potting and encapsulation (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC -
to determine the optimum protection technology for today’s electronic design engineers. The ELANTAS product portfolio includes Thin film conformal coatings (acrylic, alkyd, urethane, silicone) Thick film (read more)
Browse Conformal Coatings Datasheets for ELANTAS North America LLC -
light energy. Quantaflex is a Screen Printed, Polymer Thick Film, Flexible, Electroluminescent Lamp. Quantaflex also refers to the Proprietary System of Materials, Chemical Formulations and Manufacturing Processes used to manufacture our E.L. Lamps. Thin and flexible light (read more)
Browse Electroluminescent Lighting Datasheets for Quantaflex Printed Electronics Inc.
Conduct Research Top
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High-tech Adhesives for Thin-film Solar Cells
Deepmaterial presents adhesives for solar cells for the first time. The light-curing products based on epoxy resins or acrylates are particularly well suited for bonding the protective films of thin-film solar cells, while at the same time forming an effective barrier against humidity. Thin-film
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Evaluation of chromic acid anodized aluminum foil coated composite tubes for the Space Station truss structure
Results showed that 0.003-in CAA Al foil cocured or secondary bonded to graphite/epoxy tubes with thin epoxy film adhesive retains excellent bond strength and provides a superior protective and thermal control coating to the LEO environment.
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200-mm wafer-scale transfer of 0.18-/spl mu/m dual-damascene Cu/SiO/sub 2/ interconnection system to plastic substrates
(b) Wafer adhesive bonding to a FR-4 substrate via a thin epoxy adhesive film .
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Adhesive joint computations using cohesive zones
…results to be comparable the same critical fracture energy Gc = 0.125 N/mm and peak stress tmax = 10 N/mm2 have been taken as mate- rial parameters for the interface, which are representative of a thin epoxy adhesive film ( 0.2 mm thick…
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Improvement in the adhesion of polyimide/epoxy joints using various curing agents
An improvement in the interfacial adhesion of poly- imide (PI) thin films with epoxy adhesive layers is required for the fabrication of compact and light- weight electronic components, such as three-dimen- sional circuits and flexible printed circuits.
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Patterning of aluminum thin films by 157nm F2 laser
A stud pin 2.7 mm in diameter was bonded to the surface of Al thin films with epoxy adhesive .
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Moiré interferometry: Advances and applications
a thin film of epoxy adhesive is cast on the specimen surface, using a crossed- line grating as a mold to imprint its furrows in the epoxy; the mold is separated at the elevated temperature, leaving the workpiece with a uniform (undeformed…
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The composite damping capacity of sandwich cantilever beams
or fiberglass), bonded be- tween two thin sheet plates of high-stiffness mate- rial by means of a thin film of epoxy adhesive .
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Effects of humidity and temperature cycling on 3-D packaging
Similar effects might be expected for thin - film epoxy adhesives .
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A high performance triboelectric generator for harvesting low frequency ambient vibration energy
The FCCL is composed of a 25 μm thick flexible polyimide substrate and one or two 18 μm thick copper films with epoxy adhesive thin layers in between.
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Improved method to evaluate the adhesion properties of thin film conformal coatings
As shown in Fig. 3, thin - film / epoxy adhesive failure is light/dark blue, thin-film cohesive failure is dark grey and SiO2/ thin-film adhesive failure is bright white.