Microelectronics and thin film manufacturing equipment including vacuum systems and components, gas delivery systems, deposition systems, photolithography units, etching equipment, annealing furnaces and other accessories.
Battery assembly machines are used to manufacture electrical batteries and battery packs.
Breadboards and breadboard accessories are used for testing and experimenting with electronic circuits. They are covered with slots for interchanging components and electrical connection strips.
Capacitor assembly machines are used to manufacture capacitors, passive electronic components that store energy in the form of an electrostatic field.
Depanelizers cut or separate larger sheets of multiple, etched printed circuit boards (PCBs) into individual PCBs. They are sometimes called PCB singulators.
Die bonders permanently attach a semiconductor die or chip to a package or substrate.
Electrical feedthroughs transmit electrical current through the walls of a pressurized or vacuum system through a hermetic seal.
Electronic Packages and Lids are used in the microelectronic and fiber optic industry. Packages and lids are used to enclose electronic chips and interface with circuit boards. They are typicaly customized to customer requirements.
Feedthroughs transmit electrical current, fluids, optical signals, or mechanical motion through the walls of a pressurized or vacuum system through a hermetic seal.
Laboratory fume hoods are partially enclosed workspaces that are exhausted to the outside.
Ionizers and static eliminators eliminate static and dust and can neutralize and clean surfaces at remote distances.
Lithography equipment transfers circuit or device patterns onto a substrate using a patterned mask and a beam of light or electrons to selectively expose a photoresist layer. Overlay metrology systems align the pattern masks or reticules.
Magnetrons are high-powered vacuum tubes used to generate microwave signals. Products include cavity magnetrons and sputtering magnetrons.
MEMS processing equipment is used to create micro-electro-mechanical systems (MEMS) sensors and wafers.
Reflow ovens are used to perform reflow soldering of surface mount electronic components to printed circuit boards (PCB).
Equipment used to manufacture or process semiconductors.
Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.
Surface mount technology (SMT) manufacturing equipment is used to populate printed circuit boards (PCB). This includes soldering machines, ovens, component placement, paste depositors and screen and stencils.
Soldering irons, stations and accessories bond two or more metallic surfaces together with a low melting alloy solder such as tin/lead or Sn/Cu/Ni/Ge alloys, which is melted, wets the surface and resolidifies forming a soldered joint.
Static control products control electrostatic discharge to avoid damage to personnel or equipment.
Thin film equipment uses vacuum processing for the modification of surfaces using CVD, PVD, plasma etching, and thermal oxidation or ion implantation.
Wafer cassettes are used to transport and store wafers during semiconductor manufacturing operations. They are designed to house or carry several wafers of the same size and are available in a range of materials to support specific applications, such as thermal processing.
Wafer chucks are used to handle semiconductor wafers during wafer processing applications. Common work clamping technologies include vacuum and electrostatic.
Wire and cable crimpers are designed for the connection of electrical and metal components by cutting, stripping, bending, and deforming. Crimping is extensive in the electrical and metal-forming industries and was developed as a high-quality, low cost replacement for soldered terminations. This article does not reference hose crimping processes.
Cable and wire strippers are devices used to remove sections of insulation from electrical wire, allowing access to the conductor for terminating and splicing. This guide includes handheld, benchtop, powered, and chemical stripping processes.
Wire wrapping tools are used to install and remove wire wrap connections. Wire wrapping attaches a connecting wire to a terminal by tightly coiling the wire around the terminal’s corners.