Wafer Ink

Description: RF-HDT-AJLS Tag-it(TM) HF-I Pro Transponder Chip (Wafer, bumped, inked, grind, sawn on tape)

• Operating Frequency: 13.56 MHz
• T_J: -25 to 70 C
• Technology: Wi-Fi / WiMAX / Wi-Mesh

Description: RF-HDT-AJLE Tag-it(TM) HF-I Standard Transponder Chip (Wafer, bumped, inked, grind, sawn on tape)

• Operating Frequency: 13.56 MHz
• T_J: -25 to 70 C
• Technology: Wi-Fi / WiMAX / Wi-Mesh

Description: Aperture Wafers are precision controlled orifices where the ID Length is controlled very tightly. Typical Applications: Hematology Instrumentation, Ink Jet Printing, Flow Control.

• Orifice Diameter: 0.0016 to 0.0395 inch
• Media: Chemical, Hydraulic Fluids, Ink, Other Gas, Pneumatic Air
• Applications: Flow Measurement, Ink Jet Printing
• Features: Other

Description: LOCTITE CT 5030 E&C, Epoxy, Conductive Ink LOCTITE CT 5030 E&C is a conductive ink designed to provide thin coating used in shielding and grounding applications. It is electrically conductive, resistant to abrasion, crease resistant and heat resistant. It is also used in creating

• Substrate: Metal
• Industry: OEM / Industrial
• Form: Transfer Tape

Description: (Known as HYSOL ECCOCOAT CT5030 Catalyst B97 conductive ink ) LOCTITE CT 5030 E&C is a conductive ink designed to provide thin coating used in shielding and grounding applications. It is electrically conductive, resistant to abrasion, crease resistant and heat resistant. It is also

Description: WAFER UNSAWN, 725U, WITH INKING

• T_J: -40 to 85 C
• Features: Other, RoHS Compliant
• Device Type: Storage Interface

Description: WAFER UNSAWN, 725U, WITH INKING

• Features: Other
• Device Type: Sensor Interface

Description: Sapphire & Ruby Nozzles are used where a longer Inner Diameter to Length ratio is desired. Sapphire nozzles & Ruby offer longer life than using metal and we can hold tighter tolerances due to sapphires & Ruby acceptance of higher surface finish. Typical Applications: Gas & Air Flow, Wafer Jet

• Media: Air / Gases, Coatings / Inks
• Application: Cleaning / Blowoff, Cutting / Machining
• Features: Other

Description: Sapphire Nozzles are used where a longer Inner Diameter to Length ratio is desired. Using sapphire nozzles will provide longer life than using metal and we can hold tighter tolerances due to sapphires acceptance of higher surface finish. Typical Sapphire Nozzle Applications: Gas & Air Flow,

• Orifice Size: 9.5 to 30 mil
• Media: Air / Gases, Coatings / Inks, Water
• Application: Cleaning / Blowoff, Cutting / Machining
• Form: In-line

Description: Videojet inks and fluids are designed, tested and manufactured together, to function together at optimum performance levels, no matter what your application or production environment.

• Industry: Electronics, Food and Beverage, Medical / Healthcare, Military Specification, OEM / Industrial, Semiconductor / Wafer
• Features: Heat Resistant / High Temperature
• Type: Ink, Marking Material

Description: of your particular application, or a custom-engineered product can be made, if required. Applications Media filler: Video tapes, audio tapes, data storage devices, ink jet media Polishing abrasive Thermal management additive Frictional additive Wear resistance additive Metal matrix Structural

• Compound / Abrasive Type: Aluminum Oxide
• Grading System: Micron Graded
• Type: Polishing
• Form: Powder

Description: application, or a custom-engineered product can be made if required. Applications: Media Filler: Video and audio tapes, data storage devices, ink jet media Polishing abrasive Thermal management additive Wear resistance additive Metal matrix Structural ceramics

• Compound / Abrasive Type: Aluminum Oxide
• Grading System: Micron Graded
• Type: Polishing
• Form: Powder

Description: Ink Manifolds Ceramic Bushings Read-Write Head Manufacturing Tooling Coil Insulator Housings

• Material Type: Alumina / Aluminum Oxide
• Applications: Electrical / HV Parts, Electronics / RF-Microwave
• Shape / Form: Fabricated / Custom Shape, Wafer / Substrate

Description: material in biological and electronic applications and quantum engineering. Source: Synthesis Storage: Store at room temperature. Application: For PET products, inks, rubbers, glues, paints, For wafers & PCB cleaning agents Purity: >99% Concentration: 0.07 CAS Number: 7782-40-3 Size:

Description: Substrate Materials SCHOTT BOROFLOAT® 33 – Low CTE, High T% SCHOTT D 263® T eco Ultra-Thin Low Iron Soda Lime – Economical Float Material Low & Non-Alkaline, Corning® Eagle XG® Corning® Gorilla®, AGC Dragontrail®, SCHOTT AS 87 Customer Furnished Materials & Wafers Our ITO, IMITO, and IMO

• Features: Electric, Other