Dielectric Ceramic Powder

Description: Saint-Gobain's #1020 is a fused, crushed mullite powder that is blocky-shaped & white in color. This powder produces coatings that are ideal for applications requiring good dielectric strength, thermal insulation and aluminum metal contact.

• Applications: Abrasive / Erosive Wear Protection
• Type: Powder / Aggregate (Grain / Grog)

Description: strontium titanate.) The ultra-fine particle size, 50 to 400 nano meters (nm) of these ceramic powders make them ideal for ultra-thin dielectric layers in composites and ceramic capacitors. TPL has the ability to provide ceramic nano-powder formulations to

• Applications: Other
• Material Type: Piezoelectric Ceramic
• Performance Features: Composite / Ceramic Matrix
• Type: Powder / Aggregate (Grain / Grog)

Description: Saint-Gobain’s #110 is a blocky-shaped gray fused aluminum oxide powder containing about 3 percent titania. When sprayed, this powder produces a hard, dense coating that offers wear resistance & dielectric strength in aerospace, printing, automotive & chemical applications

• Applications: Abrasive / Erosive Wear Protection
• Type: Powder / Aggregate (Grain / Grog)

Description: Saint-Gobain’s #112 is a blocky-shaped, fused aluminum oxide powder with about 3% titania. The powder produces coatings that provide wear resistance & dielectric strength in aerospace, printing & automotive applications. The #112 is approved for GE A50TF87 Class B, Canadian

• Applications: Abrasive / Erosive Wear Protection
• Type: Powder / Aggregate (Grain / Grog)

Description: Honeywell EMS 52432, Boeing 10-67 type 3 & Rolls Royce 9507/36. Saint-Gobain Coating Solutions offers a complete line of aluminum oxide thermal spray powders that impart dense, hard, wear-resistant coatings with electrical insulating properties. These coatings provide high dielectric

• Applications: Abrasive / Erosive Wear Protection
• Type: Powder / Aggregate (Grain / Grog)

Description: Hexagonal boron nitride (HBN) powder has good thermal conductivity, insulation, chemical stability and lubricity. Its anti-oxidation temperature exceeds 2000 ?, and it also has good lubricity at high temperature. It is mainly used in the preparation of cubic boron nitride, high temperature

Description: advanced capacitance materials primarily for electromagnetic weapon systems and is a manufacturer of nano-size ceramic dielectric powders, monolithic ceramic capacitors and substrates, as well as specialty dielectric materials. The Micropower Technologies Division

• Dielectric Constant: 4.75 to 5.03
• Features: Electronics / Semiconductors, Electrical Power / HV
• Material Form: Composite, Film / Sheet, Polymer (Plastic / Elastomer)

Description: This material is a filled dielectric which contains a high Dk ceramic powder. The thicknesses available include 25 and 16um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor

• Features: Dielectric / Insulating
• Thickness: 6.30E-4 to 9.84E-4 inches

Description: titanate.) The ultra-fine particle size, 50 to 400 nano meters (nm) of these ceramic powders make them ideal for ultra-thin dielectric layers in composites and ceramic capacitors. TPL has the ability to provide nano-powder formulations to customer specifications.

• Application: Nanoelectronics, Specialty / Other
• Material Type: Ceramic / Carbide, Other
• Particle / Feature Size: 400 nm
• Specific Surface Area (SSA): 2.5 to 4.5 m²/g

Description: titanate.) The ultra-fine particle size, 50 to 400 nano meters (nm) of these ceramic powders make them ideal for ultra-thin dielectric layers in composites and ceramic capacitors. TPL has the ability to provide nano-powder formulations to customer specifications.

• Application: Nanoelectronics, Specialty / Other
• Material Type: Ceramic / Carbide, Nanocomposite, Other
• Particle / Feature Size: 50 to 100 nm
• Specific Surface Area (SSA): 15 to 18 m²/g

Description: Boron Nitride is a non-toxic thermal and chemical refractory substance with high electrical resistance that is most usually found in the form of colorless crystals or white powder. It is a sophisticated synthetic ceramic material that is also known as "white graphene" or "inorganic

• Material Type: Boron Nitride
• Shape / Form: Spout / Nozzle (Launder Pouring / Atomization), Powder / Aggregate (Grain / Grog)

Description: helix support rods, termination wedges, heatsinks, etc.,we apply the same basic manufacturing processes to produce these designs using aluminum nitride. AlN is somewhat more challenging than some other technical ceramic because the fine grained grinding powder adheres to the diamond

• Coeff. of Thermal Expansion (CTE): 5 µm/m-C
• Dielectric Constant (Relative Permittivity): 9 #
• Electrical Resistivity: 1.00E15 ohm-cm
• Material Type: Aluminum Nitride

Description: materials Additive for film for anti-blocking, dielectric strength improvement, and gas barrier Additives for plastics to increase hardness and dimensional stability Matte Finish for coatings Binder for ceramics and inorganic coating material

• Applications: Other
• Material Type: Silica / Silicate Materials
• Type: Powder / Aggregate (Grain / Grog)

Description: We offer a complete line of high-purity electronic material formulations. Electroding, dielectric, ferroelectric and piezoelectric compositions are offered in target, substrate and powder form in the following compositions. Custom compositions are also available. BaTi Oxide

• Applications: Electronics / RF-Microwave

Description: HTCP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly. As with all thermal interface materials, we

• Material Form: Powder / Grain

Description: exceptional properties obtained from HTSP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly. As with all

• Material Form: Powder / Grain

Description: Bonds plated metals to ceramic, heaters, ignitors, gasketing

• Dielectric Strength: 1.00E7
• Features: Electronics / Semiconductors
• Material Form: Adhesive, Composite, Gap Filling Sealant / Gasket, Powder / Grain

Description: Sauereisen Electric Refractory Cement No. 350 is a chemically-setting inorganic cement specified for high temperature bonding applications. The product is supplied as a two-component sodium silicate cement consisting of a Powder and Liquid which are mixed together as used. The excellent

• Dielectric Constant: 8.08
• Dielectric Strength: 35 to 42
• Features: Electronics / Semiconductors, Electrical Power / HV
• Material Form: Adhesive, Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Gap Filling Sealant / Gasket, Powder / Grain

Description: Sauereisen Insa-Lute Adhesive Cement No. 1 is specified throughout the automotive, appliance and assembly industries for bonding, insulating, and encapsulating applications. A thermally conductive and electrically insulating cement paste, the material bonds well to metal, ceramics and

• Dielectric Constant: 3.5 to 6
• Dielectric Strength: 51000 to 2.00E6
• Material Form: Adhesive, Grease / Gel, Powder / Grain

Description: applications. HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCPX are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to

• Material Form: Gap Filling Sealant / Gasket, Powder / Grain

Description: -corrosive and compatible for applications with ceramics, glass and most metals. The material is supplied in Powder form and need only be mixed with water to apply.

• Dielectric Constant: 3 to 4
• Dielectric Strength: 12.5 to 102
• Features: Electronics / Semiconductors, Electrical Power / HV
• Material Form: Adhesive, Potting Compound, Powder / Grain

Description: -based cement, No. 13 is non-corrosive and compatible for applications with ceramics, glass and most metals. The material is supplied in Powder form and need only be mixed with water to apply.

• Dielectric Constant: 6.86
• Dielectric Strength: 55
• Features: Electronics / Semiconductors, Electrical Power / HV
• Material Form: Adhesive, Potting Compound, Powder / Grain

Description: most organic solvents. Adhesion to metals, ceramics and almost all plastics is excellent. Master Bond Polymer System EP125 is recommended for bonding, casting, laminating and sealing applications where exceptional long term resistance to heat and aggression.

• Dielectric Constant: 3.8
• Dielectric Strength: 1.57E7 to 1.77E7
• Features: Electronics / Semiconductors, Electrical Power / HV
• Material Form: Adhesive, Gap Filling Sealant / Gasket, Grease / Gel, Polymer (Plastic / Elastomer), Powder / Grain, Varnish / Impregnating Resin

Description: chemical resistance, and of ceramic and stainless steel for high temperature version. Materials with low or high dielectric constants can be accurately detected. The unique Active Shield suppresses interference from material buildup or long installation nozzles. The unique modular

• Built in alarm indicator: Yes
• Can handle liquids with suspended solids (slurries): Yes
• Device Classification: Sensor-Only
• Instrument Display Options: Digital Readouts

Description: applicable for heavy solids applications where abrasive materials occur as in the mining industry. The fully potted electronics are unaffected by condensation, dust or vibration. Wetted parts are made of stainless steel with a PFA shield for high chemical resistance, and of ceramic and

• Built in alarm indicator: Yes
• Can handle liquids with suspended solids (slurries): Yes
• Device Classification: Sensor-Only
• Instrument Display Options: Analog Meter or Indicator

Description: ceramic powder. Common applications for plasma spray include thermal barrier coatings, abradable coatings, corrosion resistant coatings, and wear coatings.

• Material Form: Composite, Tape

Description: utilization of this technology can facilitate the spraying of almost any ceramic, cermet or metal onto a wide variety of materials with exceptional bond strength. Plasma spray is the only method used to produce pure ceramic coatings from ceramic powder. Common

• Material Form: Composite, Tape

Description: These materials are partially filled dielectrics which contain a high Dk ceramic powder. The thicknesses available include 12 and 8um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated

• Electrical Resistivity: 1.20E13 to 1.90E13 ohm-cm
• Features: Dielectric / Insulating
• Thickness: 3.15E-4 to 4.72E-4 inches

Description: -resistance industries. Powders are manufactured using several different techniques, including agglomeration, sintering, fusion and plasma densification. Customers parts have longer life, operate at higher temperatures, produce lower emission, yield high dielectric strength and are

• Material Type: Ceramic, Titania / Titanate
• Particle Size: 10 to 63 µm
• Thermal Spray Technology: Flame Spray - Powder

Description: -resistance industries. Powders are manufactured using several different techniques, including agglomeration, sintering, fusion and plasma densification. Customers parts have longer life, operate at higher temperatures, produce lower emission, yield high dielectric strength and are

• Material Type: Ceramic, Zirconia
• Particle Size: 10 to 45 µm
• Thermal Spray Technology: Flame Spray - Powder

Description: -resistance industries. Powders are manufactured using several different techniques, including agglomeration, sintering, fusion and plasma densification. Customers parts have longer life, operate at higher temperatures, produce lower emission, yield high dielectric strength and are

• Material Type: Ceramic, Alumina
• Particle Size: 20 to 45 µm
• Thermal Spray Technology: Flame Spray - Powder

Description: -resistance industries. Powders are manufactured using several different techniques, including agglomeration, sintering, fusion and plasma densification. Customers parts have longer life, operate at higher temperatures, produce lower emission, yield high dielectric strength and are

• Material Type: Ceramic, Specialty / Other
• Particle Size: 15 to 45 µm
• Thermal Spray Technology: Flame Spray - Powder

Description: , and carbonization for products such as ceramic powders, shaped ceramics, carbon materials, and battery materials. Through our decades of furnace design experience, our team understands the many challenges associated with conventional heating. In some applications, it can be

• Application: Drying, Firing / Sintering, Other
• Heat Source / Transfer: RF / Microwave / Dielectric
• Process Temperature: 600 to 1800 C

Description: Boron Nitride is a high-tech synthetic ceramic substance that comes in powder and solid forms. It has exceptional temperature resistance, dielectric strength and thermal conductivity. Boron nitride is an easily machinable material due to its varied characteristics. To obtain

• Material Type: Boron Nitride

Description: Boron Nitride is a cutting-edge synthetic ceramic material that is available in both solid and powder form. Boron nitride is a genuinely exceptional material due to its unique features, which range from high heat capacity and excellent thermal conductivity to easy machinability,

• Material Type: Boron Nitride

Description: Every Harper rotary tube furnace is designed for the customer’s unique specifications. We bring innovative solutions to designs for continuous processing of advanced materials such as granular, powder, or particulate aggregates in high purity and specialty atmosphere environments at

• Application: Drying, Other
• Atmosphere: Air / Oxidizing, Other
• Heat Source / Transfer: Combustion, Electric / Resistance, RF / Microwave / Dielectric
• Process Temperature: 3000 C

Description: Boron Nitride is a cutting-edge synthetic ceramic material that is available in both solid and powder form. Boron nitride is a genuinely exceptional material due to its unique features, which range from high heat capacity and excellent thermal conductivity to easy machinability,

• Material Type: Boron Nitride
• Shape / Form: Tube / Sheath - Immersion (Closed End)

Description: As one of the key passive components, multilayer ceramic capacitors (MLCC) temporarily charge and remove noise in electronic circuits. They are the most general capacitors available today. The main body has a structure in which dielectric layers and nickel electrode layers are

• Capacitance Range: 2.00E-7 to 220 microF
• Capacitance Type: Fixed
• Configuration / Form Factor: Surface Mount / Chip Capacitor
• DC Rated Voltage Range (WVDC): 4 to 50 volts

Description: markets. Meeting the demands of such a diverse group of industries requires an equally diverse range of coatings and technologies. DFI offers a full range of high technology coating services, including anodize, hard coat, hard coat Teflon impregnation, powder coating, chromate and other

• Additional Services / Processes: Recoating / Refinishing
• Cleaning / Parts Washing: Burn-off / Thermal Cleaning, Degreasing, Pressure / Spray Washing, Scrub Tank / Immersion Washing, Stripping / Coating Removal
• Coating Process: Chemical Finish / Conversion, Phosphate Coating, Powder Coating, Spray Coating, Thin Film Coating
• Finishing / Surface Treatment: Abrasive / Blasting, Buffing / Polishing, Deburring / Deflashing, Mass Finishing (Tumbling / Vibratory), Mirror Finishing, Passivation, Peening, Pickling / Chemical Deburring, Sanding / Grinding

Description: materials Additive for film for anti-blocking, dielectric strength improvement, and gas barrier Additives for plastics to increase hardness and dimensional stability Matte Finish for coatings Binder for ceramics and inorganic coating material

• Diameter: 0.0030 to 0.0200 mm
• Features: Odorless
• Material: Silica / Quartz / Glass
• Type: Powder / Granule

Description: materials Additive for film for anti-blocking, dielectric strength improvement, and gas barrier Additives for plastics to increase hardness and dimensional stability Matte Finish for coatings Binder for ceramics and inorganic coating material

• Applications: Coatings / Paint, Plastics / Composites, Other
• Form: Powder
• Function: Catalyst

Description: Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide

• Applications: Refractory / High Temperature Materials
• Material Type: Specialty Ceramic