Help with Semiconductor Wire and Wedge Bonders specifications:
Bonders
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| Type | |||
| Your choices are... | |||
| Thermocompression Ball Bonder | Thermocompression uses pressure and temperature to create an intermetallic bond. A “free air ball” is created by a spark from an “electronic flame off” or EFO underneath the capillary before bonding takes place. | ||
| Thermosonic Ball Bonder | Thermosonic adds ultrasonic energy to pressure and temperature to create an intermetallic bond. A “free air ball” is created by a spark from an “electronic flame off” or EFO underneath the capillary before bonding takes place. | ||
| Wedge Bonder | Wedge bonders use ultrasonic energy and pressure to create a bond between a wire and a bond pad. This process deforms the wire into a flat elongated shape of a wedge. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Automation | |||
| Your choices are... | |||
| Manual | The process requires full human interaction to be completed. | ||
| Semi-Automatic | Semi-automatic machines allow a single operator to perform routine activities quickly and accurately. | ||
| Automatic | Automatic machines perform activities without operator intervention. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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