TABLE OF CONTENTS The reliability of electronic systems depends on extensive testing, inspection, and evaluation of all parts of the design and manufacturing process, including the adhesives used in the systems. Test methods for adhesives and adhesive-bonded assemblies may be generally classified as physical, electrical, environmental, thermal, mechanical or thermomechanical, and chemical (Table 7.1). This chapter summarizes most of the methods used to test and evaluate adhesives used in electronics. It is not intended to provide detailed instructions, but to lead the reader to the appropriate government or industry specifications, documents that are available from the various organizations listed in Table 7.2.
| Physical | Electrical | Environmental | Thermal | Mechanical/Thermomechanical | Chemical Analysis |
|---|---|---|---|---|---|
| Viscosity ASTM D2196 and ASTM D2556 | Volume resistivity MIL-STD-883, Method 5011, (3.8.11.1), ASTM D257 | Solvent and chemical resistance IPC-SM-817, paragraph 4.5.6 | Exotherm during cure ASTM D2471 | Hardness ASTM D2240 | Weight-loss during cure No standard method |
| Spread and slump IPC-SM-817, Method 4.5.5 and IPC-SM-870 | Dielectric constant, dissipation factor ASTM D150-81 | Corrosion or migration effects IPC-TM-650, Method 2.6.14 | Gel time ASTM D2471 | Modulus ASTM D790 (flexural), ASTM D638 (tensile), and ASTM D412 (Young's) | Infrared spectrum (ASTM E1252 Practice for General Techniques for Obtaining Infrared Spectra for Qualitative Infrared Analysis) or Fourier Transform Infrared Reflection Spectroscopy (ASTM E1790-00 Standard Practice for Near Infrared Qualitative Analysis) |
| Density ASTM D1875 (uncured) ASTM D792-91 (cured) | Dielectric breakdown voltage ASTM D149 | Radiation effects ASTM D1879-99 Standard Practice for Exposure of Adhesive Specimens to High-Energy... |
