Master Bond, Inc.

Master Bond LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity. Read more...

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ELANTAS PDG, Inc.

This webinar will outline the different stresses and conditions of the newest motor designs, and how material and process selection can optimize performance. Read more...

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ELANTAS PDG, Inc.

Learn how ELANTAS low modulus materials can help improve reliability of embedded components by reducing internal and external stress generated on components. ELANTAS has also developed and patented its innovative Conashield™ "flood coat" technology which can provide ruggedization, weight reduction, and reliability improvements compared to traditional potting. Read more...

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Ellsworth Adhesives

CoolTherm® SC-1200 thermally conductive silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones. Read more...

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DuPont Electronics & Imaging

DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications for over 35 years with a proven record of consistency and dependability. Read more...

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Arnold Magnetic Technologies

ENCAPSULATED MAGNETS

WRAPTITE CARBON FIBER ENCAPSULATION

Arnold Magnetic Technologies offers composite and metallic encapsulation solutions for a wide range of permanent magnet systems and applications.

While metallic sleeved magnet containment solutions are used extensively for magnet containment, Wraptite composite sleeves offer a superior design alternative... Read more...

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Ellsworth Adhesives

As electronic devices become smaller, stronger and faster, the need for greater thermal management (heat dissipation and control) within these devices has increased exponentially. Read more...

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Master Bond, Inc.

Free flowing EP4EN-80 is suitable for bonding, small potting and encapsulations up to about a ¼ inch thick in some applications. Read more...

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MacDermid Alpha Electronics Solutions

ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low Coefficient of Thermal Expansion. Read more...

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Techsil Limited

RTV27844 is a low viscosity, easily pourable silicone potting compound with the capability of remaining flexible at low temperatures and is used for the protection of electronic components and assemblies against shock, vibration, moisture, ozone, dust, chemicals, and other environmental hazards. For applications such as potting solar cells for maximum light transmission and electronic as... Read more...

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