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Supplier: Bell & Gossett, a xylem brand
Description: The Circuit Sensor Flow Meter is a precision machined wafer-type orifice insert that is installed between standard 125, 150, 250 or 300 psi ANSI flanges, to monitor system flow with a minimum friction head loss. System flow is determined by obtaining a differential pressure across the
- End Fittings: Flanged, Other
- Operating Temperature: 250 F
- Pipe Diameter: 2.5 to 12 inch
- Type: Differential Pressure Meter, Orifice Plate
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Supplier: ASTM International
Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 These practices describe the use of wafers with special electrical and physical characteristics for controlling and monitoring performance of non-contact dielectric characterization systems (NCDCS) that employ corona
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Supplier: HORIBA Instruments, Inc.
Description: of the CS-131, only two-thirds* of previous models allow for easy integration into your wafer cleaning system. *Compared to the CS-220 series. Fewer lot defects in the cleaning process means a higher yield Outputs from the monitor are used for replenishment control of the SC-1
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Supplier: Win Source Electronics
Description: 14443, ISO 15693, ISO 18092, MIFARE, NFC Voltage - Supply: 2.4V ~ 5.5V Package / Case: Die Supplier Device Package: Wafer Temperature Range - Operating: -40°C ~ 125°C (TJ) Fake Threat In the Open Market: 65 pct. REACH Status: REACH Unaffected HTSUS: 0000.00.0000 Mfr: STMicroelectronics
- Operating Temperature: -40 to 125 C
- Output Options: Inverting
- Supply Voltage (Vi): 2.4 to 5.5 volts
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Supplier: Win Source Electronics
Description: -3 Package / Case: Die Supplier Device Package: Wafer Temperature Range - Operating: -40°C ~ 85°C ECCN: EAR99 Fake Threat In the Open Market: 50 pct. MSL Level: 1 (Unlimited) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Texas Instruments Base Product Number: RF-HDT Product
- Operating Temperature: -40 to 85 C
- Output Options: Inverting
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Supplier: Win Source Electronics
Description: , ISO 18000-3 Voltage - Supply: 1.5V ~ 1.7V Package / Case: Die Supplier Device Package: Wafer Temperature Range - Operating: -40°C ~ 85°C Fake Threat In the Open Market: 70 pct. MSL Level: 1 (Unlimited) REACH Status: REACH Unaffected Mfr: NXP USA Inc. Other Names: 935300299115,568-SL2
- Operating Temperature: -40 to 85 C
- Output Options: Inverting
- Supply Voltage (Vi): 1.5 to 1.7 volts
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Supplier: ASTM International
Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This test method covers the measurement of carrier lifetime appropriate to carrier recombination processes in homogeneously doped, polished, - or -type silicon wafers with room-temperature resistivity greater than about
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Supplier: Win Source Electronics
Description: Manufacturer: Microchip Technology Win Source Part Number: 862235-ATA5575M1330- DDB Series: ATA5577 Operating Temperature Range: -40°C ~ 85°C (TA) Features: RFID Transponder IC 100kHz ~ 150kHz - - - Die Package: Die Package: Box Mounting: Surface Mount
- Operating Temperature: -40 to 85 C
- Output Options: Inverting
- Package Type: Other
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Description: The m924 (4channel) and m922 (2channel) Semiconductor OEM modules are the newest Luxtron products for Etcher and Wafer Fab equipment temperature monitoring of Electrostatic Chucks, Chambers and other devices. The m920 Series modules are high performance solutions that are
- Device Category: Sensor / Transducer
- Electrical Outputs: Current, Serial
- Operating Temperature: 32 to 140 F
- Technology: Optical Pyrometer
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Supplier: HORIBA Instruments, Inc.
Description: The HF-960M uses sensors that offer outstanding corrosion resistance for high-precision, high-speed measurement of low concentrations of hydrofluoric acid, hydrochloric acid and ammonia, and is thus perfect for single-bath and wafer cleaning. The HF-960M is also an environmentally
- Analog Input Type: DC Voltage
- Depth: 115 mm
- Display Technology: LED
- Display Type: Combination
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Supplier: Conax Technologies
Description: Ion Implantation is a critical step in the manufacture of semiconductors. High energy implantation can heat the wafer and cause problems that lead to yield reduction. Monitoring the temperature of wafers during implantation is required to determine the amount of
- Basic Element Used: Thermocouple
- Plug or Quick Connect: Yes
- Probe Configuration: Straight Probe
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Supplier: Technic, Inc.
Description: , servomotor driven hoist / cassette transfer mechanism, travel limit sensors, heaters, temperature controllers, low level safety devices, process pumps, filter housing, wafer cassette agitation mechanisms, wafer carrier racks, and quick dump rinse cell assemblies, and cassette
- Application / Industry: Semiconductor / Wafer, Solar / Photovoltaic
- Equipment / System Type: Automated System
- Process / Technology: Electroplating
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Supplier: Conax Technologies
Description: Conax offers a Single-Point calibration thermocouple designed for use on Applied Materials/Moore Technologies 76XX, 77XX and 78XX Series Epitaxial Barrel Reactors. The Single-Point sensor allows for the calibration of the 3 infrared (IR) sensors used to monitor susceptor temperature
- Basic Element Used: Thermocouple
- Probe Configuration: Straight Probe
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Supplier: Conax Technologies
Description: . The Triple-point sensor allows for the calibration of the 3 infrared (IR) sensors used to monitor susceptor temperature during wafer processing. Because the sensor has 3 measurement junctions, all 3 IR sensors may be calibrated at one time. This saves time and increases
- Basic Element Used: Thermocouple
- Plug or Quick Connect: Yes
- Probe Configuration: Straight Probe
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Supplier: Microchip Technology, Inc.
Description: power saving one-shot mode that allows the device to make a temperature measurement and update the temperature register and then return to shutdown mode. The AT30TS74 is based on the industry standard "LM75-type" compatible temperature sensor and is a precision
- Package Type / Mounting: Other
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Supplier: Vaisala
Description: to install in the bulk chemicals dispense, and in point of use chemical blending, spiking and monitoring applications. With Vaisala K-PATENTS® PR-23-MS you can: Prevent wrong chemicals from entering the fabrication process. Optimize etch process and increase the
- Features: Alarms, Automatic Temperature Compensation, Measures Temperature
- Measurement Scale: RI Detector
- Monitoring: Continuous
- Mounting: Permanent or Fixtured
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Supplier: Kionix, Inc.
Description: protected from the environment by ahermetically-sealed silicon cap at the wafer level. TheKXTE9™s advanced, orientation-detectio n feature reports changes inlandscape, portrait, face-up, and face-down conditions. Thissophisticated, embedded algorithm eliminates the need for
- Acceleration: 2 to 8 g
- Device Type: Sensor / Transducer
- Features: Sealed, Self Test / Diagnostics / Self Calibrating
- Frequency Range: 25 to 800 Hz
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Supplier: E-Labs, Inc.
Description: feet of test floor space with climatic, dynamic and pressure testing capabilities. E-Labs maintains state-of-the art equipment for data acquisition, with over 240 channels of instrumentation for temperature, accelerometer, high-speed video/camera, and strain gauging, pressure and force
- Capabilities: Cleanliness Monitoring / Testing, Environmental Exposure Testing, Environmental Testing and Analysis Services, Failure Analysis, Report Preparation, Sample Retention, Standards Testing / Certification, Other
- Industry Applications: Aerospace / Aviation, Automotive, Chemical / Material Processing, Marine, Military, Nuclear / Utility, Pharmaceutical / Biotech, Packaging, Piping / Pressure Vessel, Semiconductors / Electronics, Structural / Construction
- Materials: Adhesives / Sealants, Ceramics / Glass, Chemicals, Coatings, Composites, Fuel Cell / Battery Materials, Gases, Metals, Petroleum Fluids (Oil, Fuel, Distillates), Plastic / Rubber, Textiles, Wafers / Surfaces, Welds / Joints
- Regional Preference: North America, United States Only, Northeast US Only, Southern US Only, Southwest US Only, Northwest US Only, Midwest US Only, Canada Only
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Supplier: Broadcom Inc.
Description: with a specific lens cap. The laser design is buried hetero structure with multi-quantum well (MQW) active layers and distributed-feedback (DFB) grating layer. All laser chips come from wafers that have been certified using a representative lot of devices that must achieve an acceptable yield
- Laser Type: Laser Diodes
- Wavelength Range: 1270 to 1450 nm
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Supplier: Lake Shore Cryotronics, Inc.
Description: a Lake Shore product. Using a self-contained closed cycle refrigerator (CCR), the station cools down to cryogenic temperatures unassisted, eliminating the need for monitoring by the researcher. Various options and configurations on the CRX-4K enable the researcher to conduct exacting
- NDT Probe Technology: Magnetic / Hall Effect
- Special Features: Array
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Supplier: Lake Shore Cryotronics, Inc.
Description: electro-optical probing, plus out-of-plane vertical field superconducting magnetic measurements. Researchers can use the CRX-VF for performing Hall effect measurements and testing magneto-transport parameters. It is designed to enable true 90° wafer probing on wafers up to 51 mm (2 in)
- NDT Probe Technology: Magnetic / Hall Effect
- Special Features: Array
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Supplier: Broadcom Inc.
Description: uncooled applications with data rates up to 10.7 Gb/s. The laser is mounted into a TO header and hermetically sealed with a specific lens cap. The laser design is a buried heterostructure with multi-quantum well (MQW) active layers and DFB grating layer. All laser chips come from wafers that
- Laser Type: Laser Diodes
- Operating Temperature Range: -40 to 85 C
- Wavelength Range: 1470 to 1610 nm
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Supplier: JEOL USA, Inc.
Description: available for saving and recalling process conditions tailored to specific applications or specimen types. Connect to LAN for remote access and control through a web browser. Monitor and adjust the milling process over multiple CPs. High throughput ion source High throughput ion
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Supplier: ROHM Semiconductor USA, LLC
Description: technology. Acceleration sensing is based on the principle of a differential capacitance arising from acceleration-induced motion of the sense element, which further utilizes common mode cancellation to decrease errors from process variation, temperature, and environmental stress. The sense
- Number of Axes: Triaxial
- Operating Temperature: -40 to 185 F
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Supplier: ROHM Semiconductor USA, LLC
Description: technology. Acceleration sensing is based on the principle of a differential capacitance arising from acceleration-induced motion of the sense element, which further utilizes common mode cancellation to decrease errors from process variation, temperature, and environmental stress. The sense
- Number of Axes: Triaxial
- Operating Temperature: -40 to 185 F
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Supplier: ROHM Semiconductor USA, LLC
Description: technology. Acceleration sensing is based on the principle of a differential capacitance arising from acceleration-induced motion of the sense element, which further utilizes common mode cancellation to decrease errors from process variation, temperature, and environmental stress. The sense
- Number of Axes: Triaxial
- Operating Temperature: -40 to 185 F
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Supplier: ROHM Semiconductor USA, LLC
Description: technology. Acceleration sensing is based on the principle of a differential capacitance arising from acceleration-induced motion of the sense element, which further utilizes common mode cancellation to decrease errors from process variation, temperature, and environmental stress. The sense
- Number of Axes: Triaxial
- Operating Temperature: -40 to 185 F
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Supplier: PI (Physik Instrumente) L.P.
Description: combined with profile generator and position feedforward control. Wave generator. Data recorder. Autozero. Trigger I/O. Supports all current ID chips from PI. Compact design with functional blocks for an easy derivation of OEM versions. Safety and monitoring functionalities
- Frequency Range: 20 kHz
- Input Voltage: -10 to 10 volts
- Voltage Range: 24 volts
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Supplier: Lake Shore Cryotronics, Inc.
Description: convenience of cryogen-free operation and the dependable measurement performance of a Lake Shore product. Using a self-contained closed cycle refrigerator (CCR), the station cools down to cryogenic temperatures unassisted, eliminating the need for monitoring by the researcher. Its
- NDT Probe Technology: Magnetic / Hall Effect
- Special Features: Array
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Supplier: Lake Shore Cryotronics, Inc.
Description: temperatures unassisted, eliminating the need for monitoring by the researcher. A 360° sample stage rotation option allows measurement of angular-dependent and anisotropic magneto-transport properties.
- NDT Probe Technology: Magnetic / Hall Effect
- Special Features: Array
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Supplier: Hach
Description: , graphed sensor trends, alarm limits, temperature and event occurrence. Up to 3 sensors input for a reduced cost of installation and ownership High level of accuracy and rapid response time means reliable and effective process monitoring Thermal cut-off sensor protection for
- Control Signal Output: Current Loop, Switch / Relay Output, Serial / Digital, Network / Fieldbus Output
- Control Technique: Linear Control
- Controller Inputs: Serial / Digital Input
- Form Factor: Panel / Chassis Mount, Other
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Description: Description Specifications Body Size: 1/2"(DN15)~12"(DN300 ) Fusing Temperature: 165°F(74°C), 212°F(100°C) Material: Carbon Steel, Stainless Steel, Lining Fluorine Body Type: Ball Valve, Butterfly Valve Connection Type
- Connection: Bolt Flange
- Material of Construction: Stainless Steel, Steel
- Media Description: Other
- Valve Size: 2 to 12 inch
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Description: Description Specifications Body Size: 1/2"(DN15)~12"(DN300 ) Fusing Temperature: 165°F(74°C), 212°F(100°C) Material: Carbon Steel, Stainless Steel, Lining Fluorine Body Type: Ball Valve, Butterfly Valve Connection Type
- Connection: Bolt Flange
- Material of Construction: Stainless Steel, Steel
- Media Description: Other
- Valve Size: 2 to 12 inch
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Description: Description Specifications Body Size: 1/2"(DN15)~12"(DN300 ) Fusing Temperature: 165°F(74°C), 212°F(100°C) Material: Carbon Steel, Stainless Steel, Lining Fluorine Body Type: Ball Valve, Butterfly Valve Connection Type
- Media: Other
- Primary Material of Construction: Stainless Steel, Steel
- Valve Size: 2 to 12 inch
- Valve Type: Ball Valves, Directional Valves, Shut Off Valves
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Description: Description Specifications Body Size: 1/2"(DN15)~12"(DN300 ) Fusing Temperature: 165°F(74°C), 212°F(100°C) Material: Carbon Steel, Stainless Steel, Lining Fluorine Body Type: Ball Valve, Butterfly Valve Connection Type
- Media: Other
- Primary Material of Construction: Stainless Steel, Steel
- Valve Size: 2 to 12 inch
- Valve Type: Directional Valves, Safety Valves, Shut Off Valves
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Supplier: Brooks Instrument
Description: measurement without stopping the flow of process gas. It allows semiconductor manufacturers to verify process gas accuracy, check valve leak-by and monitor sensor stability in real time without removing the flow controller from the gas line. Combined with an all-metal wetted flow path, ultra
- Accuracy: 1 ±% FS
- Control Signal Output: Analog Voltage, Serial / Digital, Network / Fieldbus Output
- Media: Gas / Air
- Number of Control Outputs: 1 outputs
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Supplier: ATV Technologie GmbH
Description: paste FORMIC ACID ENRICHED ATMOSPHERE Direct IR Heating Multiple TC monitoring Process temperature 450°C up to 700°C Temperature ramp-up rate 3,5K/sec. Temperature cool-down rate 2K/sec. Rapid single wafer processing < 20°C/sec.
- Configuration: Bench / Cabinet
- Temperature Range: 450 to 700 F
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Supplier: Technetics Group
Description: drains, engine kiss seals Oil & Gas: actuators, connectors, couplings, feed throughs, gas lines, reservoirs, sensors Semiconductor: actuators, beamlines, connectors, feed-throughs, leak detectors, sensors, wafer handlers Medical: batteries, cardiovascular devices, implants, drug delivery,
- Applications: Aerospace, Semiconductor, Other
- Bellows Construction: Welded
- Features: Cryogenic Rated, Flange, Medically Rated, Vacuum Rated
- Materials: Hastelloy®, Inconel®, Monel®, Stainless Steel, Steel, Titanium, Other
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Supplier: Skyworks Solutions, Inc.
Description: Please note: this product is being discontinued and is not recommended for new designs. The SKY81452 is a highly integrated, high efficiency LED backlight solution for tablets, notebook computers, monitors, and other portable devices. An integrated boost converter provides a high voltage
- Efficiency: 93 %
- Form Factor: Integrated Circuit (IC)
- Input Voltage: 2.5 to 5.5 volts
- Number of Channels: 6 #
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Supplier: Armstrong International
Description: design time. The CCA with TVS 4000 Series and the Inverted Bucket Traps is guaranteed for three years. Cost savings This preassembled concept offers tremendous savings by reducing multiple component purchases that cause additional purchase-order monitoring and shipping costs. Other savings
- Application: Steam
- Body Material: Steel
- Integral Valve Type: Manual
- Manifold Circuit Style: Parallel
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Supplier: Armstrong International
Description: design time. The CCA with TVS 4000 Series and the Inverted Bucket Traps is guaranteed for three years. Cost savings This preassembled concept offers tremendous savings by reducing multiple component purchases that cause additional purchase-order monitoring and shipping costs. Other savings
- Application: Steam
- Body Material: Steel
- Integral Valve Type: Manual
- Manifold Circuit Style: Parallel
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passing through. A change toward a dry condition or a liquid of a different dielectric will upset the capacitive field and initiate an alarm. The sensing plates are embedded into a wafer flange which provides monitoring without any intrusion into the stream flow (read more)
Browse Process Monitors Datasheets for Arjay Engineering -
, which are brought to a uniform thickness. The white light interferometers of the interferoMETER IMS5420 series were developed to continuously monitor the thickness. These consist of a compact sensor and a controller, which is housed in a robust industrial housing. An active temperature control (read more)
Browse Interferometers Datasheets for Micro-Epsilon Group -
flake from the quartz substrate, which can cause particle contamination to the wafer. Durability – The coating does not decompose, out-gas, or sublimate under vacuum at high temperature. Slower devitrification – The coating greatly (read more)
Browse Thermocouple Temperature Probes Datasheets for Conax Technologies -
not flake from the quartz substrate, which could cause particle contamination to the wafer. Durability – The coating does not decompose, out-gas or sublimate under vacuum at high temperature. Slower devitrification – The coating greatly (read more)
Browse Thermocouple Temperature Probes Datasheets for Conax Technologies -
The Fire-Safe Fusible Link Valve FSV-F Series automatically shuts off flow in case of fire or excessive temperatures. Ideal for facilities handling flammable liquids or gases, it offers reliable safety protection (read more)
Browse Industrial Valves Datasheets for Shanghai Thinktank Process Management Co., Ltd -
-current wafer processing systems, precision sensor feedthroughs, or fiber optic monitoring in load locks, our assemblies are built for reliability in the most demanding semiconductor environments. (read more)
Browse Feedthroughs Datasheets for Douglas Electrical Components -
escalation of hazardous situations. Key Features: Automatic Operation in Fires: Equipped with fusible links that melt at predetermined temperatures (165°F / 74°C, 212°F / 100°C, and other options), causing the valve to shut off flow (read more)
Browse Industrial Valves Datasheets for Shanghai Thinktank Process Management Co., Ltd
Conduct Research Top
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MSilica Nanoparticles Treated by Cold Atmospheric-Pressure Plasmas Improve the Dielectric Performance of Organic-Inorganic Nanocomposites
Fabrication. Experimental devices were fabricated using standard soft. lithography techniques [45]. First, AZ 9260 (AZ Electronic. Materials, Somerville, NJ, USA) photoresist was spun onto a. clean /100S silicon substrate. The wafer was exposed to UV. light for 60 s through a mask patterned
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In-situ Si wafer temperature measuring using pulse-modulated infrared laser interferometric thermometry for CVD film deposition
and thermal conductivity between a wafer and a stage are important to suppress wafer temperature rise, and direct wafer temperature monitor is neces- sary for precise wafer temperature control.
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KLA-Tencor Introduces Additions To SensArray™ Portfolio Of Semiconductor In-Situ Process Monitoring Solutions
Complementary to the industry-leading EtchTemp product, ET-SE delivers temperature wafer monitoring during silicon etch processes, providing temperature measurements with a higher signal-to-noise ratio than alternative methods.
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Characterization of various Ti-Al film alloys as wafer temperature metrology systems
After thermal cycling at process temperature, the change in Ti/Al film stack sheet resistance is directly proportional to heater seipoint temperature, thus providing a wafer temperature monitor .
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Temperature oscillations in a silicon wafer under constant power of incoherent irradiation by heating lamps in a thermal chamber of RTP set up
As has been seen from fig. 3, for the total radiation the wafer temperature monitored by thermocouple oscillates in the .
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Noncontact temperature monitoring of semiconductors by optical absorption edge sensing
The absence of a reliable, repeatable noncontact wafer temperature monitor from ambient temperature upwards has meant that in most cases etch, PVD and C\'D process engineers have developed their processes without precise knowledge of wafer temperature.
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In-situ process monitoring in metal deposition processes
4-2-2 Wafer temperature monitoring in the lamp heating environment .
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GaN-based LEDs grown on 6-inch diameter Si (111) substrates by MOVPE
Despite this, with careful control over the growth process, and with the aid of in-situ curvature and whole- wafer temperature monitoring , it is possible to realise GaN-based LED structures on 6-inch Si (111) substrates with good performance.
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Rapid Thermal Processing Strategies for Highly Uniform and Repeatable Process Results on Patterned Wafers
By moving away from heating using non-uniform heat sources, like lamp based radiation heating, with inaccurate wafer temperature monitor /control, a significant portion of the extrinsic source of variations can be reduced or eliminated.
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New sensing wafer technique for artifact-free transient temperature measurements in PEB processes
A wafer temperature monitoring system capable of measuring dynamic and steady state PEB temperatures with high accuracy and precision has been demonstrated.
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Silicon integrated microsensors
These arrays can be used in wafer temperature monitoring , in thermal imaging, and in infrared spectroscopy for process monitoring.