802.11 Chipsets

Description: Single Chip 2x2 802.11a/b/g/n MIMO MAC/BB/Radio The AR6004 chipset is a single chip, small form factor 2x2 IEEE 802.11 a/b/g/n MAC/baseband/radio optimized for low-power mobile applications. AR6004 Specs Wi-Fi Wi-Fi Standards 802.11n 802.11a

• Data Rate: 300000 kbps
• IC Package Type: BGA
• Interface: I²C, USB
• Technology: Wi-Fi / WiMAX / Wi-Mesh

Description: Dual-band 2x2 802.11ax. The QCA6290 is a state-of-the-art 802.11ax client device supporting 2x2 configuration and 802.11 a/b/g/n/ac Wav-2/ax WLAN standards. When paired with an 8x8 MU-MIMO supported access point, it can provide up to 4x increase in user throughput, and up to

• Data Rate: 1.78E6 kbps
• Technology: Wi-Fi / WiMAX / Wi-Mesh

Description: Dual-band 1 x 1 802.11ac + Bluetooth 4.1 The QCA9377-3 is a single-die wireless local area network (WLAN) and Bluetooth combination solution to support 1 × 1 802.11a/b/g/n/ac WLAN standards and Bluetooth 4.1 + HS, designed to deliver superior integration of WLAN/Bluetooth and low

• Data Rate: 433000 kbps
• Interface: I²C, PCI Express
• Technology: Bluetooth, Wi-Fi / WiMAX / Wi-Mesh

Description: Low-Energy Wi-Fi Single-Band 802.11a/b/g/n SoC QCA4002 is an intelligent Wi-Fi platform for the Internet of Things (IoT). This complete networking platform enables customers to add full-featured Wi-Fi to a wide variety of products with minimal development effort and cost. QCA4002

• Data Rate: 10000 kbps
• IC Package Type: QFN
• Interface: I²C, USB
• Technology: Wi-Fi / WiMAX / Wi-Mesh

Description: WiFi Modules (802.11) 802.11bgn with CPU Chipset:Marvel MW300

Description: WiFi Modules (802.11) 17 350 cd/m2 SXGA Panel PC with Intel H81 chipset, Core i5 Quad Core i5-4570S Processor (6M Cache, up to 3.60 GHz), TDP 65W, 2GB RAM*2, support iRIS-2400, black color, PSU ACE-A622A, projective capacitive touch window, R10

Description: WiFi Modules (802.11) 17 350 cd/m2 SXGA Panel PC with Intel H81 chipset, Core i5 Quad Core i5-4570S Processor (6M Cache, up to 3.60 GHz), TDP 65W, 2GB RAM*2, support iRIS-2400, black color, PSU ACE-A622A, resistive touch window, R10

Description: Intelligraphics Inc., the industry leader in providing advanced Wi-Fi software solutions and wireless driver development services, today announced the availability of its high quality and feature rich IGX 802.11ac Wi-Fi 5 SoftAP solution for Windows Embedded Compact 7 (WEC7) and Windows

Description: features with a greatly-reduced impact on the battery life of mobile devices. With World level Regulatory Compliance and full compatibility with the latest industry standards like 802.11d/h regulatory adaptability, Wi-Fi Protected Setup™ via PIN and Push-Button (PBC), Passpoint™ and

Description: The IGX-UACF1-9379b7-BT is a highly integrated Wireless Local Area Network (WLAN) system-on-chip (SOC) for 5GHZ 802.11ac, or 2.4/5GHz 802.11n WLAN applications. Dual-stream spatial multiplexing up to 867Mbps data rate is featured. It is based on the Qualcomm Atheros QCA9379

• Modulation: Other
• Operating Frequency: 2400 to 5845 MHz
• Operating Temperature: 0.0 to 70 C
• Output Power: 11 to 15 dBm

Description: Interfaces: Serial and SPI (master only) USB interface available with a Serial-to-USB adapter 802.11 b/g/n compliant Solutions with WLAN, MAC, baseband and power amplifier WiFi client and AP mode support RTOS & TCP/IP stack support

• Form Factor: Board
• Modem Type: Radio Modem
• Network Media: Wireless

Description: 6th & 7th Gen Intel® Xeon E3/ Core™ i7/i5/i3 LGA1151 uATX with DVI-D/HDMI/DP/eDP/VG A, 6 COM, Dual LAN, SATAIII,12 USB3.0 Supports Intel® Xeon®/ 6th & 7th Gen Core™ i7/i5/i3 processor with Q170/C236/H110 chipset Four DIMM sockets support

• Chipset Type: Intel® Chipset, Other
• Max Speed: 2.3 to 3.6 GHz
• Memory Capacity: 32 GB
• Processor / CPU Type: Other

Description: .2/2.0 (optional) Supports PCIE Gen3, 10 x USB 3.0, 2 USB 2.0, 8 x SATAIII, 1 miniPCIe(mSATA) and dual GbE LAN Supports Intel AMT 11.0 and Intel vPro competent Supports DVI-D,HDMI2.0 ,DP++,eDP,VGAdisplay Four DIMM sockets support up to 64GB DDR4 2133/2400 MHz SDRAM Supports Intel® Xeon®/ 6th

• Chipset Type: Intel® Chipset, Other
• Max Speed: 2.3 to 3.6 GHz
• Memory Capacity: 64 GB
• Processor / CPU Type: Other

Description: IGX-PACAF1-9880a1 is a IEEE 802.11ac wireless adapter that operates in 2.4GHz and 5 GHz bands, available in PCIe mini card form factor. Featuring QCA9880 chipset, the IGX-PACAF1-9880a1 dramatically increases the overall throughput up to 1.3Gbps with 3 x 3 MIMO techniques. Leveraging

• Area Network Type: Wireless Local Area Network (WLAN)
• Data Rate: 1.3 Gbps
• Frequency Band: 5850 MHz
• Modem Type: Radio Modem

Description: AR9590 CHIPSET: (802.11N: PEACOC

• Device Type: Transceiver

Description: AIRETOS® E94 Class - Series H: 802.11 abgn 2T/2R Dual Band Wi-Fi & BT Combo modules. Key Features Dual Band (DB) 2.4Ghz + 5 Ghz wireless connection up to 300Mbps Lowest (best-in-class) power consumption Extended temperature grade version

Description: /s bandwidth (backwards compatible to 1.x) Technical Summary Form Factor Full-mini PCIe (BTO) Chipset Qualcomm-Atheros QCA9880/82/90/92 Standard IEEE 802.11ac

Description: /s bandwidth (backwards compatible to 1.x) Technical Summary Form Factor Half-mini PCIe (BTO) Chipset Qualcomm-Atheros QCA9882/92 Standard IEEE 802.11ac

Description: The IGX-SACF1-9379a3-BT is a single-die Wireless Local Area Network (WLAN) and Bluetooth (BT) combo module. It supports 2×2 MIMO with two spatial streams. It features IEEE 802.11 a/b/g/n/ac WLAN standards and BT v4.2+HS. Based on the Qualcomm QCA9379-3 chipset it enables seamless

• Modulation: Other
• Operating Frequency: 2400 to 5850 MHz
• Output Power: 2 to 4 dBm
• Radio Technique: Frequency-Hopping Spread Spectrum

Description: XWAY WAV300 WI-FI CHIPSET

Description: XWAY WAV300 WI-FI CHIPSET

Description: XWAY WAV300 WI-FI CHIPSET

Description: XWAY WAV300 WI-FI CHIPSET

Description: ENTERPRISE 11AC RADIO CHIPSET

Description: The PD11BI cc Embedded motherboard is designed around the latest Intel Atom 22nm Celeron Quad Core J1900 SoC processor and supports up to 8GB 1333MHz of memory. The Baytrail SoC has low power requirements but has excellent performance including a graphics engine based on the Intel Gen7 HD

• Chipset Type: Intel® Chipset
• LAN / Networking: 2
• Max Speed: 1.33 to 1.6 GHz
• Memory Capacity: 8 GB

Description: 3+3 GE WLAN CHIPSET(11AC)

Description: WLAN CHIPSET SINGLE BAND 11N

Description: 3.5" SBC supports Intel® 11th Gen Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU, VGA, HDMI (or DP), eDP / LVDS, 3 x Intel Gb Ethernet, Audio, 2 x M.2, Touch Screen controller, 4DI / 4DO, 6 x USB, 4 x COM, 1 x Mini PCIe, 1 x SIM, Battery Charger, SMBus LEX SYSTEM

• Chipset Type: Intel® Chipset
• Communication Networks: Ethernet
• I/O Bus Specifications: USB, Other
• Operating Temperature: -40 to 158 F

Description: DirectX11.1, OpenGL4.0, OpenCL1.2, 3 independent display: VGA + LVDS +HDMI/Displayport* Optimized thermal design with fanless solution for wide temperature Flexible design using integrated multiple I/O: MIOe to approach vertical applications & keep domain knowhow 2 Gb

• Cache Memory (L1 & L2): 3000 KB
• Chipset Type: Intel® Chipset
• Features: RJ-45 Connectors?
• Operating Temperature: -40 to 185 F

Description: support up to 8GB Intel Gen 7 DirectX®11.1 support, Dual Independent display: 18/24bit LVDS, VGA, DP/HDMI Flexible design using integrated multiple I/O: MIOe to approach vertical applications & keep domain knowhow Intel GbE support, Rich I/O interface with 2 COM, 1 SATA, 4 USB 2.0,

• CPU Speed: 1830 MHz
• Cache Memory (L1 & L2): 2000 KB
• Chipset Type: Intel® Chipset
• Operating Temperature: 32 to 140 F

Description: 2+2 GE WLAN CHIPSET (11N+11AC)

Description: FANLESS HalfSize ISA SBC with Embedded VIA Mark 533 / 800 MHz Processor - E.O.L - Please ask your sales representative about availability of potential stock quantities.

• CPU Speed: 533 to 800 MHz
• Chipset Type: VIA Chipset
• CompactFlashTM: Yes
• Features: Real Clock Timer?

Description: The FSB-960H adopts Intelfs dual-core processor at current speeds up to 3GHz with FSB 1333MHz to meet a wide range of performance requirements. In a PICMG 1.3 SHB Express form factor the FSB-960H system host board takes full advantage of the Intel Q35 Express chipset for enhanced system

• Chipset Type: Intel® Chipset
• Features: Watchdog Timer?, RJ-45 Connectors?
• Operating Temperature: 32 to 140 F
• Ports: Serial Ports, Parallel Ports, USB

Description: 2.5" SBC supports Intel® 11th Gen Tiger Lake-UP3 i7 / i5 / i3, Celeron CPU, HDMI, eDP, 4 x Intel Gb Ethernet, 2 x M.2, 1 x Nano SIM, 4DI / 4DO, 3 x USB 3.0, 6 x USB 2.0, 2 x COM, SMBus LEX SYSTEM 2I110D is the 2.5" SBC with 11th Gen Intel® Tiger Lake-UP3 i7/i5/i3/Celeron

• Chipset Type: Intel® Chipset
• Communication Networks: Ethernet
• I/O Bus Specifications: USB, Other
• Operating Temperature: -40 to 158 F

Description: 2.5" Embedded SBC supports Intel® 11th Gen Tiger Lake-UP3 i7 / i5 / i3, Celeron CPU, 4 x HDMI, 3 x Intel 2.5Gb Ethernet, 2 x M.2, 1 x Nano SIM, 4DI / 4DO, 2 x USB 3.0, 4 x USB 2.0, 2 x COM, SMBus LEX SYSTEM 2I110AW is powered by 11th Gen Intel® Core™ i7i5/i3 Processors

• Chipset Type: Intel® Chipset
• Communication Networks: Ethernet
• I/O Bus Specifications: USB, Other
• Ports: Serial Ports, USB

Description: Panel PCs ATEX Anti-Explosive Certified Robust DIN-rail Fanless Embedded System with Intel Atom Processor Z510PT Intel US15WPT Chipset and 6 Isolation COM

Description: 3.5” SBC with the 11th Gen Intel® Core™ and Intel® Celeron® (formerly Tiger Lake UP3) Processors

• CPU Speed: 4400 MHz
• Cache Memory (L1 & L2): 12000 KB
• Chipset Type: Intel® Chipset, Other
• Communication Networks: Ethernet