Urethane Encapsulant

Description: PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and bond

• Viscosity: 1,500 cP
• Use Temperature: -55 to 125 F
• Dielectric Constant (Relative Permittivity): 4.41 to 4.63
• Features: Ceramic / Glass, Electrical Insulation / Dielectric Material, Electrical Power / HV, Electronics, Encapsulanting / Potting, Filled / Reinforced, Flexible / Dampening, Liquid, Metal, Paper / Paperboard, Plastic, UV / Radiation Cured (EB, Light)

Description: Resin Designs 51606MV Urethane Encapsulant Clear is a two component, room temperature curing polyurethane that is used for encapsulation and potting applications. It is high performance and moisture resistant. 2:1 mix ratio by volume. 50 mL Mixpac.

• Tensile Strength (Break): 2,000 psi
• Elongation: 200 %
• Dielectric Strength: 400.00000000000006 kV/in
• Features: Encapsulating / Potting

Description: Resin Designs 51606LV Urethane Encapsulant Black is a two component, room temperature curing polyurethane that is used for encapsulation and potting applications. It is flexible, high performance, and moisture resistant. 2:1 mix ratio by volume. 50 mL Mixpac.

• Tensile Strength (Break): 1,000 psi
• Dielectric Strength: 400.00000000000006 kV/in
• Features: Encapsulating / Potting
• Chemical System: Polyurethane (PU, PUR)

Description: Resin Designs 64-50P Urethane Encapsulant is a two component, room temperature curing polyurethane that is used for encapsulation and potting applications. It is flexible, high performance, and has excellent moisture resistance. 1:2 mix ratio by volume. 50 mL Cartridge.

• Viscosity: 2,000 to 20,000 cP
• Tensile Strength (Break): 140 psi
• Elongation: 250 %
• Dielectric Strength: 400.00000000000006 kV/in

Description: Resin Designs 071607-D2 Urethane Encapsulant Clear is a two component, room temperature curing polyurethane that is used for hard coat applications. It is non-yellowing, UV stable, and has excellent moisture resistance. 1:1 mix ratio by volume. 50 mL Mixpac.

• Viscosity: 700 cP
• Features: Encapsulating / Potting
• Chemical System: Polyurethane (PU, PUR)
• Cure / Technology: Two Component System

Description: Rigid 2-part polyisocyanate urethane adhesive for use in fiber optic components. It is designed for flame resistance and fast cure. LOCTITE® UK 3364™ is a black, rigid 2-part polyisocyanate urethane adhesive for use in fiber optic components. It is designed for flame resistance and

• Viscosity: 1,500 cP
• Use Temperature: 200 to 240 F
• Chemical System: Polyurethane (PU, PUR)
• Cure / Technology: Two Component System

Description: 20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100 exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. This system

• Viscosity: 1,600 cP
• Use Temperature: -67 to 266 F
• Coeff. of Thermal Expansion (CTE): 83.33333333333333 µin/in-F
• Tensile Strength (Break): 1,600 psi

Description: This two component urethane is a low durometer (45 Shore A), potting, casting, and encapsulating compound. It is an unfilled material engineered to provide excellent hydrolytic stability and low moisture permeability. It has outstanding thermal cycling properties, a low glass transition

• Use Temperature: -40 to 257 F
• Elongation: 50 %
• Tensile Strength (Break): 150 psi
• Dielectric Constant (Relative Permittivity): 4.5

Description: 20-2621 is a two component Polyurethane compound designed for applications requiring "water like" clarity. This room temperature curing system provides excellent environmental protection and will not yellow over time.

• Use Temperature: -40 to 275 F
• Coeff. of Thermal Expansion (CTE): 126.66666666666666 µin/in-F
• Elongation: 60 %
• Tensile Strength (Break): 1,200 psi

Description: PNU-46203™ is an electronics grade, two-component polyurethane adhesive or encapsulant for high temperature resistance. PNU-46203™ is designed for the encapsulation by casting of completed circuit boards. Cured PNU-46203™ is expected to meet the flammability requirements of UL 94, V-0 at

• Viscosity: 15,000 cP
• Use Temperature: -55 to 125 F
• Dielectric Constant (Relative Permittivity): 6.89 to 7.01
• Features: Ceramic / Glass, Electrical Insulation / Dielectric Material, Electrical Power / HV, Electronics, Encapsulanting / Potting, Filled / Reinforced, Flame Retardant (e.g. UL 94 Rated), Flexible / Dampening, Liquid, Metal, Paper / Paperboard, Plastic

Description: 70-2170 is a liquid, low viscosity, urethane resin formulated for casting dimensionally stable parts. Parts cast with 70-2170 have an ABS feel and appearance. 70-2170 is mercury free and does not contain TDI or MbOCA. It’s low shrinkage and low viscosity allow for the production of precision

• Viscosity: 100 to 1,300 cP
• Tensile Strength (Break): 70 psi
• Elongation: 6 %
• Form / Function: Die Bonding Adhesive / Compound

Description: CONFORMAL COATING, URETHANE

Description: Encapsulant potting urethane.

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound

Description: The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit boards. When applied in thin layers, < 0.01� it acts as an adhesive and provides excellent thermal contact between dissimilar materials such as

• Viscosity: 70,000 cP
• Use Temperature: -55 to 125 F
• Dielectric Constant (Relative Permittivity): 8.27 to 8.46
• Features: Ceramic / Glass, Electrical Insulation / Dielectric Material, Electrical Power / HV, Electronics, Encapsulanting / Potting, Filled / Reinforced, Flame Retardant (e.g. UL 94 Rated), Flexible / Dampening, Liquid, Metal, Paper / Paperboard, Plastic, UL Approved

Description: The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides

• Viscosity: 30,000 cP
• Use Temperature: -55 to 125 F
• Thermal Conductivity: 1.21151436 W/m-K
• Dielectric Constant (Relative Permittivity): 6.85 to 7.6

Description: CONFORMAL COATING, URETHANE, FAST DRY / Liquid

Description: (Known as Hysol US0154 ) Encapsulant potting urethane.

• Viscosity: 55 cP
• Coeff. of Thermal Expansion (CTE): 5.555555555555555 µin/in-F
• Elongation: 50 %
• Industry: Electronics (PCB / SMT Assembly)

Description: Chemical Zinc Oxide⁄Non Hazardous, Non Silicone Heat Transfer Compound Lubricant Type Ideal for aggressive chemical environments. Urethane conformal coating is a durable finish product that provides a protective coating for printed circuit boards against moisture, corrosion and thermal shock.

Description: Chemical Zinc Oxide⁄Non Hazardous, Non Silicone Heat Transfer Compound Lubricant Type Ideal for aggressive chemical environments. Urethane conformal coating is a durable finish product that provides a protective coating for printed circuit boards against moisture, corrosion and thermal shock.

Description: MG Chemicals 4223 Urethane Conformal Coating offers a highly chemical-resistant finish that meets UL standards for indoor conformal coatings. This PU protects electric circuits against corrosive chemicals, moisture, dirt, dust, thermal shocks and scratches, alongside is also insulates against

• Form / Function: Conformal / Encapsulating Coating
• Industry: Electronics (PCB / SMT Assembly)
• Chemical System: Polyurethane (PU, PUR)

Description: Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins

• Viscosity: 2,500 cP
• Use Temperature: -80 to 250 F
• Coeff. of Thermal Expansion (CTE): 22 µin/in-F
• Tensile Strength (Break): 1,700 psi

Description: Master Bond Polymer System UV21 is an easy to use one component UV curable urethane elastomer compound. It has been used for bonding, sealing, casting and formed in place high performance seals and gaskets. The UV21 is a solvent free system and has an excellent six month shelf life at ambient

• Viscosity: 32,000 to 36,000 cP
• Use Temperature: -60 to 300 F
• Thermal Conductivity: 0.029 W/m-K
• Coeff. of Thermal Expansion (CTE): 83 µin/in-F

Description: HYSOL US1150 is an extended polybutadiene/MDI base, mineral filled, medium hardness, ambient cure urethane encapsulant/sealant. This material can be used for potting electronics or devices for protection against environmental hazards. It exhibits very little hardness increase when

• Viscosity: 3,500 cP
• Use Temperature: -85 to 257 F
• Thermal Conductivity: 0.486 W/m-K
• Industry: Electronics (PCB / SMT Assembly)

Description: HIGH TEMPERATURE RIGID URETHANE

• Features: Encapsulating / Potting

Description: 8800-B Black flexible urethane

• Features: Encapsulating / Potting Compound, Specialty / Other

Description: Urethane Clear 250ml

• Form / Function: Conformal / Encapsulating Coating
• Features: Other, Specialty / Other, Tooling / Mold Material
• Chemical System: Polyurethane (PU, PUR)

Description: Sauereisen Universal Block Filler No. 509 is a moist-cured urethane formulation specifically designed to fill small voids, irregularities, and air pockets in concrete. No. 509 provides a smooth surface prior to application of vinyl ester and urethane protective barriers.

• Use Temperature: 20 to 400 F
• Features: Air Setting / Film Drying, Concrete / Masonry, Leveling / Filling Compound, Other, Solvent Based (Volatile Organic)
• Chemical System: Polyurethane (PU, PUR), Rubber Based / Elastomeric
• Cure / Technology: Two Component System

Description: Urethane Coating Type UR: Resistant to Moisture, Chemicals, and Abrasion. Thermal Resistance to 248°F with Dielectric Strength of 640 Volts/mil

Description: service life and reliability of electronic circuit boards operating in the most demanding environments. Product Features Solvent-Free, Fast-Cure Processing Urethane acrylate chemistry with UV cure in seconds and secondary moisture cure (RTV) for shadowed areas. ~100% solids formulation that

• Use Temperature: -85 to 302 F
• Dielectric Strength: 355.60000000000076 kV/in
• Dielectric Constant (Relative Permittivity): 2.67
• Form / Function: Conformal / Encapsulating Coating

Description: Sonic-Fiber Faced Mineral Wool is a semi-flexible non-asbestos mineral wool that provides greater sound attenuation than fiberglass bats or urethane foam. Sonic-Fiber Faced Mineral Wool is naturally hydrophobic (repels water), fire resistant, does not promote mold growth, and is vermin-proof.

• Noise Reduction Coefficient (if applicable): 1.18 NRC
• Thickness: 2 to 4 inch
• Features: Other

Description: unwanted noise. Easy to handle and relatively lightweight, Sonic-Fiber is a semi-flexible non-asbestos mineral wool that provides greater sound attenuation than fiberglass bats or urethane foam. Sonic-Fiber is naturally hydrophobic (repels water), fire resistant, does not promote mold growth,

• Noise Reduction Coefficient (if applicable): 1.18 NRC
• Thickness: 2 to 4 inch
• Features: Other

Description: Master Bond Polymer System UV15X-5 is a newly developed one component, non-yellowing, UV curable urethane elastomer system possessing high flexibility and outstanding abrasion resistance. This high viscosity system can be used for bonding, sealing, coating and casting. Master Bond UV15X-5

• Viscosity: 240,000 cP
• Use Temperature: -80 to 250 F
• Thermal Conductivity: 0.029 W/m-K
• Coeff. of Thermal Expansion (CTE): 83 µin/in-F