KMSF^® 2000 is a negative?tone, low?temperature?cure PPE?copolymer photo?dielectric designed for high?reliability heterogeneous integration in advanced packaging. It features excellent pattern resolution, a low dielectric constant (Dk = 2.5), and a low dissipation factor (Df = 0.003), making it ideal for high?frequency applications requiring superior signal integrity.

Engineered for consistent performance, KMSF^® 2000 supports an optimal cured film thickness of 5–10 μm, providing versatility and stability for next?generation electronic packaging solutions.

Key Features: 

• Negative tone, photoimageable dielectric
• 5 to 10 µm film thickness after cure
• Solvent-developable in PGMEA
• i-Line/broadband sensitivity, 1:1 aspect ratio imaging
• Low temperature cure ≤ 200°C
• Low Dk/Df electrical properties
• Low moisture uptake
• Good thermal and chemical stability

Material Uses:

• Redistribution layer (RDL) dielectric
• Passivation layer
• Interlayer dielectric (ILD)
• Wafer-level packaging (WLP) dielectric
• Protective dielectric layer