Product Announcements:
Industrial Computers and Embedded Systems

CT-3238: 8-channel analog input /0&4-20mA/15-bit single-terminal Read more...

ODOT new input isolation module: Easily avoids common-mode interference Read more...

The module supports up to 32 IO modules extension, the maximum input of process data is 1024 bytes and the maximum output is 1024 bytes, flexible selection of IO modules to be paired with adapter Read more...

The module supports up to 32 IO modules extension, the maximum input of process data is 1024 bytes, and the maximum output is 1024 bytes, flexible selection of IO modules to be paired with adapter Read more...

◼ The module supports 16 channels digital input, supports low level input, and it can connect to the NPN sensor. ◼ The module could collect the digital output signal of field equipment (dry contact or active output). ◼ The module could be connected to 2-wire or 3-wire digital sensor. Read more...

RTD Temperature Acquisition Module, 3 Channels PT1000 Read more...

BECOM Electronics GmbH's ADSP-BF609 embedded module features dual-core 500MHz processors and 256KB RAM, designed for real-time control, industrial automation, and advanced image/audio processing applications. Read more...

Advancing Space Exploration with Cutting-Edge Connectivity Solutions

For decades, Smiths Interconnect has been a trusted name in space exploration—delivering high-performance connectivity solutions that power a wide range of missions. From deep space communication to ensuring equipment reliability in the harshest environments, Smiths Interconnect’s components ar... Read more...

Powering the Future: The Role of Electrical Architecture in the Shift to Electrification

When working on high-voltage DC power transmission projects, most engineers focus on sizing batteries and cables correctly. However, the surprising reality is that connectors often represent the key link in the system.

Why? At the core of every connector lies its contact technology, whi... Read more...

Mezzanine & Backplane Connectors: Securing High-Density Board Links

The densification of electronic boards is pushing mechanical architectures to their limits. With FPGAs and processors demanding ever more I/O and higher speeds, internal connectors (Mezzanine and Backplane) have become the focal point of critical reliability challenges.

For the system architect, the equ... Read more...