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Supplier: SemiProbe
Description: a semiautomatic 300 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules -
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 300 mm
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: SemiProbe
Description: a semiautomatic 100 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases,
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 100 mm
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: SemiProbe
Description: a semiautomatic 200 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases,
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 200 mm
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: SemiProbe
Description: a semiautomatic 150 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases,
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 150 mm
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: PTB Sales, Inc.
Description: Ask for current price. The Brooks FabExpress (FX3000) is a atmospheric bridge system designed to simultaneously handle 200mm and 300mm wafers. The FX3000 is optimized with the Brooks Reliance robotics automation component set (robot and aligner) and
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Supplier: Filmetrics, Inc.
Description: -board baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and the option to upgrade to fully robotic wafer handling. The different F60-t instruments are distinguished primarily by thickness and wavelength range.
- Applications: Semiconductor Wafers, CVD / PVD Films
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Mounting / Loading: In-situ / System Mounted
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Supplier: Filmetrics, Inc.
Description: include automatic notch finding, automatic on-board baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and cassette-to-cassette robotic wafer handling. The different F60-c instruments are distinguished primarily
- Applications: Semiconductor Wafers, CVD / PVD Films
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Mounting / Loading: In-situ / System Mounted
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Supplier: PTB Sales, Inc.
Description: Ask for current price. The Brooks Gemini Express 5000 (GX5000) is a vacuum cluster tool integration platform for 200mm to 300mm wafers, with the capability for two load locks and three process facets. The GX5000 handles wafers without mechanical changes, and
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Supplier: TSI Incorporated
Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 10 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards.
- Applications: Semiconductor Wafers, CVD / PVD Films
- Form Factor: Other
- Maximum Wafer / Part Size: 200 to 300 mm
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: TSI Incorporated
Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 20 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards.
- Applications: Semiconductor Wafers, CVD / PVD Films
- Form Factor: Other
- Maximum Wafer / Part Size: 200 to 300 mm
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: 3X Ceramic Parts Company Limited
Description: vacuum ceramic arm are used on the photovaltaic equipment , a left and a right ceramic arm used in conjunction, their funtion is to handling the wafer by air suction and move it . The hole and air slot on the plate was cnc machined , and the top plate and bottom plate combined together
- Compressive / Crushing Strength: 377096 psi
- Density: 3.9 g/cc
- Material Type: Alumina / Aluminum Oxide
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Supplier: Renbrandt, Inc.
Description: mm) These couplings are especially designed for precision instruments. encoder drives. robotics. aircraft equipment. radar. laser. optical/mechanical devices. computers. precision remote controls. UNEQUALED PERFORMANCE. Some of the features are: Zero backlash. Low inertia.
- Bore Diameter: 0.1562 to 0.1850 inch
- Coupling Diameter: 1 inch
- Coupling Type: Wafer / Flexible Disc
- Rated Speed: 5000 rpm
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Supplier: Renbrandt, Inc.
Description: Inch (38.1 mm) These couplings are especially designed for precision instruments. encoder drives. robotics. aircraft equipment. radar. laser. optical/mechanical devices. computers. precision remote controls. UNEQUALED PERFORMANCE. Some of the features are: Zero backlash. Low inertia.
- Bore Diameter: 0.4531 to 0.4687 inch
- Coupling Diameter: 1.5 inch
- Coupling Type: Wafer / Flexible Disc
- Rated Speed: 5000 rpm
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Supplier: Renbrandt, Inc.
Description: OUTER DIAMETER 2 1/2 Inch (63.5 mm) These couplings are especially designed for precision instruments. encoder drives. robotics. aircraft equipment. radar. laser. optical/mechanical devices. computers. precision remote controls. UNEQUALED PERFORMANCE. Some of the features are: Zero
- Bore Diameter: 0.1875 to 0.9375 inch
- Coupling Diameter: 2.5 inch
- Coupling Type: Wafer / Flexible Disc
- Rated Torque: 240 In-lbs
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Supplier: RS Components, Ltd.
Description: . wafer-handling machines Encoder Technology = Incremental Maximum Revolutions = 30000rpm Output Signal Type = Digital Supply Voltage = 4.5 - 5.5 V dc Resolution = 1000 CPR Overall Height = 10.16mm Overall Width = 26.67mm Overall Depth = 11.71mm Minimum Operating
- Diameter or Width: 1.05 inch
- Electrical Output and Interface: Other
- Maximum Mechanical Shaft Speed: 30000 rpm
- Operating Temperature: -40 to 212 F
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Supplier: RS Components, Ltd.
Description: . wafer-handling machines Encoder Technology = Incremental Maximum Revolutions = 30000rpm Output Signal Type = Digital Supply Voltage = 4.5 - 5.5 V dc Resolution = 1024 CPR Overall Height = 10.16mm Overall Width = 26.67mm Overall Depth = 11.71mm Minimum Operating
- Diameter or Width: 1.05 inch
- Electrical Output and Interface: Other
- Maximum Mechanical Shaft Speed: 30000 rpm
- Operating Temperature: -40 to 212 F
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Supplier: RS Components, Ltd.
Description: . wafer-handling machines Encoder Technology = Incremental Output Signal Type = Digital Supply Voltage = 4.5 - 5.5 V dc Resolution = 500 CPR Overall Height = 10.16mm Overall Width = 26.67mm Overall Depth = 11.71mm Minimum Operating Temperature = -40°C Maximum Operating
- Diameter or Width: 1.05 inch
- Electrical Output and Interface: Other
- Operating Temperature: -40 to 212 F
- Resolution (counts per revolution): 500 (counts/revolution)
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Supplier: RS Components, Ltd.
Description: . wafer-handling machines Encoder Technology = Incremental Maximum Revolutions = 30000rpm Output Signal Type = Digital Supply Voltage = 4.5 - 5.5 V dc Resolution = 256 CPR Overall Height = 10.16mm Overall Width = 26.67mm Overall Depth = 11.71mm Minimum Operating
- Diameter or Width: 1.05 inch
- Electrical Output and Interface: Other
- Maximum Mechanical Shaft Speed: 30000 rpm
- Operating Temperature: -40 to 212 F
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More Information Top
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New material deposition technologies for advanced packaging [IC packaging]
Fig. 6 300mm wafer handling robot with dual end effectors .
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Integration / Motion Control
The GB4S Robot System is a high recision 300mm wafer handling robot that offers superior performance for tool automation applications requiring standard payload and throughput requirements.
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Integration / Systems
The GB4S Robot System is a high recision 300mm wafer handling robot that offers superior performance for tool automation applications requiring standard payload and throughput requirements.
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http://dspace.mit.edu/openaccess-disseminate/1721.1/69013
Figure 23 Mating kinematic coupling grooves on the wafer carrying pod (FOUP) enable precise alignment on the load ports of semiconductor processing equipment, so wafer handling robots can precisely access 300 mm silicon wafers.
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X-ray Diffraction
The D8 FABLINE features a robot , handling wafers up to 300 mm diameter as well as it can be equipped with two FOUP ports for routine analytics in quality control.
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Rudolph Announces Wafer Scanner System For Post-Fab Inspection And 3-D Bump Metrology
The Rudolph inspection platform, with 200 mm and 300 mm wafer handling capability, combines fast robots and intelligent scheduling capabilities to maximize handling throughput.
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A bumping process for 12" wafers
In Figure 7 the 300 mm line with wafer loader, reloader and robot handling system is shown.
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Advances in 300 mm wafer level packaging-new concepts of material deposition technologies
Automatic equipment for solder bumping was introduced, a cell concept with robot handling for the processing of wafers up to 300mm and an alignment accuracy of ti- 12,5pm @ 6 sigma.
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Adept Technology Announces New Wafer Handling Robots for Semiconductor Automation Industry
The units are clean room Class 1 robots specifically designed for handling 200 mm and 300 mm wafers .
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Intelligent Robotics and Applications
Wafer handling robots have been used in semiconductors manufacture for both 200 mm and 300 mm wafer widely, because the advantage is outstanding obviously, cleaner, more efficiently, safer and faster.