Wafer Ink

Description: Aperture Wafers are precision controlled orifices where the ID Length is controlled very tightly. Typical Applications: Hematology Instrumentation, Ink Jet Printing, Flow Control.

• Applications and Industry: Flow Measurement, Ink Jet Printing, Other
• Material: Sapphire
• Media Type: Pneumatic Air, Hydraulic Fluids, Ink, Chemical, Other Gas, Other
• Orifice Diameter: 0.0016 to 0.0395 inch

Description: (Known as HYSOL ECCOCOAT CT5030 Catalyst B97 conductive ink ) LOCTITE CT 5030 E&C is a conductive ink designed to provide thin coating used in shielding and grounding applications. It is electrically conductive, resistant to abrasion, crease resistant and heat resistant. It is also

Description: RF-HDT-AJLE Tag-it(TM) HF-I Standard Transponder Chip (Wafer, bumped, inked, grind, sawn on tape)

• Operating Frequency: 13.56 MHz
• T_J: -25 to 70 C
• Technology: Wi-Fi / WiMAX / Wi-Mesh

Description: RF-HDT-AJLS Tag-it(TM) HF-I Pro Transponder Chip (Wafer, bumped, inked, grind, sawn on tape)

• Operating Frequency: 13.56 MHz
• T_J: -25 to 70 C
• Technology: Wi-Fi / WiMAX / Wi-Mesh

Description: LOCTITE CT 5030 E&C, Epoxy, Conductive Ink LOCTITE CT 5030 E&C is a conductive ink designed to provide thin coating used in shielding and grounding applications. It is electrically conductive, resistant to abrasion, crease resistant and heat resistant. It is also used

• Form: Transfer Tape
• Industry: OEM / Industrial
• Substrate / Surface: Metal

Description: WAFER UNSAWN, 304U, WITH INKING

• IC Package Type: Other

Description: WAFER UNSAWN, 725U, WITH INKING

• IC Package Type: Other

Description: WAFER UNSAWN, 725U, WITH INKING

• Device Type / Applications: Storage Interface
• IC Package Type: Other
• RoHS Compliant: Yes
• T_J: -40 to 85 C

Description: WAFER UNSAWN, 304U, WITH INKING

• Device Type / Applications: Storage Interface
• IC Package Type: Other
• RoHS Compliant: Yes
• T_J: -40 to 85 C

Description: Sapphire Nozzles are used where a longer Inner Diameter to Length ratio is desired. Using sapphire nozzles will provide longer life than using metal and we can hold tighter tolerances due to sapphires acceptance of higher surface finish. Typical Sapphire Nozzle Applications: Gas & Air Flow,

• Application: Cleaning / Blowoff, Cutting / Machining, Other
• Media: Air / Gases, Coatings / Inks, Water
• Nozzle Form: In-line
• Nozzle Material: Other

Description: Videojet inks and fluids are designed, tested and manufactured together, to function together at optimum performance levels, no matter what your application or production environment.

• Features & Industry: Heat Resistant / High Temperature
• Industry: Electronics, Food and Beverage, Medical / Healthcare, Military Specification, OEM / Industrial, Semiconductor / Wafer
• Type: Ink, Marking Material

Description: Sapphire & Ruby Nozzles are used where a longer Inner Diameter to Length ratio is desired. Sapphire nozzles & Ruby offer longer life than using metal and we can hold tighter tolerances due to sapphires & Ruby acceptance of higher surface finish. Typical Applications: Gas & Air Flow, Wafer Jet

• Application: Cleaning / Blowoff, Cutting / Machining
• Media: Air / Gases, Coatings / Inks, Other
• Nozzle Material: Other

Description: the needs of your particular application, or a custom-engineered product can be made, if required. Applications Media filler: Video tapes, audio tapes, data storage devices, ink jet media Polishing abrasive Thermal management additive Frictional additive Wear resistance additive Metal matrix

• Abrasive Grain Type: Aluminum Oxide
• Form: Powder
• Grading / Grit System: Micron Graded
• Products / Materials Finished: Semiconductors / Electronics (Wafers)

Description: particular application, or a custom-engineered product can be made if required. Applications: Media Filler: Video and audio tapes, data storage devices, ink jet media Polishing abrasive Thermal management additive Wear resistance additive Metal matrix Structural ceramics

• Abrasive Grain Type: Aluminum Oxide
• Form: Powder
• Grading / Grit System: Micron Graded
• Products / Materials Finished: Semiconductors / Electronics (Wafers)

Description: Print Head Substrates Ink Manifolds Ceramic Bushings Read-Write Head Manufacturing Tooling Coil Insulator Housings

• Applications: Electrical / HV Parts, Electronics / RF-Microwave
• Material Type: Alumina / Aluminum Oxide
• Shape / Form: Fabricated / Custom Shape, Wafer / Substrate

Description: potential material in biological and electronic applications and quantum engineering. Source: Synthesis Storage: Store at room temperature. Application: For PET products, inks, rubbers, glues, paints, For wafers & PCB cleaning agents Purity: >99% Concentration: 0.07 CAS Number:

Description: AGC Dragontrail®, SCHOTT AS 87 Customer Furnished Materials & Wafers Our ITO, IMITO, and IMO heater solutions are perfect for outdoor security surveillance, traffic monitoring, aircraft flap monitoring, digital CMOS imaging applications, avionics cockpit displays

• Fuel / Energy Source: Electric