Find out how innovative solutions can extend brake rotor life and minimize pollution generated by brake systems in passenger cars and commercial vehicles. What's more, brake rotor manufacturers can meet mass production demands with greater cost-effectiveness and automation. Corrosion resistance can be further improved with solution such as the Smart ONC® technology.
The webinar shows how time and resources can be saved thanks to autonomous test and inspection. The audience will receive compact information about the functions of test and inspection systems that avoid fault slippage as well as for minimizing pseudo errors when used in the manufacturing process. Ways to minimize the risk of misclassification through the use of artificial intelligence will be demonstrated.
Automating the lifecycle management of your products is essential because it ensures a single source of information and streamlined processes from concept to end-of-life. Finding the right information and sharing knowledge is a remarkably time-consuming and likely area for mistakes to occur. Anything you can do to help you manage complex product information, as well as engineering and manufacturing workflows, will positively impact your bottom line.
Join Siemens and National Institute for Aviation Research (NIAR) to learn how to speed up and de-risk certification by using numerical analysis supported by physical testing as proof of compliance. Make certification an integral part of the program and ensure traceability from requirements to design, analysis, testing and reporting. Consolidate this knowledge in a collaborative engineering platform as your company moves to certification by analysis supported by testing.
The objective of this webinar is to share the concept of passive multi-function assemblies (MFAs), with examples provided that incorporate such functions as transitions, RF filters, ferrite isolators, non-directional couplers and high-power terminations. It will illustrate the advantages and the pitfalls that can readily be avoided and will offer an understanding of the trade-offs and benefits of MFAs in the defense and space industries.
This webinar will introduce key material properties of a sputtering target to the audience, and how they affect the product performance at our customer site. Purity and microstructure of a material are the biggest differentiators in the sputtering target market and essentially, the focus will be on a few of the process manufacturing levers that PST's Electronics Deposition Materials uses to control said properties, and meet the customer requirements, which keeps getting stringent with ever-decreasing node size of transistors.
Quantum technologies promise to solve complex optimization problems that are out of the scope of today’s most powerful supercomputers. With this webinar, Radiall will unveil the latest interconnectivity solutions for quantum technologies: a strategic and booming field. Will you be part of it?
Companies that can best optimize their cyber-physical systems and their workforce will be the winners in their market, and digital transformation is the key to that success. But adoption of digital transformation – or Industry 4.0 – technologies like the industrial internet of things (IIoT), big data, and data visualization has been uneven across market sectors.
What do engineers and managers need to know about digital transformation, and how can becoming a digital transformation expert transform your career?
In this webinar, you will learn the three Ts (Thermal Transient Testing) and what makes it essential to characterize the junction temperature and heat conduction path of power modules. You also will learn how to properly test and simulate the thermal performance of complex power semiconductor package types. If you know how to calibrate thermal simulation models, you will better understand the usage of test-based data. Join us for this webinar and learn more about what SIEMENS can offer your company and product life cycle.
SOLIMIDE® Foam is a premiere thermal and acoustic insulating foam with improved performance with none of the standard drawbacks of typical insulating foams. SOLIMIDE® is lightweight, fire resistant, emits little to no smoke, nontoxic, and offers hydrolytic stability in addition to a number of other benefits that make it ideal for applications where safety is a key concern as well as enable other creative uses such as managing thermal runaway. Watch this webinar to learn more about SOLIMIDE® properties, benefits, and utilization.
With today's technologies, it's difficult for high-mix manufacturers to automate profitably; production volumes are simply not high enough to recoup the investment. Vention created MAP (Manufacturing Automation Platform) to allow all manufacturers to automate their factory by themselves, at a fraction of the time and cost of traditional industrial automation technologies. Discover the one platform with which to design, automate, order, and deploy automated equipment.
Semiconductor companies looking at new, system-level approaches to keep up with Moore’s law and design complexity must adopt a model-based system engineering approach that emphasizes an integrated product design workflow for advanced semiconductor packaging design with a collaborative PLM platform, including NX, Simcenter FloEFD, Simcenter 3D, Simcenter HEEDS and Simcenter T3Ster. Garrett Wyatt is a New Business Sales Executive for Siemens Digital Industries Software who works with industry-leading semiconductor companies to select the best tools and design methodologies.
Thermogravimetric analysis (TGA) measures the mass of a sample while the sample is heated or cooled in a defined atmosphere. The main use of TGA is to characterize materials with regard to their composition. A TGA/DSC instrument even allows you measure thermal events that do not produce a mass change.
Rohde & Schwarz have developed a novel way of capturing and measuring eye diagrams in hardware. Making it much faster to capture, lock on and display all the bits required for finding anomalies or statistical analysis. Learn more in our webinar.
This webinar aims to demonstrate how a combined electro-thermal co-simulation as well as thermo-mechanical analyses of these boards using Siemens Simcenter products can improve the accuracy of the analyses and increase the productivity of the design teams.
The rapid expansion of connected devices and data-intensive applications is driving the growing demand for highly efficient and adaptive high-performance computing solutions. Mobile devices such as cell phones, tablets and car infotainment systems have the most sophisticated System-on-Chips (SoCs) ever produced.
When it comes to sealed protection TE Connectivity offers rugged connectors and high-performance heat shrink tubing built for the harshest environments – exposure to moisture, dust, debris, shock, and vibration. Engineers need to design for safety and durability while meeting global industry safety standards. At TE, we provide connectivity solutions that meet complex application needs with a single connection.
As a business leader, we know how vitally important it is for you to deliver the products your customers expect; there's so much at stake and many risks. The problem is that design teams can't keep up with all the product requirements changes and updates because they don't have the tools to see the impact of the changes, and they can't adapt and validate them fast enough. But that whole mess can be avoided by getting a high-level view of design performance using simulation and analysis earlier and often in the design process. The goal is to resolve problems early before they become significant.
When developing a product that requires a display, choosing the right display is key. But how do you select the right display for your application? In this webinar, Azumo discusses five different display technologies and analyzes 10 key considerations to help you decide the best display for your product.
MIL-DTL-38999 connectors have been used in everything from aircraft to military vehicles for decades. Explore the history of D38999 connectors and their evolution as technology has advanced over the years. Modern and emerging computing systems require higher data transfer speeds, requiring more technologically advanced connectors to support the data within these systems. PIC Wire & Cable can support robust data requirements with interconnect solutions designed for these emerging applications with the innovative MACHFORCE D38999 style connector.
As the ecosystem for Ultra-Wideband (UWB) continues to expand, so do the immersive experiences and use cases that can be enabled when devices become spatially aware of other devices and their environment. In this webinar, we will cover the growth of the ecosystem and the emerging applications in the Smart Home and commercial environment.
Are you designing electrical systems for applications such as medical devices or aerospace equipment that require high reliability? In this webinar, we will walk through the basics of multilayer ceramic capacitor (MLCC) manufacturing, and how our experts at Knowles Precision Devices ensure reliability.
An overview will be presented of Altech's comprehensive DIN rail terminal block line with its different connection technologies for wiring solutions in many industries and applications.
Gallium nitride (GaN) on silicon carbide (SiC) has the highest power density across a broad frequency range and plays a pivotal role in providing the best figure of merit for power amplifiers in terms of linear output power. This webinar will showcase MMICs, HEMTs, RF diodes, SAW solutions with best in class performance meeting the requirements of 5G, satellite communications, aerospace and defense applications. Different types of beamforming, figures of merit used in components for these applications and the key benefits will be discussed.
Characterizing high-frequency active or passive devices is extremely challenging especially now that more devices are in the D-band and above which are paving the path for future technologies like 6G and beyond. This webinar will address these higher frequency devices and their advantages such as faster data rates as well as the challenges and solutions associated when the devices are on-wafer.
The rapid rise of oil prices has pushed the growth of electric vehicles (EVs) and hybrid electric vehicles (HEVs)to take center-stage in the automotive industry. The high voltage batteries used in these systems require safe insulation and isolation. Broadcom offers a complete family of products that can be used to simplify designs. These products enable more reliable inverter system design for the HEV and EV markets. Devices range from gate drivers to analog and digital current and voltage sensor ICs. These parts ensure reinforced galvanic insulation between the control circuits from the high voltages and the power semiconductor devices.
We at TE Connectivity (TE), a world leader in connectivity and innovative technology, have taken a closer look at the HVAC market and are sharing our insights to help manufacturers capitalize on the opportunity for innovation and market share gain. Engineers need to be aware of the myriad global issues and trends driving HVAC systems growth, and the design and technology challenges that must be considered. With a focus on energy-efficient and clean air advancements, HVAC capabilities are effectively attempting to address climate change and decarbonization concerns while also delivering the kinds of safe, healthy, and comfortable-living solutions required from a growing and increasingly urbanized population.
In this presentation we will cover the many variables and considerations involved when selecting an appropriate Thermal Interface Material solution for your applications. We will discuss the different material options available, and which types of applications each is best suited for. The presentation will address some of the common challenges of thermal applications such as compression force limitations, dielectric concerns, and handling challenges.
Energy storage systems offer a wide range of technological approaches to manage our supply-demand situation, create a more resilient energy infrastructure, and deliver cost savings for utilities and consumers. In this webinar, you will get a deeper insight into Infineon's comprehensive solution offering for Energy Storage Systems, with a focus on silicon carbide and its important contribution to reducing losses by 50%. You will also get an overview of the structure of energy storage systems and learn more about topologies and implementation approaches.
Low temperature solder solutions have been gaining interest in recent years as a technology enabler for next generation chip-scale package designs. Recent alloying advancements led to the development of the HRL3 alloy that significantly improves reliability over traditional tin-bismuth (SnBi)-based low temperature solder alloys.