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Supplier: Coilcraft, Inc.
Description: values Available in two sizes: 4.45 × 3.94 × 3.15 mm and 6.86 × 4.45 × 3.15 mm RoHS-compliant 260°C compatible. Terminations: tin-silver over copper COTS Plus tin-silver-copper and tin-lead terminations available
- Inductance Range: 0.0056 microH
- Inductance Tolerance: 1 to 5 (+/- %)
- DCR: 0.0032 ohms
- SRF: 18,000 MHz
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Supplier: TE Connectivity
Description: Body Features Enclosure Type : Hermetically Sealed Configuration Features Contact Arrangement : 4 Form C 4PDT-CO Contact Features Contact Material : Silver Cadmium Oxide Terminal Plating : Tin-Lead Electrical Characteristics Coil Resistance (OHM) : 400 Coil Voltage Rating (VDC) : 28
- DC Coil Voltage: 28 volts
- Coil Resistance: 400 ohms
- Operating Temperature: -94 to 257 F
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Supplier: TE Connectivity
Description: Material : Silver (Ag) Contact Type : Pin Mating Pin Diameter : .4 MM [.016 INCH ] Outer Contact Plating Material : Tin (Sn) RF Connector Center Contact Plating Material : Silver (Ag) Dimensions Connector Height : 14.4 MM [.567 INCH ] Product Length : 24.3 MM [.957 INCH ]
- Voltage Rating: 60 volts
- Current Rating: 3 amps
- Number of Contacts: 4 #
- Contact Pitch: 3.9877978465891633 mm
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Supplier: TE Connectivity
Description: Body Features Connector & Keying Code : A Primary Product Color : Black Configuration Features Number of Positions : 23 Number of Rows : 4 PCB Mount Orientation : Right Angle Contact Features Contact Mating Area Plating Material : Tin (Sn), Silver (Ag) Contact Type : Tab Mating Tab
- Number of Contacts: 23 #
- Contact Pitch: 1.9811989301525779 to 8.204195569734393 mm
- Connector Type: Automotive Connector, Wire-to-Board Connector
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Supplier: TE Connectivity
Description: Thickness : .8 MM [.032 INCH ] Mating Tab Width : 6.3 MM [.248 INCH ] PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : .381 MICM [15 MICIN ] Dimensions Connector Height : 12.8 MM [.504 INCH ] Connector Length : 37.3 MM
- Voltage Rating: 250 volts
- Current Rating: 16 amps
- Operating Temperature: -40 to 120 C
- Number of Contacts: 6
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Supplier: Win Source Electronics
Description: Number of Contacts: 6 Gender: Receptacle Length: 12.3 mm Housing Material: Nylon Number of Circuits: 6 Orientation: Right Angle Contact Plating: Silver, Tin Housing Color: White Contact Resistance: 20 mΩ Number of Pins: 6 Categories: FFC,FPC(FlatFlexible)Connectors
- Voltage Rating: 125 volts
- Current Rating: 1 amps
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Supplier: Win Source Electronics
Description: Number of Contacts: 20 Gender: Receptacle Length: 26.3 mm Housing Material: Nylon Number of Circuits: 20 Orientation: Right Angle Contact Plating: Silver, Tin Housing Color: Natural Contact Resistance: 20 mΩ Material: Nylon, Polyamide Number of Pins: 20 Categories:
- Voltage Rating: 125 volts
- Current Rating: 1 amps
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Supplier: Win Source Electronics
Description: Number of Contacts: 12 Gender: Receptacle Length: 18.6 mm Housing Material: Nylon Number of Circuits: 12 Orientation: Vertical Contact Plating: Silver, Tin Housing Color: White Contact Resistance: 20 mΩ Material: Nylon, Polyamide Categories: FFC,FPC(FlatFlexible)Connectors
- Voltage Rating: 125 volts
- Current Rating: 1 amps
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Supplier: RS Components, Ltd.
Description: Weller T0051388199 Lead Free Solder
- Diameter / Thickness: 0.01181103 inch
- Melting Range: 429.8 F
- Features: Other, Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
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Supplier: Indium Corporation
Description: This alloy has excellent thermal fatigue properties. Good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC Eutectic Pb-Free: Yes
- Diameter / Thickness: 0.03 inch
- Features: Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
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Supplier: Techsil Limited
Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Features: Flux Cored Wire, Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip,
- Melting Range: 430 F
- Conductivity: 81,200,000,000 µS/cm
- Approvals / Conformance: ASTM / UNS
- Product Form: Paste, Powder, Preform
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Supplier: Indium Corporation
Description: Very popular lead-free solder alloy. Alloy: 96.5Sn 3.0Ag 0.5Cu Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 220ºC Solidus Melting Temperature: 217ºC Pb-Free: Yes
- Diameter / Thickness: 0.002 inch
- Solder Alloy: Lead Free, Tin-Silver (Sn-Ag)
- Features: Strip / Sheet / Foil
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Supplier: Techsil Limited
Description: MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Features: Flux Cored Wire, Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
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Supplier: Indium Corporation
Description: InTEGRATED® Solder Preforms are joined in a matrix by fine, precise strands of solder which, during the soldering process, melt and flow to adjacent pads to give you complete preform separation. Applications InTEGRATED® Solder Preforms save assembly time and labor costs by
- Solder Alloy: Indium (In), Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
- Product Form: Preform
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, Green, Blue, Gray and Violet. 3 styles manufactured by Keystone. Miniature type test points are made from .010"(.25) dia. Phosphor Bronze with Silver or Matte Tin (read more)
Browse Test Points Datasheets for Keystone Electronics Corp. -
is produced to a 96.5% minimum purity lead level and may contain 1.5-3% Antimony (Sb) and .1-3.5% Tin (Sn) Mars Metal is able to provide you with very specific lead grades such as: Chemical Copper lead Low sulfur Low bismuth Low silver pure (read more)
Browse Ingots and Casting Stock Datasheets for MarsMetal -
to a 96.5% minimum purity lead level and may contain 1.5-3% Antimony (Sb) and .1-3.5% Tin (Sn). Mars Metal is able to provide you with very specific lead grades such as: Chemical Copper lead Low sulfur Low bismuth Low silver pure (read more)
Browse Ingots and Casting Stock Datasheets for MarsMetal
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HVAC: Equations, Data, and Rules of Thumb, Second Edition > Hydronic (Water) Piping Systems
Pipe: type “L” copper tubing, ASTM B88, Hard DrawnFittings: wrought copper solder joint fittings, ANSI/ASME B16.22Joints: solder joint with 95-5 tin antimony solder, 96-4 tin silver solder, or 94 - 6 tin silver solder , ASTM B32.
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Understanding Solids: The Science of Materials
etals Silver 428 Copper 403 Gold 319 Iron 83.5 Nickel 94 Titanium 22 Alloys Brass 106 Bronze 53 … … 29 wt% Cu, 4 wt% Fe) Lead– tin solder 50 Refractories Alumina 38 … … Porcelain 2 Polymers Nylon 6 ,6 0.25 0 …
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Lead-free Solders: Materials Reliability for Electronics
reflow soldering electromigration 356–8, 365–8 miniaturization 471–2 parameters 223–4 Restriction … … RoHS) 122, 233, 340–1 room-temperature whiskers 325– 6 , 332–3 root grooves 327–8 SAC see tin – silver –copper satellite control processors … … deformation 276, 278–84, 286– 94 thermomigration 427–34, 436 Scheil …
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IC Component Sockets
Non-noble contact plating, 69 silver , 68 solder , 6 9 tin , 69 Overstress failure, 16, 138 Pad, xi, 1, 11, 13, 14, 89, 97 … … mechanical strength, 57 solderability, 58 stress relaxation and creep, 57 Quad flat pack, 94 , 204 Qualification, xii, 17 …
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Effects of Ni addition to high-lead solders on the growth of Cu3Sn and micro voids
[5] I. E. Anderson, and J. L. Harringa, “Suppression of void coalescence in thermal aging of Tin - Silver -Copper-X solder joints,” J Electron Mater, 35, pp. 94 -106, 2006. [ 6 ] F. Gao, T. Takemoto, H. Nishikawa, and A. Komatsu, “Microstructure .
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Minor Fe, Co, and Ni additions to SnAgCu solders for retarding Cu3Sn growth
[ 6 ] I. E. Anderson, and J. L. Harringa, "Suppression of void coalescence in thermal aging of Tin - Silver -Copper-X solder joints," J Electron Mater, 35 , pp. 94 -106, 2006.
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Reliability of Microtechnology
… 100, 103, 109, 111, 112, 176, 189, 192–194 Shear strength, 75, 118, 119, 172 Shear test, 119, 172–174 Short circuit, 79, 91, 116 Silver flake, 76 Simulation, 4– 6 , 66, 78, 112, 127 … … SAC), 53–55, 117, 197 Solder , 4, 9, 11–13, 33 … … 40, 41, 46, 47, 58, 59, 61–65, 67, 71, 76, 78, 85, 87, 94 –96, 100–107, 109 … … 157, 175–176, 179, 198, 199 Thermo-mechanical stress, 37, 58, 71, 100, 120 Tin whisker, 119–121 Transition …
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Modern Electroplating 5th Edition
… acid copper electrodeposition, 40 Erythorbic acid bath, 492–493 Etching procedure: disadvantage of, 229 6 -Ethoxy-2-mercaptobenzothiazole … … noncyanide zinc baths, 288–289 Ethylene oxide (EO) groups: Raman shift, 177 European Union’s End-of-Life Directive, 240 Eutectic alloys: tin -lead alloys composition, 279–280 application, 279–280 Eutectic solder : material properties of, 142 … … of, 161 Eutectic tin– silver , 162 Evans diagram, 434 … … 152 ions, 152 iron electrodeposition, ferrous chloride bath, 312 nickel electroplating, functional applications, 94 solutions, copper electrodeposition …
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States > Minnesota > State > Regulations > Plumbing Board‚ Minnesota > [MNR 4715] 4715 - Plumbing Code
… 50 percent tin and 50 percent lead, 95 percent tin and five percent antimony, or 96 percent tin and four percent silver , conforming to ASTM Standard Specification for soft solder metal B32- 94 , except that 50 percent tin and 50 percent lead … … 76; 28 SR 146; L 2007 c 140 art 4 s 61; art 6 s 15; art …
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Sporadic Degradation in Board Level Drop Reliability - Those Aren't All Kirkendall Voids!
1958 ( 6 ), pp. 1- 7 19. Meyer, R., "Pressure and Vacancy-Flow Effects on the Kirkendall Shift in Silver -Gold Alloys", Phys. Rev. 181 (1969), pp. 1086- 94 21. … and Low S., "Physical and Mechanical Properties of Intermetallic Compounds Commonly Found in Solder Joints", Online Research … Haimovich, J., "Cu-Sn Intermetallic Compound Growth in Hot-Air-Leveled Tin at and below 100°C", AMP …