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Supplier: PTB Sales, Inc.
Description: Ask for current price. The Brooks FabExpress (FX3000) is a atmospheric bridge system designed to simultaneously handle 200mm and 300mm wafers. The FX3000 is optimized with the Brooks Reliance robotics automation component set (robot and aligner) and the Brooks family of Load
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Supplier: SemiProbe
Description: semiautomatic 300 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages,
- Maximum Wafer / Part Size: 300.00000000000006 mm
- Measurements: Electrical Test - Parametric / In-line
- Mounting / Loading: Manual Loading
- Technology: Optical / Imaging System
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Supplier: 3X Ceramic Parts Company Limited
Description: Alumina Ceramic Robot Arm F Type CNC machined The ceramic robot arm provided by our company is mainly divided into clamping type, bearing type and vacuum adsorption type. The sizes are 2 ", 4", 6 ", 8", 12 ", and non-standard sizes can be customized. The F-type left and right vacuum
- Density: 3.8999975386044725 g/cc
- Compressive / Crushing Strength: 377,095.7823287122 psi
- Material Type: Alumina / Aluminum Oxide
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Supplier: TSI Incorporated
Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 20 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic wafer
- Maximum Wafer / Part Size: 200 to 300.00000000000006 mm
- Applications: CVD / PVD Films, Semiconductor Wafers
- Mounting / Loading: Floor Mounted / Stand-alone
- Features: Other
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Supplier: TSI Incorporated
Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 10 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic wafer
- Maximum Wafer / Part Size: 200 to 300.00000000000006 mm
- Applications: CVD / PVD Films, Semiconductor Wafers
- Mounting / Loading: Floor Mounted / Stand-alone
- Features: Other
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Supplier: Renbrandt, Inc.
Description: Inch (38.1 mm) These couplings are especially designed for precision instruments. encoder drives. robotics. aircraft equipment. radar. laser. optical/mechanical devices. computers. precision remote controls. UNEQUALED PERFORMANCE. Some of the features are: Zero backlash. Low inertia. Handles offset
- Bore Diameter: 0.2407 to 0.4531 inch
- Coupling Diameter: 1.5 inch
- Rated Torque: 15.625 In-lbs
- Rated Speed: 5,000 rpm
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Supplier: Renbrandt, Inc.
Description: mm) These couplings are especially designed for precision instruments. encoder drives. robotics. aircraft equipment. radar. laser. optical/mechanical devices. computers. precision remote controls. UNEQUALED PERFORMANCE. Some of the features are: Zero backlash. Low inertia. Handles offset and
- Bore Diameter: 0.1406 to 0.1565 inch
- Coupling Diameter: 1 inch
- Rated Torque: 3.75 In-lbs
- Rated Speed: 5,000 rpm
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Supplier: Filmetrics, Inc.
Description: baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and the option to upgrade to fully robotic wafer handling. The different F60-t instruments are distinguished primarily by thickness and wavelength range. Generally
- Measurements: Area Mapping
- Applications: CVD / PVD Films, Semiconductor Wafers
- Mounting / Loading: In-situ / System Mounted
- Form Factor: Monitor / Instrument
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Supplier: Filmetrics, Inc.
Description: notch finding, automatic on-board baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and cassette-to-cassette robotic wafer handling. The different F60-c instruments are distinguished primarily by thickness and
- Measurements: Area Mapping
- Applications: CVD / PVD Films, Semiconductor Wafers
- Mounting / Loading: In-situ / System Mounted
- Form Factor: Monitor / Instrument
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INSACO Offers Wafer Carriers With or Without Multiple Holes INSACO, Inc has become recognized as a worldwide leader in custom machined ceramic and sapphire parts for the semiconductor industry. Through this experience (read more)
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Hamilton Company is the worldwide leader in the design and manufacture of manual, semi-automated, and robotic products for precision fluid measuring. For over 50 years, Hamilton has been helping customers satisfy end-users' needs by providing high performance fluid handling systems for the (read more)
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New material deposition technologies for advanced packaging [IC packaging]
Fig. 6 300mm wafer handling robot with dual end effectors .
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Integration / Motion Control
The GB4S Robot System is a high recision 300mm wafer handling robot that offers superior performance for tool automation applications requiring standard payload and throughput requirements.
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Integration / Systems
The GB4S Robot System is a high recision 300mm wafer handling robot that offers superior performance for tool automation applications requiring standard payload and throughput requirements.
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http://dspace.mit.edu/openaccess-disseminate/1721.1/69013
Figure 23 Mating kinematic coupling grooves on the wafer carrying pod (FOUP) enable precise alignment on the load ports of semiconductor processing equipment, so wafer handling robots can precisely access 300 mm silicon wafers.
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X-ray Diffraction
The D8 FABLINE features a robot , handling wafers up to 300 mm diameter as well as it can be equipped with two FOUP ports for routine analytics in quality control.
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Rudolph Announces Wafer Scanner System For Post-Fab Inspection And 3-D Bump Metrology
The Rudolph inspection platform, with 200 mm and 300 mm wafer handling capability, combines fast robots and intelligent scheduling capabilities to maximize handling throughput.
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A bumping process for 12" wafers
In Figure 7 the 300 mm line with wafer loader, reloader and robot handling system is shown.
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Advances in 300 mm wafer level packaging-new concepts of material deposition technologies
Automatic equipment for solder bumping was introduced, a cell concept with robot handling for the processing of wafers up to 300mm and an alignment accuracy of ti- 12,5pm @ 6 sigma.
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Adept Technology Announces New Wafer Handling Robots for Semiconductor Automation Industry
The units are clean room Class 1 robots specifically designed for handling 200 mm and 300 mm wafers .
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Intelligent Robotics and Applications
Wafer handling robots have been used in semiconductors manufacture for both 200 mm and 300 mm wafer widely, because the advantage is outstanding obviously, cleaner, more efficiently, safer and faster.