Military / Government (MIL-SPEC / GG) Insulating Varnishes and Impregnating Resins
from Hernon Manufacturing, Inc.
Porosity Sealant (HPS) 38374R is the solution to leak proof parts, improving machinability, in addition to increasing the durability and surface quality for painting and plating. The required addition of HPS Initiator activates the dual-cure system enabling the system to cure anaerobically at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic
- Form / Shape: 4 gal
- Cure / Technology: Thermoset
from Master Bond, Inc.
Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; OEM or Industrial; Photonics; Semiconductors, IC's; Tooling
- Form / Shape: Liquid
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
- Chemical System: Epoxy
from ELANTAS North America LLC
Water-borne epoxy emulsion - dip-and-bake impregnating resin [See More]
- Industry: Aerospace; Automotive; Electric Power; Marine; Military; OEM or Industrial
- Form / Shape: Liquid
- Substrate Compatibility: Metal; Paper or Paperboard; Plastic
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Porosity Sealant (HPS) 59801 is a low viscosity liquid sealant designed for sealing interfacial leak paths in flexible electronic assemblies. It may also be used to enhance dielectric strength or seal porosity in passive materials. The dual-cure system incorporated in HPS 59801 offers the advantage... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset
- Form / Shape: 1 gal
from Master Bond, Inc.
Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; OEM or Industrial; Photonics; Semiconductors, IC's; Tooling
- Form / Shape: Liquid
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Porosity Sealant (HPS) 990 is the solution to leak proof parts, improving machinability, in addition to increasing the durability and surface quality for painting and plating. HPS 990 is also excellent for sealing leak paths in rigid electronic assemblies. The hardened resins exhibit superior... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset
- Form / Shape: 4 gal
from Master Bond, Inc.
Master Bond Polymer System UV19 is a newly developed UV curable, low viscosity optically clear compound specifically designed for high performance laminating, sealing, bonding and coating. This remarkable acrylic based polymer composition can effectively replace conventional heat and/or solvent... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; OEM or Industrial; Photonics; Semiconductors, IC's; Tooling
- Form / Shape: Liquid
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
- Chemical System: Elastomeric
from Hernon Manufacturing, Inc.
Porosity Sealant (HPS) 991 is the solution to leak proof parts, improving machinability, in addition to increasing the durability and surface quality for painting and plating. The required addition of HPS Initiator 91 activates HPS 991R enabling the system to cure at elevated temperatures (HPS 991). [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic
- Form / Shape: 1 gal
- Cure / Technology: Thermoset
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; OEM or Industrial; Photonics; Semiconductors, IC's; Tooling
- Form / Shape: Liquid
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
- Cure / Technology: Thermoset; UV or Radiation Cured
from Hernon Manufacturing, Inc.
Porosity Sealant (HPS) 994 is the solution to leak proof parts, improving machinability, in addition to increasing the durability and surface quality for painting and plating. The hardened resins exhibit superior chemical resistance and higher temperature stability. The microscopic voids, where... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic
- Form / Shape: HPS POROSITY SEALANT 994M W/O ACTIVATOR 50 GAL
- Cure / Technology: Thermoset
from Master Bond, Inc.
Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration and shock. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Photonics; Semiconductors, IC's
- Form / Shape: Liquid
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Formulations - Applications - Impregnation - HPS Accelerator 28 [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Form / Shape: 4 oz