MacDermid Alpha Electronics Solutions

MacDermid Alpha Electronics Solutions announces the launch of ALPHA HiTech AD13-9910B ultra-low temperature adhesive, designed to mitigate defects on very temperature sensitive parts and substrates. Read more...

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Master Bond, Inc.

Master Bond EP36FR is a one component, B-staged epoxy for potting, encapsulation, coating and bonding. It meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. Read more...

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Master Bond, Inc.

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. Read more...

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Ellsworth Adhesives

CoolTherm® SC-1200 thermally conductive silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones. Read more...

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CHT USA Inc.

CHT's liquid silicone foam is designed to reduce weight – as well as mitigate thermal runaway and provide protection from moisture, debris, vibration and shock for electronic components and EV battery packs. Read more...

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ELANTAS PDG, Inc.

Learn how ELANTAS low modulus materials can help improve reliability of embedded components by reducing internal and external stress generated on components. ELANTAS has also developed and patented its innovative Conashield™ "flood coat" technology which can provide ruggedization, weight reduction, and reliability improvements compared to traditional potting. Read more...

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Master Bond, Inc.

Master Bond LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity. Read more...

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Arnold Magnetic Technologies

ENCAPSULATED MAGNETS

WRAPTITE CARBON FIBER ENCAPSULATION

Arnold Magnetic Technologies offers composite and metallic encapsulation solutions for a wide range of permanent magnet systems and applications.

While metallic sleeved magnet containment solutions are used extensively for magnet containment, Wraptite composite sleeves offer a superior design alternative... Read more...

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Master Bond, Inc.

Free flowing EP4EN-80 is suitable for bonding, small potting and encapsulations up to about a ¼ inch thick in some applications. Read more...

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MacDermid Alpha Electronics Solutions

ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low Coefficient of Thermal Expansion. Read more...

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