Proven performance

Optimized dry screw pump for harsh semiconductor and solar etch, CVD, and ALD processes. High internal gas temperature minimizes condensation in the pump. Excellent for powder handling. Optional Tantal coating for pumping corrosive gases. Deep ultimate and over 3,000 m³/h peak pumping speed are ideal for processes with high gas flow.

Efficient

Low cost of ownership, minimal maintenance, long service intervals, high uptime, high hydrogen throughput, low energy consumption, variable temperature control.

Compact 

Canned water-cooled motors and a direct-mounted booster enable a small footprint and low overall height for the DS 3161.