MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release of MacuSpec VF-TH 300, a new addition to the award-winning VF-TH series electroplating processes widely utilized in mSAP HDI manufacturing. 

As the 5G standard is growing outward from the highest tier smartphones, board manufacturers of these devices need to increase high density layers beyond the capability of regular HDI and into the realm of more difficult to build modified Semi Additive Processing (mSAP). The MacuSpec VF-TH 300 is a single step pattern plating process for the simultaneous copper filling of blind microvias and plating of through holes while providing controlled trace profiles in mSAP applications. The innovative process deposits an electrolytic copper layer that is naturally resistant to a phenomenon called V-pitting which can occur during the final etching process. V-Pits are a reliability concern that are currently addressed with an annealing process that involves baking the boards after plating for several hours. With the VF-TH 300, customers can now utilize a shortened bake or skip the bake entirely and achieve V-pit free results, improving quality and increasing production throughputs. The process does not require a predip or flash plate and is completely analyzable by CVS for ease of process control.

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