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Supplier: Plastronics Socket Company, Inc.
Description: - rapid response and turnaround Extensive catalog - easy purchase With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a
- Contact Resistance: 50 milliohms
- Contacts Pitch: 0.4000 to 0.8000 mm
- Current Rating: 0.0500 amps
- Features: Clamshell Socket
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Supplier: Plastronics Socket Company, Inc.
Description: - rapid response and turnaround Extensive catalog - easy purchase With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a
- Contact Resistance: 50 milliohms
- Contacts Pitch: 0.4000 to 0.8000 mm
- Current Rating: 0.0500 amps
- Features: Open Top Socket
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Supplier: Plastronics Socket Company, Inc.
Description: With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN
- Contact Resistance: 50 milliohms
- Contacts Pitch: 0.4000 to 0.8000 mm
- Current Rating: 0.0500 to 2.93 amps
- Features: Clamshell Socket
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Supplier: Plastronics Socket Company, Inc.
Description: With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN
- Contact Resistance: 50 milliohms
- Contacts Pitch: 0.4000 to 0.8000 mm
- Current Rating: 0.0500 to 2.93 amps
- Features: Open Top Socket
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Supplier: Ironwood Electronics, Inc.
Description: GHz QFN sockets provide 10 GHz bandwidth in a small cost effective ZIF socket for prototype and test applications. The GHz QFN socket is a simple mechanical socket based on an elastomer connector technology. The GHz QFN socket is a solder-less
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 0.4000 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: Sensata Technologies
Description: 0.4mm, 0.5mm, 0.65mm, and 8mm pitch Low cost design using stamped cantilever contact Staggered, through hole tail design for BIB design consideration ACTIVE ALIGNMENT: Active IC guide feature improving on package alignment accuracy Optimal thermal contact for package e-pad Solutions for Power
- Contact Plating: Gold Plating
- Contact Resistance: 200 milliohms
- Operating Temperature: 150 C
- Product Type: IC Socket
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Supplier: Aries Electronics, Inc.
Description: (compressed): 0.45mm PITCH: Released to <0.4mm – Mixed Pitch Available PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and Partial Arrays Available STRUCTURE: Silmat® Interposer with Patented Core INTERPOSER MATERIALS: Ag Particles in Silicone Elastomer
- Contacts Pitch: 10.16 mm
- Current Rating: 4 amps
- Features: Clamshell Socket
- Operating Temperature: -55 to 200 C
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Supplier: Ironwood Electronics, Inc.
Description: {size:8.5in 11.0in; margin:1.0in 1.25in 1.0in 1.25in; mso-header-margin:.5 in; mso-footer-margin:.5 in; mso-paper-source:0;} div.Section1 {page:Section1;} --> These industry leading probing adapters for QFN/MLF allow probing connection to all pins of the chip. A high
- Contact Plating: Gold Plating
- Contacts Pitch: 0.5000 mm
- Mounting: SMT, Through-hole
- Number of Contacts: 32
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Supplier: Aries Electronics, Inc.
Description: KEY PERFORMANCE ELEMENTS – Series AR4HT High-Temperature 200°C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing) Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE
- Contacts Pitch: 2.54 mm
- Features: Clamshell Socket
- Operating Temperature: -67 to 392 C
- Package Type: BGA, CSP, LGA, QFN, Test / Prototyping Socket, Other
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Supplier: JC Cherry, Inc.
Description: Test Socket GU29 Frame / QFN pkg Size 29x30.6mm / 1.14"x1.20" Can also be used as Burn in Socket ?High reliability ?Cost competitive ?Temperature: -40 to +150? For QFN Device How to order for Custom design GQ29-QFNxxxxxxx *P/N will be informed after fixing specifications.
- Package Type: Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Ironwood Electronics, Inc.
Description: SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating
- Contacts Pitch: 0.5000 mm
- Features: Solderless, ZIF Lock, Clamshell Socket
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Supplier: Sensata Technologies
Description: Lid and adapter molded to allow low cost solutions High force delivery system (up to 40lbf) A variety of contact technologies can be used for this socket ranging from elastomers to spring pins Two finger knob - easy to operate even at high force Lid assembly can be easily removed Lid has
- Product Type: IC Socket
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Supplier: Sensata Technologies
Description: Versatile, low cost socket base Passive heat sink or Heat Sink/Heater/Sensor Replaceable contact set Heater - foil or cartridge as required Sensor - RTD in complaint and isolated "button" unless otherwise specified Heat Sink - simulations
- Product Type: IC Socket
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Supplier: Ironwood Electronics, Inc.
Description: Ironwood Electronics' high performance QFN probing adapters allow probing of QFN's/MLF's with logic analyzers such as the Agilent 16,000 series or Tektronix TLA700 series. These adapters use gold plated machined pins for maximum reliability. These industry leading probing adapters for
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Supplier: Sensata Technologies
Description: Open Top Compression Surface Mount Spring and probe contact Pointed probe contacts DUT pad Pointed probe maintains continuous contact to PCB Spring loaded floating locater plate Any pitch or pitch combination .4mm and greater Threaded inserts available Available with high performance pin
- Contact Plating: Gold Plating
- Contact Resistance: 350 milliohms
- Operating Temperature: 125 C
- Product Type: IC Socket
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Supplier: DigiKey
Description: ChipProg-48, ChipProg-481, ChipProg-G41 - Socket Module - QFN
- RoHS Compliant: Yes
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Supplier: DigiKey
Description: ChipProg-48, ChipProg-481, ChipProg-G41 - Socket Module - QFN
- RoHS Compliant: Yes
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Supplier: DigiKey
Description: ChipProg-48, ChipProg-481, ChipProg-G41 - Socket Module - QFN
- RoHS Compliant: Yes
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Supplier: Aries Electronics, Inc.
Description: FEATURES Pressure-mount plunge to board interposer Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more Very low inductance per contact site High cycle life with easy maintenance Manual or Automated Handler applications
- Contact Plating: Gold Plating
- Contact Resistance: 20 milliohms
- Contacts Pitch: 0.3200 mm
- Current Rating: 4 amps
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Supplier: Renesas Electronics Corporation
Description: VID states. The ISL6263A requires only one capacitor for both the soft-start slew-rate and the dynamic VID slew-rate by internally connecting the SOFT pin to the appropriate current source. Processor socket Kelvin sensing is accomplished with an integrated unity-gain true differential
- Package Type: QFN
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Supplier: DigiKey
Description: TEST SOCKET FOR QFN-20 0.5MM IC
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GU22 Frame Series Size 22x22mm / 0.87"x0.87" Can also be used as Burn in Socket ?Highly reliable M-pin Probes as contact parts ?High Frequency For BGA Device, QFN Device 0.4mm/0.016" Pitch : 16x16 Contact Max 0.5mm/0.020" Pitch : 10x10 Contact Max
- Contact Resistance: 100 milliohms
- Contacts Pitch: 0.4000 to 0.5000 mm
- Current Rating: 1 amps
- Operating Temperature: -40 to 150 C
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Supplier: Infineon Technologies AG
Description: Clock Socket Adapter The CY3675-QFN24A socket adapter plugs directly into the Cypress CyClockMaker clock programming kit (CY3675-CLKMAKER1) to enable configuration of the following Cypress programmable clock devices: CY2544 CY2545 CY2548 The CY
- Category: Development Board
- Supported System: Other
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Supplier: Aries Electronics, Inc.
Description: FEATURES Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating, Nickel Plating
- Contacts Pitch: 0.4000 to 0.4500 mm
- Features: Solderless, Clamshell Socket
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Supplier: ASAP Semiconductor LLC
Description: TARGET BOARD FOR MSP430FR5XXX Socket Module - QFN MSP430FR5xxx
- Category: Development Board
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Supplier: Powell Electronics, Inc.
Description: 3M Textool Open-Top Sockets for QFN Ap
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: 3M Textool Open-Top Sockets for QFN Ap
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: 3M Textool Open-Top Sockets for QFN Ap
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: 3M Textool Open-Top Sockets for QFN Ap
- Product Type: IC Socket
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Supplier: Molex Signal Tech Industrial Ltd.
Description: to +125 °C Consistent stable contact resistance 120 m? (Ave) Designed for manual test, bench test, and HVM Production Test using the same socket Solution for BGA, LGA, QFN, DFN, and other variants, ideal for minimum pitch 0.35 mm Floating base or Hi Low
- Package Type: BGA, LGA, QFN, Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Lingto Electronic Limited
Description: CONN SOCKET QFN 40POS GOLD
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Supplier: Acme Chip Technology Co., Limited
Description: BOARD 78M6612 68PIN QFN
- Category: Development Board
- Supported System: Power, Other
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1044140-AC164031 Category: Development Boards, Kits, Programmers>Programm ing Adapters, Sockets For Use With/Related Products: PRO MATE - II™/PRO MATE™ Standard Package: 1 Module/Board Type: Socket Module - 28-Pin QFN ECCN: 3A992A
- Category: Development Board
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Supplier: RS Components, Ltd.
Description: Clamshell test sockets for QFNs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. Contact plating Gold over
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 0.5000 mm
- Mounting: Solder
- Number of Contacts: 40
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Indicates content that may require registration and/or purchase.
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QFN
QFN Sockets .
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QFN 0.5 mm Pitch Test & Burn-In Sockets
The new open top QFN socket series have a high-reliable fine pitch 0.5 mm contact system and a standard socket scaling.
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QFN Test & Burn-In Socket from Yamaichi
Yamaichi Electronics has introduced the new QFN socket series NP506 with ultra fine pitch 0.4 mm and 0.5 mm in open-top design for the test & burn-in of small IC packages.
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Property of impedance matching of novel QFP socket contactor by 3D electro-magnetic simulation
According simulation results, each ports of this novel QFN socket contactor are impedance matching up to 20GHz bandwidth because the return loss is very smaller than -20dB and insertion loss approximate 0dB.
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Analogue sum ASIC for L1 trigger decision in Cherenkov Telescope cameras
It includes a mezzanine board with a low inductance 48 pin QFN socket , which permits an easy exchange of the ASIC units to .
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GHz BGA Socket User Manual
MLF ( QFN ) Socket Assembly: .
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Silicon Photonics III
Fig. 5.1 (Left) a grating coupler and electrical probing laboratory test and measurement setup; (Right) a silicon photonic die wirebonded to a QFN electrical chip carrier with bonded grating fiber array, placed in a QFN chip socket soldered to a PCB .
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Innovative approaches for realisation of embedded chip packages - Technological challenges and achievements
This setup is based on a QFN test socket card and automated, parallel daisy chain and four point testing, using a labVIEW environment.
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Radiation tolerant SPI-programmable delay line for high energy physics experiments
Right : Layout of the implementation to be encapsulated in a QFN -48 socket .
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A generic low-noise CMOS readout interface for 64 × 64 imaging array with on-chip ADC
The mini- PCB serves as the socket for the QFN package, converting it to a DIP.