WiFi Interface Chips

Description: communication speed and coverage Complex / miniaturized high-frequency circuit design technology High-density miniaturized wireless communication module Designand analysis of high-density wiring for various DC power and digital interface signals, including high-frequency signals (signal

• Technology: Wi-Fi / WiMAX / Wi-Mesh

Description: The Radicom Research WiFiHU series is a secure WiFi module that easily adds WiFi connectivity to virtually any processor-based device. The module is IEEE802.11 b/g/n™ compatible with a USB2.0 interface. With reliable transmissions, protocol stack and use of 1TX/2RX MIMO antenna

• Form Factor: Board
• Network Equipment: Modem
• Features: Radio Modem
• Network Media: Wireless

Description: Declaration ID D065384 QDID 222970 General features SDIO v2.0 Host Interface – (Can be shared across Wi-Fi and BT/Bluetooth® LE) gSPI host interface SBC Host offload A2DP WPA3 SoftAP (Up to 4 clients) DPP (Device Provisional Protocol) for Wi-Fi Easy Connect™ GPIOs (5) Coexistence

• T_J: -40 to 85 C
• Technology: Bluetooth
• Features: Bluetooth^® EDR Chip, Other, RoHS Compliant

Description: interface for Wi-Fi and Bluetooth® UART/PCM host interface for Bluetooth® Support for both RTOS and Linux/Android (A-Class) host designs 40 GPIOs Coexistence 2-wire SECI for external BT/LTE 3-wire GCI Package 106-ball WLBGA (3.76 x 4.43mm; 0.35mm pitch) 251-pin WLCSP (3.76 x 4.43,

• T_J: -20 to 70 C
• Technology: Bluetooth
• Features: Bluetooth^® EDR Chip, Other, RoHS Compliant

Description: operation Bluetooth® 5.1 Supports BDR (1Mbps), EDR (2/3Mbps), and Bluetooth® LE General features SDIO v2.0 Host Interface gSPI host interface WPA2 SoftAP GPIOs (5) Coexistence 2-wire GCI / SECI Package 74-ball WLBGA (4.87 x 2.87mm; 0.4mm ball pitch) 153-bump WLCSP (4.87 x 2.87mm)

• T_J: -30 to 70 C
• Technology: Bluetooth
• Features: Bluetooth^® EDR Chip, Other, RoHS Compliant

Description: operation Bluetooth® 5.1 Supports BDR (1Mbps), EDR (2/3Mbps), and Bluetooth® LE General features SDIO v2.0 Host Interface gSPI host interface WPA2 SoftAP GPIOs (5) Coexistence 2-wire GCI / SECI Package 63-ball WLBGA (4.87 x 2.87mm; 0.4mm ball pitch) Operating temperature -30C to +70C

• T_J: -30 to 70 C
• Technology: Bluetooth
• Features: Bluetooth^® EDR Chip, Other, RoHS Compliant

Description: WiFi Modules (802.11) WiFi DualBand Serial Interface Module

Description: Manufacturer: Microchip Technology Win Source Part Number: 277860-PM5370-FI Mounting Style: SMD Function: SONET/SDH Interface: Serial Categories: Integrated Circuits Supplier Device Package: 672-FCBGA (27x27) Status: Obsolete Popularity: Low Fake Threat In the Open Market: 55 pct. Supply and

• Features: Other
• Device Type: Sensor Interface

Description: Manufacturer: Microchip Technology Win Source Part Number: 890013-PM5329-FI Operating Temperature Range: -40°C ~ 85°C Features: Ethernet - 10/100 Base-T/TX Ethernet Interface 672-FCBGA (27x27) Package: Tray Package: 672-BGA, FCBGA Part Status: Obsolete Categories: Integrated Circuits (ICs)

• T_J: -40 to 85 C
• Package Type: BGA
• Features: Other
• Device Type: Sensor Interface

Description: Manufacturer: Microchip Technology Win Source Part Number: 277809-PM5308-FI Categories: Integrated Circuits Status: Obsolete Popularity: Low Fake Threat In the Open Market: 60 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 1 MSL Level: 1 (Unlimited)

Description: supporting 2 Mbit/s Extended temperature range –40 C to +105 C Chipset is compliant with AEC-Q100 Host interface: SDIO (Wi-Fi), UART or SDIO (BT) PCM interface for Bluetooth audio Access point mode for up to 8 stations Hardware encryption engines: AES and TKIP Security: WPA, WAPI,

• Technology: GPS
• Device Type: Receiver

Description: Manufacturer: Microchip Technology Win Source Part Number: 277863-PM5377-FI Part Status: Obsolete Categories: Integrated Circuits Popularity: Low Fake Threat In the Open Market: 59 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 24 MSL Level: 1 (Unlimited)

Description: LM842-8420, WiFi 802.11ac / Bluetooth® 5.0 2T2R USB Combi Adapter with two internal Onboard Metal Frame Antennae The LM842 USB Adapter (Dongle) complies with Bluetooth® 5.0 (Dual Mode) and IEEE 802.11ac WiFi Standards of operation, using a fully integrated single-chip that

• Technology: Bluetooth, Wi-Fi / WiMAX / Wi-Mesh

Description: LM842-8421 US, WiFi 802.11ac / Bluetooth® 5.0 2T2R USB Combi Adapter with two internal Onboard Metal Frame Antennae The LM842 USB Adapter (Dongle) complies with Bluetooth® 5.0 (Dual Mode) and IEEE 802.11ac WiFi Standards of operation, using a fully integrated single-chip that

• Technology: Bluetooth, Wi-Fi / WiMAX / Wi-Mesh

Description: LM842-8426 US, WiFi 802.11ac / Bluetooth® 5.0 2T2R USB Combi Adapter The LM842 USB Adapter (Dongle) complies with Bluetooth® 5.0 (Dual Mode) and IEEE 802.11ac WiFi Standards of operation, using a fully integrated single-chip that supports 2-stream 802.11ac solutions with

• Technology: Bluetooth, Wi-Fi / WiMAX / Wi-Mesh

Description: Microchip's SmartConnect ATWILC1000 is an IEEE 802.11 b/g/n IoT link controller module. The ATWILC1000 connects to Microchip AVR/SMART MCUs, SMART MPUs, and other processors with minimal resource requirements with a simple SPI/SDIO-to-Wi-Fi interface. The ATWILC1000 supports single stream 1x1

• Operating Temperature: -40 to 85 C
• Device Type: Serial Data Converter

Description: QFN-40-EP(5x5) Ethernet ICs ROHS

• Technology: Ethernet
• Package Type: QFN
• Features: RoHS Compliant
• Device Type: UART

Description: IC ETHERNET 672FCBGA

• T_J: -40 to 85 C
• Device Type: CardBus Controller, Sensor Interface
• Technology: Ethernet
• Features: Other

Description: includes INP1012 module with RF Pad INP3013 – includes INP1013 module with Ceramic Chip Antenna How to get started: Purchase an INP3012 evaluation board Download evaluation software from the InnoPhase IoT website to test connectivity and current consumption in various test modes:

• Category: Development Suite / Kit

Description: Bluetooth 4.0, 4.1, 4.2 & 5.0 Classic and LE can operate multiple connections simultaneously using the USB 2.0 interface, onboard management for maximising throughput while multiple connections are open under WiFi and/or Bluetooth®. Features 802.11ac standard + MIMO on 5G 2T2R, Wave-2

• Technology: Bluetooth, Wi-Fi / WiMAX / Wi-Mesh
• Interface: USB

Description: Telecom Interface ICs Single Chip Add/Drop Multiplexer with integrated Ethernet and PDH client interfaces

Description: interface. The ATWINC3400 connects to any Microchip PIC® or SAM MCU with minimal resource requirements. A MCU host driver can be found in the Advanced Software Framework (ASF) and in MPLAB(r) Harmony v3. The ATWINC3400’s most advanced mode is a single-stream 1 x 1 802.11n mode. The ATWINC3400

• Pin Count: 36
• Operating Temperature: -40 to 85 C
• Features: Other

Description: Sensitivity and Range via advanced PHY signal processing Wi-Fi Direct, station mode and Soft-AP support Supports IEEE 802.11 WEP, WPA2 Security Enterprise On-chip memory management engine to reduce host load SPI and SDIO host interfaces

• Operating Temperature: -40 to 85 C
• Device Type: Serial Data Converter

Description: IC TELECOM INTERFACE Product overview: PM5333-FI from Microchip Technology is an Interface Transceiver IC for serial communication, bus conversion, signal driving, receiver stages, and industrial networking. It is useful for engineers and buyers comparing datasheets, replacement parts,

• Features: Other
• Device Type: Transceiver

Description: IC TELECOM INTERFACE

• Device Type: Sensor Interface

Description: interface. The ATWINC3400 connects to any Microchip PIC® or SAM MCU with minimal resource requirements. A MCU host driver can be found in the Advanced Software Framework (ASF) and in MPLAB(r) Harmony v3. The ATWINC3400’s most advanced mode is a single-stream 1 x 1 802.11n mode. The ATWINC3400

• Pin Count: 48
• Operating Temperature: -40 to 85 C
• Features: Other

Description: 2X10G + 16XSFP MULTI-RATE, MULTI

• Device Type: CardBus Controller, Sensor Interface

Description: (RF360) Standard IEEE 802.11ax/ac/abgn dual band simultaneous Wi-Fi combo with BT5.1 Data Transfer Rates Up to 1775Mbps (dynamic) Industrial Reference Based on Qualcomm reference design (Hastings) Communications Interface WLAN via PCI Express Standard 2.1 host I/O + Bluetooth via UART PIN

Description: PCIe (BTO) Chipset Qualcomm-Atheros QCA9882/92 Standard IEEE 802.11ac/abgn Data Transfer Rates Up to 1300Mbps (dynamic) Industrial Reference based on Qualcomm Atheros reference design XB140 (+ new SKYWORKS FEM) Communications Interface WLAN via PCI Express Standard 2.1 host I/O Antenna Type

Description: specifications and Wi-Fi CERTIFIED WiGig requirements. QCA9500 Specs Wi-Fi Wi-Fi Standards 802.11ad Wi-Fi Spectral Bands 60 GHz Peak Speed 4.6 Gbps Wi-Fi Features TxBF RF Antenna Elements Up to 32 Antennas Security Support Wi-Fi Security AES-GCMP AES-CCMP Interface Supported Interfaces

• Data Rate: 4,600,000 kbps
• Interface: PCI Express
• Features: SPI
• Technology: Wi-Fi / WiMAX / Wi-Mesh

Description: HALF-BRIDGE PERIPHERAL DRIVER

• Device Type: Transceiver

Description: Passive Low Frequency Interface Device (PaLFI) With EEPROM and 134.2 kHz Transponder Interface 16-QFN -40 to 85

• Operating Frequency: 0.1342 MHz
• Bias / Operating Current: 0.15 mA
• T_J: -40 to 85 C
• Features: Other, RoHS Compliant

Description: Ethernet 10/100 Base-T/TX Ethernet Interface 672-FCBGA (27x27)

• T_J: -40 to 85 C
• Package Type: BGA, FCBGA
• Device Type: CardBus Controller
• Technology: Ethernet

Description: High-Side Measurement, Bi-Directional Current/Power Monitor w/I2C Interface 10-VSSOP -40 to 125

• Features: Other
• Standards and Certifications: RoHS Compliant

Description: Dynamic NFC Interface Transponder 14-TSSOP -40 to 85

• Operating Frequency: 13.56 MHz
• T_J: -40 to 85 C
• Features: RoHS Compliant
• Technology: Wi-Fi / WiMAX / Wi-Mesh