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Supplier: CoorsTek
Description: Navigation and communication are critical elements when flying. With up to 35 antennas per aircraft in major airliners, reducing weight while ensuring unquestionable reliability are critical factors for aerospace communication. Our ceramic components can be found in many on-board
- Materials of Construction: Specialty / Other
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Supplier: Richardson RFPD
Description: The ALL mXTENDTM chip antenna component has been specifically designed for providing multiband performance in wireless devices, enabling worldwide coverage. Among other applications, it is used for designing Smart Meters and Sharkfin devices able to operate in full mobile communication
- Gain: 3.1 dB
- Polarization Type: Linear
- Primary Frequency Range: 698 to 2690 MHz
- Technology Type: Other Antennas & Arrays
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Supplier: Richardson RFPD
Description: frequency response of the wireless platform such as 2G, 3G, 4G and 5G bands, but also for other regions of the spectrum for example GNSS and Bluetooth. It is also the ideal component for densely crowded electronic platforms such as massive MIMO devices where multiple antennas need to coexist.
- Gain: 1.9 dB
- Polarization Type: Linear
- Primary Frequency Range: 824 to 5875 MHz
- Technology Type: Other Antennas & Arrays
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Supplier: Richardson RFPD
Description: The GeofindTM is a slim chip antenna engineered specifically for consumer electronic devices operating with GPS, GLONASS, and Beidou system where low-cost and robust performance is mandatory. The GeofindTM antenna is built on glass epoxy substrate. Taking advantage
- Gain: 1.4 dB
- Polarization Type: Linear
- Primary Frequency Range: 1561 to 1606 MHz
- Technology Type: Other Antennas & Arrays
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Supplier: Richardson RFPD
Description: The Micro Reach XtendTM chip antenna is a very small size and low cost antenna that combines reduced clearance area required within the customer PCB with its high performance and integration flexibility. The Micro Reach XtendTM antenna is built on glass epoxy substrate
- Gain: 0.2000 dB
- Polarization Type: Linear
- Primary Frequency Range: 2400 to 2500 MHz
- Technology Type: Other Antennas & Arrays
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Supplier: DigiKey
Description: 2.4~2.5GHZ CERAMIC SUBSTRATE LOO
- Applications: Broadband Network / WLAN, Other
- Form Factor: Internal / Chip
- Gain: 2.7 dB
- Primary Frequency Range: 2450 MHz
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Description: This book presents a step-by-step discussion of the design and development of radio frequency identification (RFID) and RFID-enabled sensors on flexible low cost substrates for UHF frequency bands. Various examples of fully function building blocks (design and fabrication of antennas
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Description: either homogeneous or inhomogeneous substrate, the microstrip-to-SIW transition and the speed-up technique for the simulation of symmetrical SIW circuits. Different types of SIW circuits are shown and simulated using the proposed method. In addition, several slot antennas and horn
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Description: In recent years, transmitarray antennas have attracted growing interest with many antenna researchers. Transmitarrays combines both optical and antenna array theory, leading to a low profile design with high gain, high radiation efficiency, and versatile radiation performance
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Supplier: SAE International
Description: wideband radiating structure capable of sending and receiving many of the signals required in a modern vehicle from a single device. The antenna is based on Planar Inverted Cone Antenna geometry. The effect of bending or curving the antenna substrate is investigated at
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Supplier: Protavic America, Inc.
Description: ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals and engineered plastics. Proven applications are bonding MRI magnets under full
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrically Insulating / Dielectric
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Description: passive devices and through substrate via • Low-temperature co-fired ceramic and liquid crystal polymer based microwave devices • Large-area printing, inkjet printing and 3D printing materials and processes for RF and THz applications • Engineered metamaterials and plasmonics for
- Industry: Electronics and Semiconductor
- Type: Conference
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Supplier: MacDermid Alpha Electronics Solutions
Description: Coating process designed to enhance fine line plating performance on laser direct structured substrates. Product Overview As the applications for molded interconnect devices have expanded from simple, large antenna constructions to advanced electronic devices, conductor line sizes
- Chemical / Process: Tin Plating
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Supplier: Merrimac Industries, Inc.
Description: , signal distribution and processing functions. They can also be used in monopulse receivers for processing signal feeds off the antenna. Hybrid junctions are often used as part of more complex divider/coupler, balance mixers, image reject mixers, single sideband modulators and antenna
- Coupler Type: Uni-Directional
- Frequency Range: 1930 to 1990 MHz
- Insertion Loss: 0.3500 dB
- Package Type: Surface Mount Technology (SMT)
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Supplier: Merrimac Industries, Inc.
Description: , signal distribution and processing functions. They can also be used in monopulse receivers for processing signal feeds off the antenna. Hybrid junctions are often used as part of more complex divider/coupler, balance mixers, image reject mixers, single sideband modulators and antenna
- Coupler Type: Uni-Directional
- Frequency Range: 3300 to 3700 MHz
- Insertion Loss: 0.3000 dB
- Package Type: Surface Mount Technology (SMT)
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Supplier: Merrimac Industries, Inc.
Description: , signal distribution and processing functions. They can also be used in monopulse receivers for processing signal feeds off the antenna. Hybrid junctions are often used as part of more complex divider/coupler, balance mixers, image reject mixers, single sideband modulators and antenna
- Coupler Type: Uni-Directional
- Frequency Range: 1700 to 2000 MHz
- Insertion Loss: 0.3000 dB
- Package Type: Surface Mount Technology (SMT)
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Supplier: Merrimac Industries, Inc.
Description: , signal distribution and processing functions. They can also be used in monopulse receivers for processing signal feeds off the antenna. Hybrid junctions are often used as part of more complex divider/coupler, balance mixers, image reject mixers, single sideband modulators and antenna
- Coupler Type: Uni-Directional
- Frequency Range: 3300 to 3700 MHz
- Insertion Loss: 0.4000 dB
- Package Type: Surface Mount Technology (SMT)
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Supplier: Skyworks Solutions, Inc.
Description: The SKY5A3043 Sky5® supports 2G/3G/4G/5G mobile devices and operates efficiently in 3G/4G/5G modes. The device consists of a low-band 3G/4G/5G PA block, low band and high-band 2G PA blocks, a silicon controller containing the MIPI RFFE interface, RF band switches, antenna switches, a bi
- Applications: Mobile / Wireless Systems
- Package Type: Surface Mount Technology (SMT), Other
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Description: , substrates for stripline antennas, in transmission lines, smart skins, as dielectric radomes, dielectric spacers, or for circuit substrates. Products are available in rod or sheet form, pack-in-place syntactic foam, rigid foam sheet stock, or as a two-component foaming system.
- Foam Type: Closed Cellular, Flexible, Rigid
- Form / Shape: Stock Shape (Bar, Sheet, etc.), Film / Sheet
- Material / Composition: Plastic / Polymer
- Special Features: Electrical Insulation / Dielectric
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Supplier: Total Plastics, Inc.
Description: glossy colors that are not affected by the color of the substrate. High clarity clear tubing is also available. Shrink temperature is 115 °C, storage life is definite. The operating temperature range is -55 °C to +105 °C. Sumitube® A4 is recommended for general purpose applications
- Diameter: 0.0469 to 2 inch
- Material: Polyolefin
- Operating Temperature: -55 to 105 C
- Shrink Temperature: 115 C
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Supplier: Skyworks Solutions, Inc.
Description: . The InGaP/GaAs die and passive components are mounted on a multi-layer laminate substrate and the assembly encapsulated in plastic overmold. GSM / EDGE: The SKY78015 uses a new compact architecture supporting the GSM850, EGSM900, DCS1800 and PCS1900 bands. The FEM also supports 2.5G Class
- Frequency Range: 824 to 1980 MHz
- Package Type: Surface Mount Technology (SMT), Other
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Supplier: Skyworks Solutions, Inc.
Description: . Extremely low leakage current maximizes handset standby time. The InGaP/GaAs die and passive components are mounted on a multi-layer laminate substrate and the assembly encapsulated in plastic overmold. GSM / EDGE: The SKY78041 with new compact architecture supports the GSM850 and EGSM900
- Package Type: Surface Mount Technology (SMT), Other
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Supplier: Skyworks Solutions, Inc.
Description: -layer laminate substrate and the assembly encapsulated in plastic overmold. WCDMA: The SKY78113-61 enhanced architecture supports WCDMA/High Speed Downlink Packet Access (HSDPA) and High Speed Uplink Packet Access (HSUPA) modulations, covers multiple bands for 3GPP including bands 8 and 26
- Package Type: Surface Mount Technology (SMT), Other
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This example demonstrates the performance of an antenna array for 140 GHz wireless communication purposes, such as for use in a 6G application. The base element design consists of a TE340-mode substrate-integrated cavity (SIC) excited (read more)
Browse Modeling and Simulation Software Datasheets for Remcom (USA) -
.03 to 30. These materials have unique dielectric and physical properties. Dielectric materials can be used to adjust the Q of cavities, as impedance transitions, substrates for stripline antennas, in transmission lines, smart skins, as dielectric radomes, dielectric spacers, or for circuit (read more)
Browse Foams and Foam Materials Datasheets for Dexmet® Corporation, a part of PPG’s engineered materials division -
. Semiconductor Substrates: h-BN has a high lattice match with graphene, a smooth surface, and excellent chemical stability. It can serve as a substrate for graphene growth, facilitating the development of two-dimensional semiconductor devices (read more)
Browse Ceramic Powders and Precursors Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
providing heat and chemical resistance, improved insulation and electrical characteristics and reduced transmission loss in antennas and sensors. It also enables strong adhesion and lamination to other materials such as smooth copper foils. Transparent Amorphous Fluoropolymer (read more)
Browse Polymers and Plastic Resins Datasheets for AGC Chemicals Americas, Inc.
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Simulating a Beam Scanning Substrate Integrated Waveguide Leaky Wave Antenna in XFdtd
An antenna based on a transverse slotted rectangular waveguide design is realized in a substrate integrated waveguide structure and simulated in XFdtd (R) EM Simulation Software. The antenna scans narrow beams from near broadside to near end fire as a function of frequency. The antenna performance
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EM Simulation of 140 GHz Antenna Array for 6G Wireless Communication
A 140 GHz slot antenna array excited by a substrate integrated cavity is demonstrated for use in wireless communications. The antenna array has high gain, wide bandwidth, low fabrication costs, and small size, which make it an effective design. The final 8x8 antenna array has bandwidth from 130
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RFID Battles the Elements
any new-ish technology, RFID has bugs to be worked out. Most have to do with immature hardware either the tags (comprised of a microchip, antenna and substrate on which they reside) or readers with which they communicate. Dead tags are just one reason RFID communication can break down
More Information Top
Indicates content that may require registration and/or purchase.
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Advanced Millimeter-wave Technologies: Antennas Packaging and Circuits Complete Document
The most critical point in terms of CTE mismatch is the gap between the chip and the Kovar frame that is bridged by the fused silica antenna substrate .
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Terahertz Planar Antennas for Next Generation Communication
In general, it is believed that above 30 GHz, the antenna substrates are thick and they have high relative dielectric constant due to several reasons [22, 23].
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2012 Index IEEE Transactions on Antennas and Propagation Vol. 60
Simulation Methodology for Synthesis of Antenna Substrates With Microscale Inclusions; TAP May 2012 2194-2202 Norman, R. J., Le Marshall, J., Carter, B. A., Wang, C.-S., Gordon, S., and Zhang, K., .
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Millimeter-Wave Antennas: Configurations and Applications
Integrated transmitter antennas are those that integrate elements of the transmit chain (such as the simple illustration in Fig. 4.11) onto the antenna substrate .
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Low Profile Conformal Antenna Arrays on High Impedance Substrate
The antenna substrate is an important factor in the resultant radiation pattern and return loss characteristics.
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Handbook of Microstrip Antennas, Volume 1
Parasitic elements on antenna substrate .
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Proceedings of the International Conference on Recent Cognizance in Wireless Communication & Image Processing
This cavity is made below the patch area in the second layer of antenna substrate .
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Profile miniaturization and performance improvement of a rectangular patch antenna using magnetic metamaterial substrates
where d is the thickness of antenna substrate , er is the rel- ative permittivity of substrate, lr is the relative permeabil- ity of substrate.
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Theory and Applications of Applied Electromagnetics
The size of the conventional rectangular antenna substrate is reduced to be more suitable for future small UWB wireless systems.
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Microwave and Millimeter Wave Circuits and Systems: Emerging Design, Technologies and Applications
Also, the antenna substrate can be composed of multi- ple fabric layers, contributing to the inhomogeneous nature of the material’s permittivity and introducing anisotropic behavior.