BMI Resin

Description: 4000 prepreg system features a toughened bismaleimide (BMI) resin system specifically formulated for aircraft primary structures demanding enhanced strength and toughness in high service temperature environments up to 450°F (232°C).When compared to other BMI prepregs on the

Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold

• Use Temperature: 450 F
• Applications: Aerospace, Industrial OEM
• Material: Carbon / Graphite
• Features: Other

Description: LOCTITE® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications Electrically conductive Thermally conductive Good dispensing characteristics Hydrophobic

• Coeff. of Thermal Expansion (CTE): 34.44444444444444 µin/in-F
• Tensile Strength (Break): 107,037.187445611 psi
• Features: Electrically Conductive Compound (Adhesive, Grease)
• Industry: Electronics, OEM / Industrial

Description: ULTRATHERM TM resins are high performance polyimide wire enamels. Applied in the form of a polyamic acid solution, the resin is converted with heat to a continuous film coating resulting in excellent resistance to radiation, chemicals, and cryogenic temperatures.

• Features: Bismaleimide (BMI)
• Industry: Electric Power, Electronics
• Type: Thermoset

Description: TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has

• Deflection Temperature (@ 264 psi, 1.8 MPa): 600 F
• Thermal Conductivity: 0.220668687 W/m-K
• Coeff. of Thermal Expansion (CTE): 30.000000000000004 µin/in-F
• Tensile Strength (Break): 17,110 psi

Description: LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste LOCTITE® ABLESTIK QMI538NB is a non-conductive die attach paste designed for applications which require very low stress and robust mechanical properties. Please refer to the TDS for alternate cure schedules.

• Viscosity: 8,200 cP
• Coeff. of Thermal Expansion (CTE): 32.77777777777778 µin/in-F
• Features: Electrically Insulating / Dielectric
• Substrate Compatibility: Plastic

Description: LOCTITE ABLESTIK QMI529HT-LV, BMI Hybrid, Die Attach, Conductive Adhesive LOCTITE® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications Electrically conductive Thermally conductive Good dispensing characteristics

• Coeff. of Thermal Expansion (CTE): 34.44444444444444 µin/in-F

Description: Producing holes in high-resin materials, with increasing demands on delamination and splintering, can be optimized with the drill geometry design. The CoroDrill geometries is designed to improve hole entrance and exit quality on carbon fiber materials with high fiber content. Benefits

• Cutting Diameter: 0.157 to 0.5 inch
• Cutting Application: Aluminum, Bronze / Brass / Copper, Plastic
• Material: Carbide
• Features: Coated, Other

Description: materials include carbon fiber, Zylon fiber and glass fiber composites using a range of epoxy, cyanate ester and BMI-based resin systems. Our technology includes the winding of multi-filament tows directly over the rotor to be contained, or the production of sleeves which are pressed

• Use Temperature: 338 F
• Industry: Aerospace, Automotive, OEM / Industrial
• Features: Encapsulant / Potting Compound, Other, Specialty / Other