TABLE OF CONTENTS | Note | The terms uprating and thermal uprating are being used increasingly in avionics industry discussions and meetings, and clear definitions are included in this clause. They were coined as shorthand references to a special case of methods commonly used in selecting components for circuit design. This document describes the methods and processes for implementing this special case. All of the elements of these processes employ existing, commonly used engineering practices. No new or unique engineering knowledge is required to follow these processes: only a rigorous application of the overall approach. |
The following terms and definitions are used herein and/or should be used when using devices outside the manufacturers' specified temperature ranges:
absolute maximum ratings: are limiting values of operating and environmental conditions applicable to any semiconductor device of a specific type as defined by its published data, which should not be exceeded under the worst possible conditions. These values are chosen by the device manufacturer to provide acceptable serviceability of the device, taking no responsibility for equipment variations, and the effects of changes in operating conditions due to variations in the characteristics of the device under consideration and all other electronic devices in the equipment. (From IEC 134, 1st Edition 1961).
ambient temperature: is the temperature of the environment in which a semiconductor device is operating.
case temperature: is the temperature of the surface of a semiconductor device package during operation.
Circuit Element Functional Mode Analysis: A documented analysis that determines minimums, ranges and...
