Appendix A: Glossary

(Definitions provided are specifically applicable to the design, fabrication, assembly, and test of printed circuit assemblies.)

A/D converter: A functional circuit element or component that converts analog signals to digital signals.
active component: An electronic component whose parametric characteristics change while operating on an applied signal.
additive process: A process for fabricating a printed circuit board by selectively depositing conductive material to define a conductor pattern on unclad, chemically treated laminate material.
adhesive characteristics: Adhesive and cohesive strength over its expected operational environment are the essential characteristics of an adhesive material. Adhesion is the strength of the bond at the interface surface. Cohesion is the bulk (cross-sectional) strength of the adhesive material.
adhesive dam: A method of controlling the flow of adhesive material on inner layers of a multilayer board during lamination by providing an etched border of copper around the outer edges of the conductor layers.
aging: Mechanisms that cause degradation of properties or performance over a period of time.
American National Standards Institute (ANSI): An organization that establishes national and international standards. ANSI publications that are most applicable to printed circuits are those that define drafting procedures and documentation formats.
American Society for Testing and Materials (ASTM): An organization that provides a forum for the development and publication of test standards and procedures for materials, products, systems, and services.
analog: A type of circuit that deals with continuously varying voltage or current values that represent physical quantities.
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Printed Circuit Assembly Design

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Appendix A: Glossary

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