TABLE OF CONTENTS | AQAP | Advance product quality planning and control plan | |
| ANOVA | Analysis of variance | |
| AV | Appraiser variation | |
| BIST | Built in self-test | |
| BOM | Bill of materials | |
| CAD | Computer-aided design | |
| CAE | Computer-aided engineering | |
| CAM | Computer-aided manufacturing | |
| CEM | Contract electronic manufacturers | |
| CLT | Central limit theory | |
| CIM | Computer-integrated manufacturing | |
| CPI | Continuous process improvement | |
| Cp | Capability of the process | |
| Cpk | Capability of the process, with average shift | |
| CR | Criteria rating | |
| DA | Decision analysis | |
| DFD | Data flow diagrams | |
| DFM | Design for manufacture | |
| DFT | Design for testability | |
| DoE | Design of experiments | |
| DOF | Degrees of freedom | |
| DPMO | Defect per million opportunities | |
| DPU | Defects per unit | |
| ECO | Engineering change orders | |
| ERP | Enterprise requirements planning | |
| ESI | Early supplier involvement | |
| EV | Equipment variation | |
| IPC | Institute for Interconnecting and Packaging of Electronic Circuits | |
| FMEA | Failure mode effect analysis | |
| FT | Functional test | |
| FTY | First-time yield | |
| GMP | Good manufacturing practices | |
| GR&R | Gauge repeatability and reproducibility | |
| Hipot | High potential | |
| IC | Integrated circuit | |
| ICT | In-circuit test | |
| JIT | Just in time | |
| MR | Moving range | |
| MTBF | Mean time between failure | |
| NIH | Not invented here | |
| NS | Normal (probability) score | |
| NTF | No trouble found | |
| OA | Orthogonal arrays | |
| OEM | Original equipment manufacturers | |
| PCB | Printed circuit board | |
| PPM | Parts per million | |
| PTF | Polymer thick film | |
| QA | Quality assurance | |
| QFD | Quality function deployment | |
| QLF | Quality... |
