Automotive Epoxy Adhesives

Description: DuPont™ Pyralux® HP is an epoxy-based adhesive system demonstrating both low loss and high reliability, specifically designed for OEMs and PCB design manufacturers. Its optimized low-loss solution is suitable for multi-layer flex and rigid-flex designs for military, automotive

• Industry: Automotive, Electronics, Medical / Food (Sanitary / FDA), Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: Die Bonding Adhesive / Compound, Epoxy (EP)

Description: Clear unfilled epoxy in a one-part system that can be stored at room temperature for up to 6 months. This material is excellent for ferrite and ceramic bonding applications. Non-hazardous and safe to use. Requires heat assist to cure.

• Viscosity: 5,000 cP
• Use Temperature: -55 to 175 F
• Tensile Strength (Break): 2,600 psi
• Dielectric Constant (Relative Permittivity): 4.3

Description: 50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to

• Viscosity: 165,000 cP
• Use Temperature: -76 to 401 F
• Thermal Conductivity: 1.442279 W/m-K
• Tensile Strength (Break): 9,500 psi

Description: ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals and engineered plastics. Proven applications are bonding MRI magnets under full

• Viscosity: 10,000 cP
• Use Temperature: -50 to 130 F
• Tensile Strength (Break): 4,500 psi
• Dielectric Constant (Relative Permittivity): 4.3

Description: Master Bond Polymer Adhesive EP21D is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more

• Use Temperature: -60 to 250 F
• Thermal Conductivity: 0.288 to 0.432 W/m-K
• Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
• Elongation: 5 %

Description: Master Bond Polymer System EP126 is a two component toughened epoxy resin based high temperature resistant adhesive system with continuous service capability at 500°F and outstanding chemical resistance. This unique high performance epoxy adhesive compound can also

• Tensile Strength (Break): 2,200 psi
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
• Substrate Compatibility: Ceramic / Glass, Composites, Dissimilar Substrates, Metal, Plastic
• Features: Epoxy (EP), Flame Retardant (e.g. UL 94 Rated), Liquid, Non-corrosive Cure, Other, Powder, Specialty / Other, Unfilled

Description: Master Bond Polymer System EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a ten-to-one (10:1) mix ratio by weight. It has an attractive

• Viscosity: 10,000 to 15,000 cP
• Use Temperature: -60 to 275 F
• Thermal Conductivity: 0.288 to 0.432 W/m-K
• Coeff. of Thermal Expansion (CTE): 17 µin/in-F

Description: Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10

• Viscosity: 8,000 to 10,000 cP
• Use Temperature: -80 to 400 F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
• Features: Anti-static / ESD Control, Die Bonding Adhesive / Compound, EMI / RFI Shielding Material, Electrical Insulating / Dielectric, Electrically Conductive, Epoxy (EP), Gap Filling Sealant / FIP Gasket, Liquid, Other, Specialty / Other, Unfilled

Description: Parker LORD® 322 Epoxy Adhesive Hardener Gray is a two component, general purpose epoxy system that is used for primerless bonding to automotive sheet molded compounds, rubber, plastics, polyester thermosets, and prepared metals. It is resistant to sunlight, humidity,

• Viscosity: 450,000 to 2,000,000 cP
• Tensile Strength (Break): 4,440 psi
• Elongation: 3 %
• Industry: Automotive

Description: Parker LORD® 320/322 Epoxy Adhesive is a two component, general purpose epoxy system that is used for primerless bonding to automotive sheet molded compounds, rubber, plastics, polyester thermosets, and prepared metals. It is resistant to sunlight, humidity, extreme

• Viscosity: 300,000 to 2,000,000 cP
• Tensile Strength (Break): 4,440 psi
• Elongation: 3 %
• Features: Epoxy (EP)

Description: Parker LORD® 320/322 Epoxy Adhesive is a two component, general purpose epoxy system that is used for primerless bonding to automotive sheet molded compounds, rubber, plastics, polyester thermosets, and prepared metals. It is resistant to sunlight, humidity, extreme

• Viscosity: 300,000 to 2,000,000 cP
• Tensile Strength (Break): 4,440 psi
• Elongation: 3 %
• Features: Epoxy (EP)

Description: Parker LORD® 320 General Purpose Epoxy Adhesive Resin Part A Off-White is a two component adhesive used for primerless adhesion to automotive sheet molded compounds. It offers durability, contains no solvent, and resists humidity, sunlight, other temperature extremes. 5

• Viscosity: 300,000 to 1,000,000 cP
• Tensile Strength (Break): 4,440 psi
• Elongation: 3 %
• Industry: Automotive

Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile

• Use Temperature: 572 F
• Thermal Conductivity: 1 W/m-K
• Coeff. of Thermal Expansion (CTE): 11.11111111111111 to 62.22222222222222 µin/in-F
• Dielectric Constant: 5.19

Description: setting. We most often see industrial epoxy resins being used in the following industries: • Automotive • Automotive electronics • Consumer electronics • EV and fuel cell manufacturing With a large array of different types of epoxy resins readily available, our selection

• Viscosity: 120,000 cP
• Industry: Automotive
• Features: Epoxy (EP)
• Substrate Compatibility: Rubber / Elastomer

Description: EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive.

• Viscosity: 80,000 to 120,000 cP
• Use Temperature: 482 F
• Coeff. of Thermal Expansion (CTE): 36.666666666666664 to 137.77777777777777 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.17

Description: enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Use Temperature: 446 F
• Industry: Aerospace, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: Die Bonding Adhesive / Compound, Electrical Insulating / Dielectric, Epoxy (EP), Filled, Gap Filling Sealant / FIP Gasket, Laminating / Composites, Liquid, Non-corrosive Cure
• Substrate Compatibility: Dissimilar Substrates

Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile

• Viscosity: 45,000 to 65,000 cP
• Use Temperature: 662 F
• Thermal Conductivity: 1.3 W/m-K
• Coeff. of Thermal Expansion (CTE): 11.666666666666666 to 52.77777777777778 µin/in-F

Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile

• Viscosity: 5,000 to 7,000 cP
• Use Temperature: 662 F
• Thermal Conductivity: 0.4 W/m-K
• Coeff. of Thermal Expansion (CTE): 16.666666666666668 to 42.22222222222222 µin/in-F

Description: useful in polyamide resins, hot melt adhesives, polyurethanes and epoxies. It is preferred for epoxy coatings when used as a formulated adduct and is particularly useful in the preparation of concrete sealers, glossy decorative floor coatings, and flexible coatings and for outdoor

• Applications: Adhesives / Sealants
• Function: Catalyst, Initiator

Description: non-toxic, water-based compound which is non-flammable and contains no solvents or volatile compounds. It can also be used in automotive exhaust applications, in headers, manifolds, catalytic converters and exhaust ports. Makes reliable high temperature repairs Excellent adhesion to cast

• Features: Epoxy (EP)
• Substrate Compatibility: Metal
• Cure / Technology: Single Component System

Description: These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and

• Viscosity: 50,000 to 100,000 cP
• Dielectric Constant (Relative Permittivity): 4
• Industry: Automotive, Electrical Power / HV, Electronics, OEM / Industrial
• Substrate Compatibility: Ceramic / Glass, Concrete / Masonry, Dissimilar Substrates, Metal, Plastic, Rubber / Elastomer, Textiles / Fabrics, Wood / Wood Product

Description: G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than

• Use Temperature: 600 F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, OEM / Industrial
• Features: Electrically Conductive, Epoxy (EP), Grease / Paste
• Cure / Technology: Single Component System, Thermosetting / Crosslinking

Description: Hernon 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond 397 will change from amber-yellow to a reddish brown upon cure. Product Benefits •

• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: Encapsulating / Potting, Epoxy (EP)
• Cure / Technology: Single Component System, Thermosetting / Crosslinking

Description: adhesive properties of a traditional adhesive. This product is unique in that it also requires strong electrical resistance, thereby broadening its range of possible applications. To achieve this, the G6E-TSHV™ Epoxy is formulated with a blend of proprietary nanomaterials,

• Viscosity: 400,000 to 450,000 cP
• Use Temperature: 77 to 302 F
• Thermal Conductivity: 2.9 W/m-K
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Medical / Food (Sanitary / FDA)

Description: DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at

• Viscosity: 80,000 to 85,000 cP
• Use Temperature: 77 to 302 F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Grease / Paste, Other, Specialty / Other

Description: fillers. This epoxy is low cost as compared to high temperature silver epoxy. Curing of G6E-HTC™ epoxy requires a heating oven. Uses for G6E-HTC™ epoxy include casting, coating, encapsulation, grounding, medical device manufacture and repair, etc. FEATURES: · Higher Glass

• Viscosity: 18,000 to 420,000 cP
• Use Temperature: 600 F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Grease / Paste, Other, Specialty / Other

Description: Silver filled epoxy system for coating tantalum capacitor slugs. This product offers ideal protection from moisture and excellent high temperature operation. Consistent operation of 175C is typical. The product is design for use with dipping machines and requires only one blotting stage.

• Viscosity: 1,000 cP
• Industry: Automotive, Electrical Power / HV, Electronics, OEM / Industrial, Semiconductors / IC Packaging
• Features: Electrically Conductive, Epoxy (EP), Filled, Impregnating Resin, Liquid, Thermal / Heat Conductive
• Substrate Compatibility: Metal

Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold

• Use Temperature: 380 F
• Applications: Aerospace, Automotive / Transportation
• Material: Carbon / Graphite

Description: Fiber reinforced composite-metal hybrids are of great interest in automotive industry because of their excellent mechanical properties and light-weighting potential. Adhesive bonding is a preferred joining technique for manufacturing fiber reinforced composite metal hybrids. Metal

Description: Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair

• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Cure / Technology: Room Temp. Cure / Vulcanizing
• Chemical System: Silicone
• Features: Thermal / Heat Conductive

Description: Product Overview A high-performance, one-component epoxy adhesive designed for bonding applications in electronics manufacturing. It provides excellent adhesion to a variety of substrates, including metals, ceramics, and plastics, making it versatile for diverse assembly needs. This

• Substrate Compatibility: Ceramic / Glass, Metal, Plastic
• Industry: Electronics, Semiconductors / IC Packaging
• Features: Liquid, Thermal / Heat Conductive
• Cure / Technology: Single Component System

Description: 3M™ ScotchCode™ Wire Marker Tape Refill Roll 5.5 mil reinforced flame-retardant epoxy film tape with an acrylic high tack pressure-sensitive adhesive. Tape resists abrasion, oil and water. Excellent adhesion to clean Neoprene™, Hypalon, nylon and PVC insulation materials. Marking all

Description: 3M™ ScotchCode™ Wire Marker Tape Refill Roll 5.5 mil reinforced flame-retardant epoxy film tape with an acrylic high tack pressure-sensitive adhesive. Tape resists abrasion, oil and water. Excellent adhesion to clean Neoprene™, Hypalon, nylon and PVC insulation materials. Marking all

Description: Tuffbond® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond® 315

• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: Ceramic / Inorganic Cement, Encapsulating / Potting, Epoxy (EP), Specialty / Other

Description: to the cone has been a challenge for engineers, specifically when the adhesive temperature resistance requirement is above 200°F (93°C). Two component epoxy was commonly used for this application, but limitations such as mixing ratio, cure speed, potential solidification in equipment

• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: Epoxy (EP), Specialty / Other
• Cure / Technology: Single Component System, Thermosetting / Crosslinking, Two Component System