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Supplier: TE Connectivity
Description: Options : Back EMF Suppression Contact Features Contact Material : Silver Cadmium Oxide Terminal Plating : Tin-Lead Electrical Characteristics Coil Resistance (OHM
- Coil Resistance: 1600 ohms
- DC Coil Voltage: 48 volts
- Maximum AC Switching Voltage: 200 volts
- Operating Temperature: -94 to 257 F
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Supplier: TE Connectivity
Description: Options : Back EMF Suppression Contact Features Contact Material : Silver Cadmium Oxide Terminal Plating : Tin-Lead Electrical Characteristics Coil Resistance (OHM
- Coil Resistance: 1275 ohms
- DC Coil Voltage: 48 volts
- Maximum AC Switching Voltage: 200 volts
- Operating Temperature: -94 to 257 F
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Supplier: TE Connectivity
Description: & Connection Type : Solder Pins Usage Conditions Environmental Ambient Temperature (Max) : 125 DEGC [257 DEGF ] Operating Temperature Range : -70 - 125 DEGC [-94 - 257 DEGF ]
- Coil Resistance: 400 ohms
- DC Coil Voltage: 28 volts
- Operating Temperature: -94 to 257 F
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Supplier: TE Connectivity
Description: : Solder Hook Terminals Main Termination & Connection Type : Solder Hook Terminals Usage Conditions Environmental Ambient Temperature (Max) : 125 DEGC [257 DEGF ] Operating Temperature Range : -70 - 125 DEGC [-94 - 257 DEGF ]
- AC Coil Voltage: 115 volts
- Maximum AC Switching Voltage: 200 volts
- Operating Temperature: -94 to 257 F
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Supplier: Coilcraft, Inc.
Description: soldering Wide range of standard EIA inductance values Available in two sizes: 4.45 × 3.94 × 3.15 mm and 6.86 × 4.45 × 3.15 mm RoHS-compliant 260°C compatible. Terminations: tin-silver over copper COTS Plus tin-silver-copper and tin-lead terminations
- Applications: RF Inductor / Choke
- Core Material: Air
- Inductance Range: 0.0056 microH
- Inductance Tolerance: 1 to 5 (+/- %)
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Supplier: RS Components, Ltd.
Description: Screwlocking DIN Secure screwlock mechanism preventing accidental disconnection. Cable acceptance 6.0mm maximum. Tin plated contacts with UL94V-2 rated housings Number of Contacts = 8 Gender = Male Mounting Type = Cable Mount Connector Size = Standard Termination Method =
- Gender: Male / Plug
- Geometry: Straight
- Number of Contacts: 8 #
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Supplier: Win Source Electronics
Description: : Bronze Voltage Rating: 125 V Current Rating: 1 A Number of Contacts: 10 Gender: Receptacle Length: 16.6 mm Housing Material: Polyamide Number of Circuits: 10 Orientation: Vertical Contact Plating: Silver, Tin Housing Color: White Contact Resistance: 20 mO
- Current Rating: 1 amps
- Voltage Rating: 125 volts
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Supplier: Win Source Electronics
Description: Connector Type: Receptacle, Female Sockets Termination: Solder Fastening Type: Threaded Contact Material: Copper Tin Voltage Rating: 50VAC, 60VDC Ingress Protection: IP67 - Dust Tight, Waterproof Material Flammability Rating: UL94 HB Orientation: A Standard Package: 1
- Current Rating: 4 amps
- Voltage Rating: 50 to 60 volts
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Supplier: Techsil Limited
Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire,
- Alloy: Tin-Silver (Sn-Ag)
- Approvals / Conformance: ASTM / UNS
- Conductivity: 8.12E10 µS/cm
- Form / Shape: Paste, Powder, Preform, Wire
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Supplier: RS Components, Ltd.
Description: No-clean solder wire (RT15) and activated no-clean solder wire (A11). A11 spools are designed for soldering connectors to all substrates. RT15 spools with fast wetting are suitable for SMD repairs. Wire Diameter = 0.35mm Product Form = Wire Melting Point = +217°C Percent
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 423 F
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Supplier: Indium Corporation
Description: Very popular lead-free solder alloy. Alloy: 96.5Sn 3.0Ag 0.5Cu Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 220ºC Solidus Melting Temperature: 217ºC Pb-Free: Yes
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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, Green, Blue, Gray and Violet. 3 styles manufactured by Keystone. Miniature type test points are made from .010"(.25) dia. Phosphor Bronze with Silver or Matte Tin (read more)
Browse Test Points Datasheets for Keystone Electronics Corp. -
is produced to a 96.5% minimum purity lead level and may contain 1.5-3% Antimony (Sb) and .1-3.5% Tin (Sn) Mars Metal is able to provide you with very specific lead grades such as: Chemical Copper lead Low sulfur Low bismuth Low silver pure (read more)
Browse Ingots and Casting Stock Datasheets for MarsMetal -
to a 96.5% minimum purity lead level and may contain 1.5-3% Antimony (Sb) and .1-3.5% Tin (Sn). Mars Metal is able to provide you with very specific lead grades such as: Chemical Copper lead Low sulfur Low bismuth Low silver pure (read more)
Browse Ingots and Casting Stock Datasheets for MarsMetal -
iron powder or hydride powder, with binder, is applied to the welded parts of ceramics and metals. The solder (pure silver, silver-copper solder or low-temperature solder such as lead, tin and indium) is directly added to the metal parts without sintering, and then it is fired in vacuum at one time (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
packaging of Kovar, carbon steel, stainless steel, tungsten copper and aluminum alloy, and can also meet the energy storage Welding, parallel seam welding, tin soldering and laser sealing welding and other welding methods; -Insulation resistance ≥5000MΩ (500V DC); -Air tightness (read more)
Browse Glass Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Cu 20 µm (0.8 mil) min Solder Mask Green, Red, Blue, Black, White, Yellow Surface Finishes ENIG, HAL Leadfree, Immersion Silver, HASL, ENEPIG (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd.
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HVAC: Equations, Data, and Rules of Thumb, Second Edition > Hydronic (Water) Piping Systems
Pipe: type “L” copper tubing, ASTM B88, Hard DrawnFittings: wrought copper solder joint fittings, ANSI/ASME B16.22Joints: solder joint with 95-5 tin antimony solder, 96-4 tin silver solder, or 94 - 6 tin silver solder , ASTM B32.
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Understanding Solids: The Science of Materials
etals Silver 428 Copper 403 Gold 319 Iron 83.5 Nickel 94 Titanium 22 Alloys Brass 106 Bronze 53 … … 29 wt% Cu, 4 wt% Fe) Lead– tin solder 50 Refractories Alumina 38 … … Porcelain 2 Polymers Nylon 6 ,6 0.25 0 …
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Lead-free Solders: Materials Reliability for Electronics
reflow soldering electromigration 356–8, 365–8 miniaturization 471–2 parameters 223–4 Restriction … … RoHS) 122, 233, 340–1 room-temperature whiskers 325– 6 , 332–3 root grooves 327–8 SAC see tin – silver –copper satellite control processors … … deformation 276, 278–84, 286– 94 thermomigration 427–34, 436 Scheil …
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IC Component Sockets
Non-noble contact plating, 69 silver , 68 solder , 6 9 tin , 69 Overstress failure, 16, 138 Pad, xi, 1, 11, 13, 14, 89, 97 … … mechanical strength, 57 solderability, 58 stress relaxation and creep, 57 Quad flat pack, 94 , 204 Qualification, xii, 17 …
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Effects of Ni addition to high-lead solders on the growth of Cu3Sn and micro voids
[5] I. E. Anderson, and J. L. Harringa, “Suppression of void coalescence in thermal aging of Tin - Silver -Copper-X solder joints,” J Electron Mater, 35, pp. 94 -106, 2006. [ 6 ] F. Gao, T. Takemoto, H. Nishikawa, and A. Komatsu, “Microstructure .
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Minor Fe, Co, and Ni additions to SnAgCu solders for retarding Cu3Sn growth
[ 6 ] I. E. Anderson, and J. L. Harringa, "Suppression of void coalescence in thermal aging of Tin - Silver -Copper-X solder joints," J Electron Mater, 35 , pp. 94 -106, 2006.
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Reliability of Microtechnology
… 100, 103, 109, 111, 112, 176, 189, 192–194 Shear strength, 75, 118, 119, 172 Shear test, 119, 172–174 Short circuit, 79, 91, 116 Silver flake, 76 Simulation, 4– 6 , 66, 78, 112, 127 … … SAC), 53–55, 117, 197 Solder , 4, 9, 11–13, 33 … … 40, 41, 46, 47, 58, 59, 61–65, 67, 71, 76, 78, 85, 87, 94 –96, 100–107, 109 … … 157, 175–176, 179, 198, 199 Thermo-mechanical stress, 37, 58, 71, 100, 120 Tin whisker, 119–121 Transition …
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Modern Electroplating 5th Edition
… acid copper electrodeposition, 40 Erythorbic acid bath, 492–493 Etching procedure: disadvantage of, 229 6 -Ethoxy-2-mercaptobenzothiazole … … noncyanide zinc baths, 288–289 Ethylene oxide (EO) groups: Raman shift, 177 European Union’s End-of-Life Directive, 240 Eutectic alloys: tin -lead alloys composition, 279–280 application, 279–280 Eutectic solder : material properties of, 142 … … of, 161 Eutectic tin– silver , 162 Evans diagram, 434 … … 152 ions, 152 iron electrodeposition, ferrous chloride bath, 312 nickel electroplating, functional applications, 94 solutions, copper electrodeposition …
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States > Minnesota > State > Regulations > Plumbing Board‚ Minnesota > [MNR 4715] 4715 - Plumbing Code
… 50 percent tin and 50 percent lead, 95 percent tin and five percent antimony, or 96 percent tin and four percent silver , conforming to ASTM Standard Specification for soft solder metal B32- 94 , except that 50 percent tin and 50 percent lead … … 76; 28 SR 146; L 2007 c 140 art 4 s 61; art 6 s 15; art …
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Sporadic Degradation in Board Level Drop Reliability - Those Aren't All Kirkendall Voids!
1958 ( 6 ), pp. 1- 7 19. Meyer, R., "Pressure and Vacancy-Flow Effects on the Kirkendall Shift in Silver -Gold Alloys", Phys. Rev. 181 (1969), pp. 1086- 94 21. … and Low S., "Physical and Mechanical Properties of Intermetallic Compounds Commonly Found in Solder Joints", Online Research … Haimovich, J., "Cu-Sn Intermetallic Compound Growth in Hot-Air-Leveled Tin at and below 100°C", AMP …