Help with Amplifier and Comparator Chips specifications:
Device Type
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| Device Type | |||
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| Audio Amplifiers | Audio amplifiers are units that amplify a sound signal, which is then sent to a speaker or another amplifier. Audio amplifiers are used to strengthen an audio signal and make it available for more powerful amplification. | ||
| Buffer | A buffer amplifier is an amplifier with unity gain. | ||
| Comparators | Analog comparators are amplifiers that compare the magnitude of voltages at two inputs. An analog comparator is an operational amplifier that can have negative feedback removed, with no feedback, and very high gain. The output voltage goes to one extreme to the other. | ||
| Current Sense Amplifier | Current sense amplifiers are integrated circuits with operational amplifiers and sense resistors that are used in measuring the amplitude and direction of current in circuits. | ||
| Differential Amplifiers | Differential amplifier chips are designed to amplify the difference between two input signals. They can amplify a small difference between two signal levels and ignore any common level shared between them. | ||
| Instrumentation Amplifiers | Instrumentation amplifier chips are precision amplifier circuits with both high-impedance differential inputs and high common-mode rejection (CMRR). These amplifiers are a type of operational amplifiers that are used for very accurate and low-noise measurements due to their high input impedance and high common-mode rejection. The differential gain of an instrumentation amplifier chip can be adjusted by changing the value of a single resistor. | ||
| Isolation Amplifiers | Isolation amplifiers electrically isolate input and output signals, often by inductive couplings. Isolation amplifiers or iso-amps may be used to protect components from potentially dangerous voltages or to amplify low-level analog signals in applications with multiple channels. | ||
| Log Amplifiers | Logarithmic amplifier chips produce an output voltage that is directly proportional to the logarithm of the input voltage. Logarithmic amplifiers or log amplifiers are mainly used in applications that require the compression of signals, such as video and audio equipment. | ||
| Operational Amplifiers | Operational amplifier chips are general-purpose, closed loop devices used to implement linear functions. Operational amplifier chips are widely used in signal processing circuits, control circuits, and instrumentation. | ||
| Operational Transconductance Amplifiers (OTA) | Operational transconductance amplifiers (OTA) are devices that convert an input voltage to an output current. They are primarily voltage-to-current amplifiers. Unlike traditional operational amplifiers or op-amps, operational transconductance amplifiers (OTA) represent a voltage-controlled current source (VCCS). Their transconductance parameter is controlled by an external, amplifier-bias current and expressed as a function of the applied voltage. Because an OTA’s output impedance is high, some operational transconductance amplifiers have on-chip controlled impedance buffers for driving resistive loads. The dependence of open-loop bandwidth, closed-loop bandwidth and frequency responses are similar to those of conventional operational amplifiers, however. For OTA circuits that use negative feedback, there is a very close relationship between the closed-loop bandwidth, the amplifier bias current and the closed-loop gain. | ||
| Power Operational Amplifiers | Power operational amplifiers (POA) are used to increase the power of low-level signals in applications that drive low impedances or reactive loads. They dissipate excess energy as heat, deliver extensive current, and can sustain relatively high supply voltages. | ||
| Variable Gain Amplifiers | Variable gain amplifiers are amplifiers whose gain can be changed by the user. | ||
| PWM Amplifiers | Pulse width modulated (PWM) amplifier chips generate a current that switches between high and low output levels. PWM amplifiers have a much higher power capability for a given voltage than linear amplifiers. | ||
| Sample and Hold Amplifiers | Sample-and-hold amplifiers are operational amplifiers whose input may be turned to sample a voltage. When turned off they can hold the sampled voltage at the output, while an ADC converts the voltage to a digital number. | ||
| Video / Wideband Amplifiers | Video or wideband amplifiers are used in video circuits for the processing of video signals. | ||
| Other | Other unlisted or proprietary amplifiers. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Package Characteristics
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| Package Type | |||
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| DIP | Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP). | ||
| CDIP | Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. | ||
| PDIP | Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics, and telecommunications. | ||
| DPAK | DPAK refers to a type of transistor outline package (T0-252). | ||
| CSP | Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs. | ||
| SIP | SIP refers to a single inline package. | ||
| SOIC | SOIC refers to a small outline IC. | ||
| SSOP | SSOP refers to a shrink small outline package. | ||
| SOP | SOP is a small outline package. | ||
| MSOP | Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar-coded. Reels are placed inside barcode-labeled boxes for shipping. | ||
| SOT | SOT packaging refers to a small outline transistor. | ||
| SOT23 | SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment. | ||
| PSOP | PSOP refers to a power small outline package. | ||
| QFP | QFP is a quad flat package. | ||
| TO-220 | Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-220 is a TO package of size 220. | ||
| TO-3 | Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-3 is a TO package of size 3. | ||
| SC-70 | SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops, and other portable and hand-held applications where space is extremely limited. | ||
| TSSOP | TSSOP refers to thin shrink small outline L-leaded packages. | ||
| QSOP | QSOP refers to a quarter size outline package. | ||
| PLCC | PLCC refers to a plastic leaded carrier. | ||
| UCSP | UCSP refers to an ultra chip scale package. | ||
| Other | This refers to other unlisted, specialized, or proprietary packages. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Operating Range | The industrial field in which the device will be used. | ||
| Your choices are... | |||
| Automotive | Devices support a temperature range and feature mechanical and electrical specifications that are suitable for automotive applications. | ||
| Commercial | Devices support a temperature range and feature mechanical and electrical specifications that are suitable for commercial applications. | ||
| Industrial | Devices support a temperature range and feature mechanical and electrical specifications that are suitable for industrial applications. | ||
| Medical | Devices support a temperature range and feature mechanical and electrical specifications that are suitable for medical applications. | ||
| Military | Devices support a temperature range and feature mechanical and electrical specifications that are suitable for military applications. | ||
| Other | Other unlisted operating ranges. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Standards and Certifications
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| RoHS Compliant | Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl, and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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| ELV Directive | The End of Life Vehicles (ELV) directive requires that certain automotive products be free (except for trace impurities) of mercury, cadmium and lead as of July 1, 2003. Lead can still be used as an alloying additive in copper, steel, aluminum, and in solderable applications. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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