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Supplier: Global American, Inc.
Description: The PMCAE-G next generation mobile Micro ATX motherboard with the latest Intel mobile technology 945GME Express chipset, which supports Intel Core Duo / Core Solo processors. The 2801590 supports up to 667 MHz Front Side Bus for up to a 25% increase in Front Side Bus bandwidth
- Max Speed: 0.533 to 0.667 GHz
- Memory Capacity: 3 GB
- ISA Slots: 1
- PCI Slots: 2
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Supplier: Global American, Inc.
Description: 2807631 the next generation mobile Mini-ITX motherboard with the latest Intel mobile technology 945GME Express chipset, which supports Intel Core Duo / Core Solo processors. The 2807631 supports up to 667 MHz Front Side Bus for up to a 25% increase in Front Side Bus bandwidth
- Max Speed: 0.533 to 0.667 GHz
- Memory Capacity: 4 GB
- PCI Slots: 1
- LAN / Networking: 2
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Supplier: Global American, Inc.
Description: 2801450 the next generation mobile Mini-ITX motherboard with the latest Intel mobile technology 945GME Express chipset, which supports Intel Core Duo / Core Solo processors. The 2801450 supports up to 667 MHz Front Side Bus for up to a 25% increase in Front Side Bus bandwidth
- Max Speed: 0.533 to 0.667 GHz
- Memory Capacity: 3 GB
- LAN / Networking: 1
- SATA: 2
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Supplier: Global American, Inc.
Description: 2807633 the next generation mobile Mini-ITX motherboard with the latest Intel mobile technology 945GME Express chipset, which supports Intel Core Duo / Core Solo processors. The 2807633 supports up to 667 MHz Front Side Bus for up to a 25% increase in Front Side Bus bandwidth
- Max Speed: 0.533 to 0.667 GHz
- Memory Capacity: 2 GB
- PCI Slots: 1
- LAN / Networking: 3
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Supplier: Microchip Technology, Inc.
Description: Conditions: 3V to 3.6V, -40°C to +150°C Core: Dual 16-Bit dsPIC33CH CPUs Master Core 90 MIPS and Slave Core 100 MIPS Operation Independent Peripherals for Master Core and Slave Core Configurable Shared Resources for Master Core and Slave Core Fast
- Pin Count: 80
- Clock Speed: 100 MHz
- MIPS: 100
- Operating Temperature: -40 to 150 C
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Supplier: Microchip Technology, Inc.
Description: to 3.6V, -40ºC to +150ºC, DC to 100 MIPS dsPIC33CK DSC Core Up to 256 KBytes of Program Flash with ECC and Live Update (dual-partition Flash) Up to 24 KBytes of Data SRAM with Memory Built in Self-Test (MBIST) Modified Harvard architecture with 16-bit data and 24-bit instructions Code
- Pin Count: 36
- Clock Speed: 100 MHz
- MIPS: 100
- Operating Temperature: -40 to 150 C
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Description: BSP QNX Neutrino BSP Green Hills INTEGRITY BSP LynuxWorks LynxOS BSP Technical Specs Processor NXP QorIQ T1042 processor with four Power Architecture® e5500 cores at up to 1.4 GHz 256 kB back-side L2 cache (per core) 256 kB platform cache IEEE 754
- RAM: 8,000 MB
- Communication Networks: Ethernet
- Features: Other
- Computer Bus: PMC
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Supplier: Advantech
Description: 18.5" FHD TFT LED LCD Touch Panel Computer with 13th Gen Intel® Core™ Processors and ATEX Explosion-Protected certification Industrial-grade 18.5" FHD TFT LCD with 50K lifetime and LED backlight Intel® Core™ Processors (13th Gen ), i7-1365URE deca-core Built in
- Display Size: 18.5 inch
- Processor: Intel®
- Features: Other
- General Features: Panel Mount, Touch Screen
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Supplier: Infineon Technologies AG
Description: most scalable portfolio of safety microcontroller. In terms of performance, the highest end product TC39x offers 6 cores running at 300 MHz and up to 6.9 MBytes embedded RAM, and consuming below 2 W. Its mirrored embedded flash banks offers A/B swap capabilities. Summary of Features 6
- Internal RAM Size: 6,624 KB
- Number of A/D Converters: 34
- Operating Temperature: -40 to 125 C
- Bits: 32 Bit
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Description: Linux Yocto Board Support Packages (BSPs) are available. Features Supports Intel® Core™ Ultra processors (Series 3) (formerly Panther Lake) Designed with SecureCOTS™ technology to support enhanced security and trusted computing Microchip PolarFire™ SoC FPGA with 256 MB SPI NOR
- RAM: 64,000 MB
- Communication Networks: Ethernet
- Features: Other
- Ports: Serial Ports, USB
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Description: Microsoft Windows drivers and other operating systems Technical Specs Processor Supports Intel® Core™ Ultra processors (Series 3) (formerly Panther Lake) Memory Up to 64 GB of LPDDR5 SDRAM with in-band ECC Up to 512 GB of onboard NVMe storage 64 MB NOR boot flash 64 kB EEPROM
- RAM: 64,000 MB
- Communication Networks: Ethernet
- Features: Other
- Ports: Serial Ports, USB
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Supplier: Radwell International
Description: IC, 8BIT MCU, RISC, 12MHZ, SSOP-48; CORE SIZE:8BIT; NO. OF I/O'S:32; PROGRAM MEMORY SIZE:8KB; RAM MEMORY SIZE:256BYTE; CPU SPEED:12MHZ; OSCILLATOR TYP. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Win Source Electronics
Description: Active Temperature Range - Operating: -40°C to 85°C (TA) Case / Package: 256-LBGA (17x17) Speed(Frequency): 204MHz Supply Voltage - Operating: 2.2 V to 3.6 V Part Core Size: 32-Bit Dual-Core Data RAM Size: 136K x 8
- Clock Speed: 204 MHz
- Internal RAM Size: 512 KB
- Internal ROM Size: 16 KB
- Supply Voltage (Vcc): 2.2 to 3.6 volts
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Supplier: Win Source Electronics
Description: Active Temperature Range - Operating: -40°C to 85°C (TA) Case / Package: 256-LBGA (17x17) Speed(Frequency): 204MHz Supply Voltage - Operating: 2.2 V to 3.6 V Part Core Size: 32-Bit Dual-Core Data RAM Size: 136K x 8
- Clock Speed: 204 MHz
- Internal RAM Size: 512 KB
- Internal ROM Size: 16 KB
- Supply Voltage (Vcc): 2.2 to 3.6 volts
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Supplier: Win Source Electronics
Description: Manufacturer: NXP Win Source Part Number: 206576-LPC1833FET256 Packaging: Tray Core Processor: ARM Cortex-M3 Number of I/O: 80 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Data Converters: A/D 16x10b; D/A 1x10b Categories: Integrated Circuits Status: Active
- Clock Speed: 150 MHz
- Internal RAM Size: 512 KB
- Supply Voltage (Vcc): 2 to 3.6 volts
- Number of I/O Ports: 80
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Description: Core™ Ultra processors (Series 3) (formerly Panther Lake) Designed with SecureCOTS™ technology to support enhanced security and trusted computing Microchip PolarFire™ SoC FPGA with 256 MB SPI NOR flash COM Express® Basic (Type 6) form factor (Revision 3.1 pinout) with
- RAM: 64,000 MB
- Communication Networks: Ethernet
- Features: Other
- Ports: Serial Ports, USB
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Supplier: Win Source Electronics
Description: Manufacturer: NXP Win Source Part Number: 074812-MCF51AC256BCPUE Packaging: Tray Core Processor: Coldfire V1 Number of I/O: 54 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Data Converters: A/D 20x12b Oscillator Type: External Categories: Integrated Circuits Status:
- Clock Speed: 50 MHz
- Internal RAM Size: 256 KB
- Supply Voltage (Vcc): 2.7 to 5.5 volts
- Number of I/O Ports: 54
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Supplier: QUALCOMM, Incorporated
Description: The Qualcomm® Snapdragon™ 600 processor with quad-core CPUs is designed for long battery life, seamless connectivity, fast web browsing and easy adaptability: perfect for high-tier smartphones and advanced embedded applications. Snapdragon 600 Processor Specs Wi-Fi Wi-Fi
- Clock Speed: 1,900 MHz
- Bits: 32 Bit
- Serial Interface: USB
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Supplier: Advanced Micro Devices, Inc.
Description: core performance with "Bulldozer" architecture. New 32 nanometer die shrink designed to reduce leakage for improved efficiency, increased clock rate headroom and better thermals. AMD Turbo CORE Technology AMD FX Processors come equipped with AMD Turbo CORE Technology.2
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Supplier: ELMA Electronic Inc.
Description: Ruggedize your SBC or bundle it in a fully integrated package including mezzanine options and OS integration sold and supported under a single assembly number. Features: 2nd generation Intel® Core™ i7 2.20 GHz (dual-core or quad-core) integrated processor Up to 16GB
- CPU Speed: 2,200 MHz
- RAM: 16,000 MB
- Features: Other
- Computer Bus: VPX
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Supplier: Aitech Defense Systems, Inc.
Description: Rugged/mil 3U VPX Single Slot SBC Core™ i7 at 1.33/2.0/2.53 GHz Processor Rugged/mil 3U VPX Single Slot SBC Core™ i7 with 1.33/2.0/2.53 GHz Processor Two (2) Cores/Four (4) Threads (Intel Hyperthreading Technology) Intel® Virtualization Technology for Directed I/O
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Supplier: HydraForce, Inc.
Description: MHz; Flash ROM: 254 Kbyte; SRAM: 256 Kbyte; EEPROM: 6200 bytes Operating Temperature Range: –40°C to +70°C (–40°F to +158°F) Storage Temperature Range: –50°C to +85°C (–58°F to +185°F) Water Resistance: meets IP67 standards (per IEC 660529) Humidity Tolerance: Relative Humidity > 90% from
- Supply Voltage (DC): 9 to 30 volts
- RAM: 0.254 MB
- Flash Memory (RAM): 0.256 MB
- Features: Anti-Vibration
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Supplier: Microchip Technology, Inc.
Description: The Microchip's ARM-based SAM7X256 is a member of the Microchip SAM7X series of microcontrollers based on the 32-bit ARM7TDMI processor. It operates at a maximum speed of 55 MHz and features 256KB of flash memory and 64KB of SRAM. The peripheral set includes USB 2.0 Full Speed device port ,
- Clock Speed: 55 MHz
- Internal RAM Size: 64 KB
- Internal ROM Size: 256 KB
- Number of Timers: 3
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Supplier: Aitech Defense Systems, Inc.
Description: (Intel® VT-d) Streaming SIMD Extensions 4.2 (Intel® SSE4.2) SSE 4.2 On-chip 32kB Data/32kB Instruction L1 Cache per core 256 k L2 Cache per core 4 MB L3 Cache shared between cores High Performance Graphics Controller Memory Resources Up to 8 GB DDR3 Dual channel SDRAM @
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Supplier: Aitech Defense Systems, Inc.
Description: Directed I/O (Intel VT-d) Streaming SIMD Extensions 4.2 (Intel SSE4.2) SSE 4.2 On-chip32kBData/32kBInstruction L1 Cache per core 256 k L2 Cache per core 4 MB L3 Cache shared between cores High Performance Graphics Controller Memory Resources Up to 4GB DDR3 SDRAM @ 1066MHz
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Supplier: ELMA Electronic Inc.
Description: integrated dual core processor (1.06 GHz ULV or 2.0 GHz LV) Up to 8GB ECC-protected DDR3-800/1066 (soldered) 256KB non-volatile F-RAM Mobile Intel® 5 Series chipset:Ibex Peak-M PCH VGA interface Two on-board Gigabit Ethernet interfaces Two USB 2.0 (front air cooled) Four USB 2.0 ports
- CPU Speed: 1,060 to 2,000 MHz
- RAM: 8,000 MB
- Computer Bus: CompactPCI (cPCI)
- Communication Networks: Ethernet
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Supplier: Lincoln Electric Co. (The)
Description: Top Features Diamond Core Technology - Delivers a forgiving arc MAXTRAC® cast aluminum industrial wire drive - Features dual driven rolls Digital meters - For set up, meters display your preset voltage and wire feed speed. During welding, actual voltage is displayed. Magnum® PRO gun and cable
- Duty Cycle: 40 %
- Output Current Range: 30 to 300 amps
- Output Voltage Range: 26 volts
- Output Power Capability: DC Output
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Supplier: ELMA Electronic Inc.
Description: performance levels per watt. Processing Units One QorIQ processor P2020, 1GHz, e500 v2 core with : o 1 GB of DDR3 with ECC o 256 or 512 MBytes of NOR Flash o Optional NAND Solid-state Disk (eUSB module)
- Features: FPGA
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: Opteron 165 1.8G Dual Core (939pins) 64bits Product overview: OSA256FAA5BL from AMD is an Embedded Microprocessor MPU for edge computing, industrial HMI, embedded Linux systems, communication gateways, and high-performance control platforms. It is useful for engineers and buyers comparing
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Supplier: Advantech
Description: Rackmount Network Appliance with Dual AMD EPYC™ 9004 Processors for Gateway and NGFW. Ideal for high-performance network security. Dual AMD EPYC™ 9004 Processors, up to 256 Cores 16 x DDR5 ECC RDIMM slots Hot-swap 2.5" disk bays and system fan, redundant PSU, 1 x HH/HL
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Supplier: Renesas Electronics Corporation
Description: The ISL23325 is a volatile, low voltage, low noise, low power, 256-Tap, dual digitally controlled potentiometer (DCP) with an Isup2/supC Bus™ interface. It integrates two DCP cores, wiper switches and control logic on a monolithic CMOS integrated circuit.brbr Each digitally controlled
- Operating Temperature: 125 C
- No. of Tap Positions: 256 #
- Current Rating: 0.000003 amps
- Potentiometer Type: Digital Potentiometer
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Supplier: Microchip Technology, Inc.
Description: Pixels Core independent autonomous animation: Alternating dual display, blinking and blanking LCD Charge Pump for contrast management in battery-powered applications External bias option for reducing power consumption Operation in power-saving modes Core and Operating Conditions 2.0V
- Clock Speed: 32 MHz
- Internal RAM Size: 32 KB
- Internal ROM Size: 256 KB
- Number of Timers: 21
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Supplier: Advantech
Description: SQFlash 830 M.2 2280 SATA SSD NGFF M.2 2280 SSD Module Compliant with SATA III and SATA v3.2 standard Supports 120 bit ECC correct per 2K Byte data Quad core processor with stable throughput Preserved pin on M.2 connector for Voltage Stabilizer support from main board GUI management
- Memory Size: 256 GB
- Memory Type: Solid State Drive
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Supplier: Critical Link, LLC
Description: integrated embedded systems. The onboard AM62Px processor provides up to a Quad Core Cortex-A53 microprocessor unit (MPU) at up to 1.4GHz. This MPU can run a rich set of real-time operating systems containing software applications programming interfaces (APIs) expected by modern system
- Capacity: 8,000 MB
- Ports / Buses: I2C, SPI, USB
- Features: Other
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Supplier: Infineon Technologies AG
Description: The XMC4100/4200 series belongs to the XMC4000 family of industrial microcontrollers based on the ARM Cortex-M4 processor core. the XMC4100/4200 series of microcontrollers take advantage of Infineon's decades of experience in microcontroller design, providing an optimized solution to
- Internal RAM Size: 40 KB
- Serial Port Channels: 4
- Pin Count: 45
- Operating Temperature: -40 to 125 C
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Languages and Compilers for Parallel Computing
We added a new hardware target to the FREIA ANR project: a 256 cores proces- sor with a power consumption of 10 W through the use of the ΣC dataflow programming language.
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Proactive power migration to reduce maximum value and spatiotemporal non-uniformity of on-chip temperature distribution in homogeneous many-core processors
We consider a tile-type homogeneous 256 core processor in ITRS predictive 16nm technology (Fig. 1).
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High Performance Computing in Science and Engineering, Garching/Munich 2007
The computational efficiency (physical time steps per CPU-time [s−1], solid line) shows a slight decay below a number of 256 processor cores .
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Layout finishing of a 28nm, 3 billions transistors, multi-core processor
Designing a fully new 256 cores processor is a great challenge for a fabless startup.
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High Performance Computing
The system can support up to 256 processor cores in a slim 2U rack drawer.
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Languages and Compilers for Parallel Computing
Measured execution times for a single time step of the IRK method with K = 4 stage vectors and the PABM method with K = 8 stage vectors on 256 processor cores of the CHiC cluster (left) and the JuRoPA cluster (right).
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High Performance Computing in Science and Engineering '10
Using 256 processor cores , the baseline simula- tion yielded an acceptable turnaround time.
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Morphology–transport relationships for silica monoliths: From physical reconstruction to pore‐scale simulations
The complete simulation of dispersion (for the 90 different values of the average flow velocity, intraskeleton porosity and diffusivity) took $280 h on 256 processor cores .
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Manycore processor networks with monolithic integrated
CMOS photonics
A 256 core processor with a monolithic electro-optical core-to-DRAM shared memory network [8].
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KALRAY and INRIA strengthen their scientific collaboration
…of the nine Inria teams involved in this new strategic partnership will, firstly, allow us to progress on subjects directly linked to programming and the architecture of the MPPA processor, and secondly, thanks to our 256 core processor , offer new computing methods…