Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: ASTM International
Description: oxidized wafers are not sufficient for this purpose because of parametric drift due to temperature-bias stressing and exposure to the atmosphere. Three methods are described to cover various experimental arrangements (see for a discussion on the two different types of corona). 1.1.1
-
Supplier: Bell & Gossett, a xylem brand
Description: The Circuit Sensor Flow Meter is a precision machined wafer-type orifice insert that is installed between standard 125, 150, 250 or 300 psi ANSI flanges, to monitor system flow with a minimum friction head loss. System flow is determined by obtaining a differential pressure across the
- Pipe Diameter: 2.5 to 12 inch
- Operating Temperature: 250 F
- Features: Differential Pressure Meter, Liquid, Other
- End Fittings: Flanged
-
Supplier: HORIBA Instruments, Inc.
Description: The CS-153 is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use FPM solution to etch silicon oxide and remove particles from the wafer surface. The CS-153 continually
- Process Media Temperature: 68 to 176 F
- Operating Temperature: 68 to 77 F
- Electrical Output: Analog Current Output, Switch / Alarm Relay Output
- Display Type: Digital Display
-
-
Supplier: HORIBA Instruments, Inc.
Description: The CS-153N is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use HF/HNO3 solution to etch silicon oxide and remove particles from the wafer surface. The CS-153N continually
- Process Media Temperature: 68 to 176 F
- Operating Temperature: 68 to 77 F
- Electrical Output: Analog Current Output, Switch / Alarm Relay Output
- Display Type: Digital Display
-
Supplier: HORIBA Instruments, Inc.
Description: of air bubbles in the flow cell during measurement. If the monitor has an integrated cooling unit, high-temperature samples can be measured directly. Temperature compensation is carried out automatically. Low-voltage 24 V DC is used for the power supply, offering improved safety
-
Supplier: HORIBA Instruments, Inc.
Description: The HF-960M uses sensors that offer outstanding corrosion resistance for high-precision, high-speed measurement of low concentrations of hydrofluoric acid, hydrochloric acid and ammonia, and is thus perfect for single-bath and wafer cleaning. The HF-960M is also an environmentally-friendly
- Number of Digits: 4
- Width: 96 mm
- Height: 96 mm
- Depth: 115 mm
-
Supplier: Win Source Electronics
Description: Wafer Temperature Range - Operating: -40°C ~ 85°C ECCN: EAR99 Fake Threat In the Open Market: 50 pct. MSL Level: 1 (Unlimited) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Texas Instruments Base Product Number: RF-HDT Product Status: Obsolete
- Operating Temperature: -40 to 85 C
- Output Options: Inverting
-
Supplier: Win Source Electronics
Description: Manufacturer: Microchip Technology Win Source Part Number: 862235-ATA5575M1330-DDB Series: ATA5577 Operating Temperature Range: -40°C ~ 85°C (TA) Features: RFID Transponder IC 100kHz ~ 150kHz - - - Die Package: Die Package: Box Mounting: Surface Mount Family Name: ATA5575 Categories: RF/IF
- Operating Temperature: -40 to 85 C
- Output Options: Inverting
- Features: Other
-
Description: The m924 (4channel) and m922 (2channel) Semiconductor OEM modules are the newest Luxtron products for Etcher and Wafer Fab equipment temperature monitoring of Electrostatic Chucks, Chambers and other devices. The m920 Series modules are high performance solutions that are flexible,
- Temperature Range: -49 to 626 F
- Operating Temperature: 32 to 140 F
- Electrical Output: Current, Serial
- Technology: Optical Pyrometer
-
Supplier: Daitron Co., Ltd.
Description: The chip testers pick up laser diode chips on a sheet, measure and evaluate various characteristics, and sort them based on the results. The measurement stages are equipped with the temperature control function to characterize devices in the required temperature ranges. Features ●To
- Mounting / Loading: Floor Mounted / Stand-alone
- Form Factor: Monitor / Instrument
- Applications: Semiconductor Wafers
-
Supplier: Win Source Electronics
Description: Manufacturer: NXP Win Source Part Number: 895329-SL3S1204FUD/BGZ Operating Temperature Range: -40°C ~ 85°C Features: RFID Transponder IC 840MHz ~ 960MHz - - - Die Package: Bulk Package: Die Mounting: Surface Mount Part Status: Obsolete Family Name: SL3S120 Categories: RF/IF and RFID Case /
- Operating Temperature: -40 to 85 C
- Output Options: Inverting
- Features: Other
-
Supplier: Conax Technologies
Description: Ion Implantation is a critical step in the manufacture of semiconductors. High energy implantation can heat the wafer and cause problems that lead to yield reduction. Monitoring the temperature of wafers during implantation is required to determine the amount of wafer
- Probe Features: Available as an Assembly
- Sensor Termination Type: Plug or Quick Connect
- Probe Configuration: Straight Probe
- Features: Thermocouple
-
Supplier: Win Source Electronics
Description: Win Source Part Number: 1355792-ST25TB04K-AC6G6 Category: RF and Wireless - RFID, RF Access, Monitoring ICs Temperature Range - Operating: -40°C ~ 85°C Fake Threat In the Open Market: 34 pct. Type: RFID Transponder MSL Level: 1 (Unlimited) Mfr: STMicroelectronics Series: ST25T Package: Bulk
- Frequency: 13,560,000 Hz
- Operating Temperature: -40 to 85 C
-
Supplier: Microchip Technology, Inc.
Description: that allows the device to make a temperature measurement and update the temperature register and then return to shutdown mode. The AT30TS74 is based on the industry standard "LM75-type" compatible temperature sensor and is a precision temperature monitoring device
- Features: Other
-
Supplier: ASTM International
Description: generation of excess carriers with a light pulse is determined by monitoring the microwave reflectivity of the wafer. Since no contact is made to the specimen, this test method is nondestructive. If wafer cleanness is maintained, wafers may be further processed following testing
-
Supplier: Conax Technologies
Description: Conax offers a Single-Point calibration thermocouple designed for use on Applied Materials/Moore Technologies 76XX, 77XX and 78XX Series Epitaxial Barrel Reactors. The Single-Point sensor allows for the calibration of the 3 infrared (IR) sensors used to monitor susceptor temperature
- Probe Features: Available as an Assembly
- Base, Noble and Refractory Metal Type: K
- Probe Configuration: Straight Probe
- Features: Thermocouple
-
Supplier: Technic, Inc.
Description: mechanism, travel limit sensors, heaters, temperature controllers, low level safety devices, process pumps, filter housing, wafer cassette agitation mechanisms, wafer carrier racks, and quick dump rinse cell assemblies, and cassette drying cell for processing substrates. Safety
- Machinery Type: Automated System
- Process / Technology: Electroplating
- Application / Industry: Semiconductor / Wafer, Solar / Photovoltaic
-
Supplier: Conax Technologies
Description: Triple-point sensor allows for the calibration of the 3 infrared (IR) sensors used to monitor susceptor temperature during wafer processing. Because the sensor has 3 measurement junctions, all 3 IR sensors may be calibrated at one time. This saves time and increases
- Probe Features: Available as an Assembly
- Base, Noble and Refractory Metal Type: C
- Sensor Termination Type: Plug or Quick Connect
- Probe Configuration: Straight Probe
-
Supplier: Lake Shore Cryotronics, Inc.
Description: low-temperature cryogen-free performance, with configurations enabling sample temperatures as low as 4.5 K. Multiple temperature sensors throughout the station ensure accurate, repeated measurements. The 2-stage CCR allows the sample to be maintained at elevated
- Features & Format: Array
- NDT Probe Technology: Magnetic / Hall Effect
-
Supplier: Vaisala
Description: measurement signal works as a check-sum. Patented CORE-optics (US Patent No. US6067151). Dual connectivity: one transmitter can operate two sensors. A second sensor can be easily integrated later. Process temperature range: -20°C – 150°C (-4°F – 300°F) Fast process temperature
- RI Range: 1.26 to 1.53
- Operating Temperature: -20 to 45 C
- Prism / Light Source & Special Features: Alarms, Automatic Temperature Compensation, Measures Temperature
- Monitoring: Continuous
-
Supplier: Broadcom Inc.
Description: specific lens cap. The laser design is buried hetero structure with multi-quantum well (MQW) active layers and distributed-feedback (DFB) grating layer. All laser chips come from wafers that have been certified using a representative lot of devices that must achieve an acceptable yield for
- Wavelength Range: 1,270 to 1,450 nm
- Laser Type: Laser Diodes
-
Supplier: Hach
Description: limits, temperature and event occurrence. Up to 3 sensors input for a reduced cost of installation and ownership High level of accuracy and rapid response time means reliable and effective process monitoring Thermal cut-off sensor protection for CIP/abnormal high temperature conditions
- Number of Inputs: 1 inputs
- Number of Control Outputs: 3 outputs
- Control Signal: Current Loop, Network / Fieldbus Output, Serial / Digital, Switch / Relay Output
- Features: Datalogger
-
Supplier: Broadcom Inc.
Description: applications with data rates up to 10.7 Gb/s. The laser is mounted into a TO header and hermetically sealed with a specific lens cap. The laser design is a buried heterostructure with multi-quantum well (MQW) active layers and DFB grating layer. All laser chips come from wafers that have been
- Wavelength Range: 1,470 to 1,610 nm
- Operating Temperature Range: -40 to 85 C
- Laser Type: Laser Diodes
-
Description: Description Specifications Body Size: 1/2"(DN15)～12"(DN300) Fusing Temperature: 165°F（74°C), 212°F（100°C) Material: Carbon Steel, Stainless Steel, Lining Fluorine Body Type: Ball Valve, Butterfly Valve Connection Type: For Ball Valve( Threaded, Welding, Flanged), Butterfly Valve(Wafer,
- Valve Size: 2 to 12 inch
- Features: Bolt Flange, Other
- Valve Type: Check Valves, Directional Valves, Safety Valves, Shut Off Valves
- Primary Material: Stainless Steel, Steel
-
Supplier: ROHM Semiconductor USA, LLC
Description: hermetically sealed at the wafer level by bonding a second silicon lid wafer to the device using a glass frit. A separate ASIC device packaged with the sense element provides signal conditioning, and intelligent user-programmable application algorithms. The accelerometer is delivered
- Operating Temperature: -40 to 185 F
- Measurement Axes: Triaxial
-
Supplier: ROHM Semiconductor USA, LLC
Description: hermetically sealed at the wafer level by bonding a second silicon lid wafer to the device using a glass frit. A separate ASIC device packaged with the sense element provides signal conditioning, and intelligent user-programmable application algorithms. The accelerometer is delivered
- Operating Temperature: -40 to 185 F
- Measurement Axes: Triaxial
-
Supplier: ROHM Semiconductor USA, LLC
Description: hermetically sealed at the wafer level by bonding a second silicon lid wafer to the device using a glass frit. A separate ASIC device packaged with the sense element provides signal conditioning, and intelligent user-programmable application algorithms. The accelerometer is delivered
- Operating Temperature: -40 to 185 F
- Measurement Axes: Triaxial
-
Supplier: ROHM Semiconductor USA, LLC
Description: hermetically sealed at the wafer level by bonding a second silicon lid wafer to the device using a glass frit. A separate ASIC device packaged with the sense element provides signal conditioning, and intelligent user-programmable application algorithms. The accelerometer is delivered
- Operating Temperature: -40 to 185 F
- Measurement Axes: Triaxial
-
Description: Description Specifications Body Size: 1/2"(DN15)～12"(DN300) Fusing Temperature: 165°F（74°C), 212°F（100°C) Material: Carbon Steel, Stainless Steel, Lining Fluorine Body Type: Ball Valve, Butterfly Valve Connection Type: For Ball Valve( Threaded, Welding, Flanged), Butterfly Valve(Wafer,
- Valve Size: 2 to 12 inch
- Valve Type: Ball Valves, Directional Valves, Shut Off Valves
- Features: Bolt Flange, Other
- Primary Material: Stainless Steel, Steel
-
Description: Description Specifications Body Size: 1/2"(DN15)～12"(DN300) Fusing Temperature: 165°F（74°C), 212°F（100°C) Material: Carbon Steel, Stainless Steel, Lining Fluorine Body Type: Ball Valve, Butterfly Valve Connection Type: For Ball Valve( Threaded, Welding, Flanged), Butterfly Valve(Wafer,
- Valve Size: 2 to 12 inch
- Features: Bolt Flange, Other
- Valve Type: Control Valves, Directional Valves
- Actuation: Electric
-
Supplier: JEOL USA, Inc.
Description: return to normal temperature can be performed automatically. In addition, vacuuming around liquid nitrogen tank is possible from the CP side to maintain cooling retention time and specimen cooling temperature. It is possible to continuously mill for 8 hours at -120°C. Cooling
-
Supplier: PI (Physik Instrumente) L.P.
Description: and recording of values. Software interfaces Extensive software support, e.g., for NI LabVIEW, C, C++, MATLAB, Python. Compatible with µ Manager and MetaMorph. PIMikroMove user software Temperature management High position stability of the sensor electronics thanks to active
- Input Voltage: -10 to 10 volts
- Voltage Range: 24 volts
- Frequency Range: 20 kHz
-
Description: Description Specifications Body Size: 1/2"(DN15)～12"(DN300) Fusing Temperature: 165°F（74°C), 212°F（100°C) Material: Carbon Steel, Stainless Steel, Lining Fluorine Body Type: Ball Valve, Butterfly Valve Connection Type: For Ball Valve( Threaded, Welding, Flanged), Butterfly Valve(Wafer,
- Valve Size: 2 to 12 inch
- Features: Bolt Flange, Other
- Valve Type: Check Valves, Directional Valves, Safety Valves, Shut Off Valves
- Primary Material: Stainless Steel, Steel
-
Supplier: Kionix, Inc.
Description: protected from the environment by ahermetically-sealed silicon cap at the wafer level. TheKXTE9™s advanced, orientation-detection feature reports changes inlandscape, portrait, face-up, and face-down conditions. Thissophisticated, embedded algorithm eliminates the need for continuousdata
- Acceleration: 2 to 8 g
- Frequency Range: 25 to 800 Hz
- Maximum Shock: 1,000 g
- Operating Temperature: -40 to 185 F
-
Supplier: Brooks Instrument
Description: to flow deviations and supports wafer yield improvement Sensor stability tracking improves system uptime by supporting predictive maintenance Valve leak-by tracking helps minimize first wafer effects Enhanced process gas accuracy meets process gas chemistry control challenges at 10 nm
- Number of Inputs: 1 inputs
- Number of Control Outputs: 1 outputs
- Accuracy: 1 ±% FS
- Control Signal: Analog Voltage, Network / Fieldbus Output, Serial / Digital
Find Suppliers by Category Top
Featured Products Top
-
passing through. A change toward a dry condition or a liquid of a different dielectric will upset the capacitive field and initiate an alarm. The sensing plates are embedded into a wafer flange which provides monitoring without any intrusion into the stream flow (read more)
Browse Process Monitors Datasheets for Arjay Engineering -
, which are brought to a uniform thickness. The white light interferometers of the interferoMETER IMS5420 series were developed to continuously monitor the thickness. These consist of a compact sensor and a controller, which is housed in a robust industrial housing. An active temperature control (read more)
Browse Interferometers Datasheets for Micro-Epsilon Group -
flake from the quartz substrate, which can cause particle contamination to the wafer. Durability – The coating does not decompose, out-gas, or sublimate under vacuum at high temperature. Slower devitrification – The coating greatly (read more)
Browse Thermocouple Temperature Probes Datasheets for Conax Technologies -
not flake from the quartz substrate, which could cause particle contamination to the wafer. Durability – The coating does not decompose, out-gas or sublimate under vacuum at high temperature. Slower devitrification – The coating greatly (read more)
Browse Thermocouple Temperature Probes Datasheets for Conax Technologies -
-current wafer processing systems, precision sensor feedthroughs, or fiber optic monitoring in load locks, our assemblies are built for reliability in the most demanding semiconductor environments. (read more)
Browse Feedthroughs Datasheets for Douglas Electrical Components -
. Advanced Smart Features Modern Static SCR Voltage Stabilizers integrate intelligent digital technologies including: Real-time voltage monitoring (read more)
Browse Voltage Regulators Datasheets for Shenzhen Xingkerong Technology Co., Ltd
Conduct Research Top
-
MSilica Nanoparticles Treated by Cold Atmospheric-Pressure Plasmas Improve the Dielectric Performance of Organic-Inorganic Nanocomposites
Fabrication. Experimental devices were fabricated using standard soft. lithography techniques [45]. First, AZ 9260 (AZ Electronic. Materials, Somerville, NJ, USA) photoresist was spun onto a. clean /100S silicon substrate. The wafer was exposed to UV. light for 60 s through a mask patterned
More Information Top
Indicates content that may require registration and/or purchase.
-
In-situ Si wafer temperature measuring using pulse-modulated infrared laser interferometric thermometry for CVD film deposition
and thermal conductivity between a wafer and a stage are important to suppress wafer temperature rise, and direct wafer temperature monitor is neces- sary for precise wafer temperature control.
-
KLA-Tencor Introduces Additions To SensArray™ Portfolio Of Semiconductor In-Situ Process Monitoring Solutions
Complementary to the industry-leading EtchTemp product, ET-SE delivers temperature wafer monitoring during silicon etch processes, providing temperature measurements with a higher signal-to-noise ratio than alternative methods.
-
Characterization of various Ti-Al film alloys as wafer temperature metrology systems
After thermal cycling at process temperature, the change in Ti/Al film stack sheet resistance is directly proportional to heater seipoint temperature, thus providing a wafer temperature monitor .
-
Temperature oscillations in a silicon wafer under constant power of incoherent irradiation by heating lamps in a thermal chamber of RTP set up
As has been seen from fig. 3, for the total radiation the wafer temperature monitored by thermocouple oscillates in the .
-
Noncontact temperature monitoring of semiconductors by optical absorption edge sensing
The absence of a reliable, repeatable noncontact wafer temperature monitor from ambient temperature upwards has meant that in most cases etch, PVD and C\'D process engineers have developed their processes without precise knowledge of wafer temperature.
-
In-situ process monitoring in metal deposition processes
4-2-2 Wafer temperature monitoring in the lamp heating environment .
-
GaN-based LEDs grown on 6-inch diameter Si (111) substrates by MOVPE
Despite this, with careful control over the growth process, and with the aid of in-situ curvature and whole- wafer temperature monitoring , it is possible to realise GaN-based LED structures on 6-inch Si (111) substrates with good performance.
-
Rapid Thermal Processing Strategies for Highly Uniform and Repeatable Process Results on Patterned Wafers
By moving away from heating using non-uniform heat sources, like lamp based radiation heating, with inaccurate wafer temperature monitor /control, a significant portion of the extrinsic source of variations can be reduced or eliminated.
-
New sensing wafer technique for artifact-free transient temperature measurements in PEB processes
A wafer temperature monitoring system capable of measuring dynamic and steady state PEB temperatures with high accuracy and precision has been demonstrated.
-
Silicon integrated microsensors
These arrays can be used in wafer temperature monitoring , in thermal imaging, and in infrared spectroscopy for process monitoring.