ELANTAS PDG, Inc.

asting and potting resins for light and heavy electrical applications
CONAP®, ELAN-Cast®, and ELAN-Tron® resins from ELANTAS PDG, Inc. guarantee optimum protection of electrical machines operating in challenging environments and offer a broad spectrum of mechanical, electrical, and self-extinguishing properties. Read more...

More Product Announcements from ELANTAS PDG, Inc.
Ellsworth Adhesives

Ellsworth Adhesives offers low pressure molding services that combine the superior performance of Henkel TECHNOMELT® thermoplastics with the versatility of Mold-Man® Machines. Read more...

More Product Announcements from Ellsworth Adhesives
MacDermid Alpha Electronics Solutions

ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low Coefficient of Thermal Expansion. Read more...

More Product Announcements from MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions

MacDermid Alpha Electronics Solutions announces the launch of ALPHA HiTech AD13-9910B ultra-low temperature adhesive, designed to mitigate defects on very temperature sensitive parts and substrates. Read more...

More Product Announcements from MacDermid Alpha Electronics Solutions
ELANTAS PDG, Inc.

Casting and Potting materials with lower thermal conductivity are used for applications where thermal management is not paramount, e.g. Read more...

More Product Announcements from ELANTAS PDG, Inc.
ELANTAS PDG, Inc.

Learn how ELANTAS low modulus materials can help improve reliability of embedded components by reducing internal and external stress generated on components. ELANTAS has also developed and patented its innovative Conashield™ "flood coat" technology which can provide ruggedization, weight reduction, and reliability improvements compared to traditional potting. Read more...

More Product Announcements from ELANTAS PDG, Inc.
Master Bond, Inc.

Supreme 3DM-85 is a thixotropic paste material formulated to serve as the damming compound in dam-and-fill encapsulation applications. Read more...

More Product Announcements from Master Bond, Inc.
CHT USA Inc.

Silicone gels are used in numerous electronic applications when a soft and highly flexible encapsulation or potting is required. CHT’s silicone gels protect delicate components and assemblies from vibration, thermal and mechanical shock, as well as guard against moisture corrosion and other harsh environmental factors. Read more...

More Product Announcements from CHT USA Inc.
Ellsworth Adhesives

CoolTherm® SC-1200 thermally conductive silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones. Read more...

More Product Announcements from Ellsworth Adhesives
ELANTAS PDG, Inc.

Potting compounds seal and protect electrical components from various stresses, chemical exposure, moisture and other environmental elements that can damage or shorten the lifespan of the device. The potting compounds themselves are polymeric and cast from a liquid state to fill around the electrical component. The challenge lies in choosing the proper potting compound chemistry. Read more...

More Product Announcements from ELANTAS PDG, Inc.