Next-Generation High-Speed, Copper Plating Process
Featured Product from MacDermid Alpha Electronics Solutions
Semiconductor fabricators are looking for solutions that deliver high performance and enhanced reliability for advanced packages. MacDermid Alpha's MICROFAB SC-40 PLUS next-generation acid copper electroplating process represents a leap forward in semiconductor manufacturing, providing fabricators with a transformative solution that combines precision, efficiency, and ease of use.
With high-speed plating capabilities of up to 2.5 µm/min, MICROFAB SC-40 PLUS delivers a high purity deposit with exceptional within-wafer, within-die and within-feature uniformity and a flat bump profile. The versatile chemistry is suitable for bump, pillar and RDL metallization and is compatible with and without a nickel barrier process for Kirkendall void free stacks.
KEY FEATURES
- High purity KV-free deposit with cutting edge uniformity
- Versatile chemistry for different AR Pillar and L/S of RDL
- ESG Compliant - methonal free
- High-speed plating
