1. Crawford, T., Step-by-Step SMT Cleaning, SMT ( Sep. 1997)

2. Woodgate, R., No-Clean The Simple Way, Circuits Assembly ( Apr. 1995)

3. Koschmieder, S., Thermal Phase: A New Technique for Stencil/PCB Cleaning, SMT ( Feb. 1998)

4. Lowe, N., Removing Paste and Adhesive, Electronic Packaging and Production ( Aug. 1999)

5. Bent, W. R., and Turbini, L. J., Evaluating the Effect of Conformal Coatings in Reducing the Rate of Conducive Anodic Filament Formation, Proc. Apex, San Diego, CA ( Jan. 2002)

6. Standard Test Method for Kauri-Butanol Value of Hydrocarbon Solvents, ASTM D1133-02, Book of Standards, Vol. 6.04.

7. Encyclopedia for the User of Petroleum Products, Exxon Co. ( 1997)

8. Novec Engineering Fluids for Electronics Cleaning, 3M Brochure, 3M Co. ( Dec. 2000)

9. Lowe, N., Flux Removal and Aqueous Process, Electronic Packaging and Production ( Oct. 1999); and Vertrel Data Sheets, DuPont.

10. Private communication with Roger Hesse, Stoelting ( Mar. 4, 2002)

11. Accel Microcel Product Bulletin 36276, Speedline Technologies, Cookson Electronics ( Apr. 2000)

12. Jackson, D., and Bixenman, M., Critical Cleaning of Flip-Chip Packages Using Dense Phase CO ₂ Technology, Proc. NEPCON West Conf., pp. 640 649( 2000)

13. SuperFuge Liquid and SCF CO ₂ Cleaning System, Bulletin SF-1000, Deflex Corp. (undated)

14. Rae, A., Dalton, S., and Bixenman, M., Cleaning with a Centrifugal Semi-aqueous Process, Electronic Packaging and Production