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Supplier: Coilcraft, Inc.
Description: values Available in two sizes: 4.45 × 3.94 × 3.15 mm and 6.86 × 4.45 × 3.15 mm RoHS-compliant 260°C compatible. Terminations: tin-silver over copper COTS Plus tin-silver-copper and tin-lead terminations available
- Inductance Range: 0.0068 microH
- Inductance Tolerance: 1 to 5 (+/- %)
- DCR: 0.0021 ohms
- SRF: 6,400 MHz
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Supplier: TE Connectivity
Description: Body Features Enclosure Type : Hermetically Sealed Configuration Features Contact Arrangement : 4 Form C 4PDT-CO Contact Features Contact Material : Silver Cadmium Oxide Terminal Plating : Tin-Lead Electrical Characteristics Coil Resistance (OHM) : 400 Coil Voltage Rating (VDC) : 28
- DC Coil Voltage: 28 volts
- Coil Resistance: 400 ohms
- Operating Temperature: -94 to 257 F
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Supplier: TE Connectivity
Description: Material : Silver (Ag) Contact Type : Pin Mating Pin Diameter : .4 MM [.016 INCH ] Outer Contact Plating Material : Tin (Sn) RF Connector Center Contact Plating Material : Silver (Ag) Dimensions Connector Height : 14.4 MM [.567 INCH ] Product Length : 24.3 MM [.957 INCH ]
- Voltage Rating: 60 volts
- Current Rating: 3 amps
- Number of Contacts: 4 #
- Contact Pitch: 3.9877978465891633 mm
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Supplier: TE Connectivity
Description: Thickness : .8 MM [.032 INCH ] Mating Tab Width : 6.3 MM [.248 INCH ] PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : .381 MICM [15 MICIN ] Dimensions Connector Height : 12.8 MM [.504 INCH ] Connector Length : 37.3 MM
- Voltage Rating: 250 volts
- Current Rating: 16 amps
- Operating Temperature: -40 to 120 C
- Number of Contacts: 6
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Supplier: Win Source Electronics
Description: Number of Contacts: 6 Gender: Receptacle Length: 12.3 mm Housing Material: Nylon Number of Circuits: 6 Orientation: Right Angle Contact Plating: Silver, Tin Housing Color: White Contact Resistance: 20 mΩ Number of Pins: 6 Categories: FFC,FPC(FlatFlexible)Connectors
- Voltage Rating: 125 volts
- Current Rating: 1 amps
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Supplier: Win Source Electronics
Description: Number of Contacts: 20 Gender: Receptacle Length: 26.3 mm Housing Material: Nylon Number of Circuits: 20 Orientation: Right Angle Contact Plating: Silver, Tin Housing Color: Natural Contact Resistance: 20 mΩ Material: Nylon, Polyamide Number of Pins: 20 Categories:
- Voltage Rating: 125 volts
- Current Rating: 1 amps
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Supplier: Win Source Electronics
Description: Number of Contacts: 12 Gender: Receptacle Length: 18.6 mm Housing Material: Nylon Number of Circuits: 12 Orientation: Vertical Contact Plating: Silver, Tin Housing Color: White Contact Resistance: 20 mΩ Material: Nylon, Polyamide Categories: FFC,FPC(FlatFlexible)Connectors
- Voltage Rating: 125 volts
- Current Rating: 1 amps
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Supplier: RS Components, Ltd.
Description: SOLDER SN96.5 AG3 CU0.5 10/10 100G
- Diameter / Thickness: 0.0393701 inch
- Features: Other, Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
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Supplier: Indium Corporation
Description: A low temperature lead-free alloy that is more malleable than BiSn. Alloy: 57Bi 42Sn 1.0Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 140ºC Solidus Melting Temperature: 139ºC Pb-Free: Yes
- Diameter / Thickness: 0.002 inch
- Solder Alloy: Lead Free, Tin-Silver (Sn-Ag)
- Features: Strip / Sheet / Foil
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Supplier: Indium Corporation
Description: This alloy has excellent thermal fatigue properties. Good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC Eutectic Pb-Free: Yes
- Diameter / Thickness: 0.03 inch
- Features: Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
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Supplier: Techsil Limited
Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Features: Flux Cored Wire, Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip,
- Melting Range: 430 F
- Conductivity: 81,200,000,000 µS/cm
- Approvals / Conformance: ASTM / UNS
- Product Form: Paste, Powder, Preform
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Supplier: Techsil Limited
Description: MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Features: Flux Cored Wire, Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
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Supplier: Indium Corporation
Description: InTEGRATED® Solder Preforms are joined in a matrix by fine, precise strands of solder which, during the soldering process, melt and flow to adjacent pads to give you complete preform separation. Applications InTEGRATED® Solder Preforms save assembly time and labor costs by
- Solder Alloy: Indium (In), Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
- Product Form: Preform
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, Green, Blue, Gray and Violet. 3 styles manufactured by Keystone. Miniature type test points are made from .010"(.25) dia. Phosphor Bronze with Silver or Matte Tin (read more)
Browse Test Points Datasheets for Keystone Electronics Corp. -
is produced to a 96.5% minimum purity lead level and may contain 1.5-3% Antimony (Sb) and .1-3.5% Tin (Sn) Mars Metal is able to provide you with very specific lead grades such as: Chemical Copper lead Low sulfur Low bismuth Low silver pure (read more)
Browse Ingots and Casting Stock Datasheets for MarsMetal -
to a 96.5% minimum purity lead level and may contain 1.5-3% Antimony (Sb) and .1-3.5% Tin (Sn). Mars Metal is able to provide you with very specific lead grades such as: Chemical Copper lead Low sulfur Low bismuth Low silver pure (read more)
Browse Ingots and Casting Stock Datasheets for MarsMetal -
iron powder or hydride powder, with binder, is applied to the welded parts of ceramics and metals. The solder (pure silver, silver-copper solder or low-temperature solder such as lead, tin and indium) is directly added to the metal parts without sintering, and then it is fired in vacuum at one time (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Cu 20 µm (0.8 mil) min Solder Mask Green, Red, Blue, Black, White, Yellow Surface Finishes ENIG, HAL Leadfree, Immersion Silver, HASL, ENEPIG (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd.
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HVAC: Equations, Data, and Rules of Thumb, Second Edition > Hydronic (Water) Piping Systems
Pipe: type “L” copper tubing, ASTM B88, Hard DrawnFittings: wrought copper solder joint fittings, ANSI/ASME B16.22Joints: solder joint with 95-5 tin antimony solder, 96-4 tin silver solder, or 94 - 6 tin silver solder , ASTM B32.
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Understanding Solids: The Science of Materials
etals Silver 428 Copper 403 Gold 319 Iron 83.5 Nickel 94 Titanium 22 Alloys Brass 106 Bronze 53 … … 29 wt% Cu, 4 wt% Fe) Lead– tin solder 50 Refractories Alumina 38 … … Porcelain 2 Polymers Nylon 6 ,6 0.25 0 …
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Lead-free Solders: Materials Reliability for Electronics
reflow soldering electromigration 356–8, 365–8 miniaturization 471–2 parameters 223–4 Restriction … … RoHS) 122, 233, 340–1 room-temperature whiskers 325– 6 , 332–3 root grooves 327–8 SAC see tin – silver –copper satellite control processors … … deformation 276, 278–84, 286– 94 thermomigration 427–34, 436 Scheil …
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IC Component Sockets
Non-noble contact plating, 69 silver , 68 solder , 6 9 tin , 69 Overstress failure, 16, 138 Pad, xi, 1, 11, 13, 14, 89, 97 … … mechanical strength, 57 solderability, 58 stress relaxation and creep, 57 Quad flat pack, 94 , 204 Qualification, xii, 17 …
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Effects of Ni addition to high-lead solders on the growth of Cu3Sn and micro voids
[5] I. E. Anderson, and J. L. Harringa, “Suppression of void coalescence in thermal aging of Tin - Silver -Copper-X solder joints,” J Electron Mater, 35, pp. 94 -106, 2006. [ 6 ] F. Gao, T. Takemoto, H. Nishikawa, and A. Komatsu, “Microstructure .
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Minor Fe, Co, and Ni additions to SnAgCu solders for retarding Cu3Sn growth
[ 6 ] I. E. Anderson, and J. L. Harringa, "Suppression of void coalescence in thermal aging of Tin - Silver -Copper-X solder joints," J Electron Mater, 35 , pp. 94 -106, 2006.
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Reliability of Microtechnology
… 100, 103, 109, 111, 112, 176, 189, 192–194 Shear strength, 75, 118, 119, 172 Shear test, 119, 172–174 Short circuit, 79, 91, 116 Silver flake, 76 Simulation, 4– 6 , 66, 78, 112, 127 … … SAC), 53–55, 117, 197 Solder , 4, 9, 11–13, 33 … … 40, 41, 46, 47, 58, 59, 61–65, 67, 71, 76, 78, 85, 87, 94 –96, 100–107, 109 … … 157, 175–176, 179, 198, 199 Thermo-mechanical stress, 37, 58, 71, 100, 120 Tin whisker, 119–121 Transition …
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Modern Electroplating 5th Edition
… acid copper electrodeposition, 40 Erythorbic acid bath, 492–493 Etching procedure: disadvantage of, 229 6 -Ethoxy-2-mercaptobenzothiazole … … noncyanide zinc baths, 288–289 Ethylene oxide (EO) groups: Raman shift, 177 European Union’s End-of-Life Directive, 240 Eutectic alloys: tin -lead alloys composition, 279–280 application, 279–280 Eutectic solder : material properties of, 142 … … of, 161 Eutectic tin– silver , 162 Evans diagram, 434 … … 152 ions, 152 iron electrodeposition, ferrous chloride bath, 312 nickel electroplating, functional applications, 94 solutions, copper electrodeposition …
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States > Minnesota > State > Regulations > Plumbing Board‚ Minnesota > [MNR 4715] 4715 - Plumbing Code
… 50 percent tin and 50 percent lead, 95 percent tin and five percent antimony, or 96 percent tin and four percent silver , conforming to ASTM Standard Specification for soft solder metal B32- 94 , except that 50 percent tin and 50 percent lead … … 76; 28 SR 146; L 2007 c 140 art 4 s 61; art 6 s 15; art …
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Sporadic Degradation in Board Level Drop Reliability - Those Aren't All Kirkendall Voids!
1958 ( 6 ), pp. 1- 7 19. Meyer, R., "Pressure and Vacancy-Flow Effects on the Kirkendall Shift in Silver -Gold Alloys", Phys. Rev. 181 (1969), pp. 1086- 94 21. … and Low S., "Physical and Mechanical Properties of Intermetallic Compounds Commonly Found in Solder Joints", Online Research … Haimovich, J., "Cu-Sn Intermetallic Compound Growth in Hot-Air-Leveled Tin at and below 100°C", AMP …