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Supplier: Toray Composite Materials America, Inc.
Description: 4000 prepreg system features a toughened bismaleimide (BMI) resin system specifically formulated for aircraft primary structures demanding enhanced strength and toughness in high service temperature environments up to 450°F (232°C).When compared to other BMI prepregs on the
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Description: • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold storage Mitsubishi Chemical Carbon Fiber and Composites is dedicated to constantly expanding our machine capability and improving our technical responsiveness to the market through new product development and
- Applications: Aerospace, Industrial OEM, Other
- Material Type: Carbon / Graphite
- Use Temperature: 450 F
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Supplier: ELANTAS North America LLC
Description: ULTRATHERM TM resins are high performance polyimide wire enamels. Applied in the form of a polyamic acid solution, the resin is converted with heat to a continuous film coating resulting in excellent resistance to radiation, chemicals, and cryogenic temperatures.
- Chemical / Polymer System Type: Bismaleimide (BMI)
- Industry: Electric Power, Electronics
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Description: LOCTITE® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications Electrically conductive Thermally conductive Good dispensing characteristics Hydrophobic
- Coeff. of Thermal Expansion (CTE): 34.44 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics
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Supplier: Ensinger North America
Description: TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has
- Chemical / Polymer System Type: Bismaleimide (BMI)
- Coeff. of Thermal Expansion (CTE): 30 µin/in-F
- Deflection Temperature (@ 264 psi, 1.8 MPa): 600 F
- Dielectric Constant: 4.2
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste LOCTITE® ABLESTIK QMI538NB is a non-conductive die attach paste designed for applications which require very low stress and robust mechanical properties. Please refer to the TDS for alternate cure
- Coeff. of Thermal Expansion (CTE): 32.78 µin/in-F
- Features: Electrically Insulating / Dielectric
- Substrate / Material Compatibility: Plastic
- Viscosity: 8200 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach LOCTITE® ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus and high adhesion at wirebond temperatures making the material suitable for
- Coeff. of Thermal Expansion (CTE): 20 µin/in-F
- Features: Electrically Insulating / Dielectric
- Thermal Conductivity: 0.6000 W/m-K
- Viscosity: 10900 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive LOCTITE® ABLESTIK QMI519LB silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed to achieve UPHs several orders of
- Coeff. of Thermal Expansion (CTE): 22.22 µin/in-F
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Supplier: Sandvik Coromant Co.
Description: : CFRP fiber rich materials – CoroDrill 854 CFRP/Aluminum stacked materials – CoroDrill 854 CFRP resin rich materials – CoroDrill 856 Composite materials with, for example, glass layers – CoroDrill 856 BMI – high-temperature resistant
- Coating / Finish: Coated
- Construction: Solid Construction
- Cutting Application: Aluminum, Bronze / Brass / Copper, Plastic, Other
- Cutting Diameter: 0.1570 to 0.5000 inch
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Supplier: Arnold Magnetic Technologies
Description: operates up to 170°C WRAPTITE MATERIALS OPTIONS Wraptite composite materials include carbon fiber, Zylon fiber and glass fiber composites using a range of epoxy, cyanate ester and BMI-based resin systems. Our technology includes the winding of multi-filament tows directly over the
- Chemical / Polymer System Type: Specialty / Other
- Cure Type / Technology: Specialty / Other
- Form / Function: Encapsulant / Potting Compound
- Industry Applications: Aerospace, Automotive, OEM / Industrial, Other
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Static and dynamic mechanical properties of modified bismaleimide and cyanate ester interpenetrating polymer networks
Abstract Interpenetrating polymer networks (IPNs) based on different ratios of modified bismaleimide ( BMI ) resin [BMI/2,2′‐diallylbisphenol A (DBA)] and cyanate ester (CE) (b10) have been synthesized via prepolymerization followed by thermal curing.
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Thermal properties of new bismaleimide resins containing hydrogen silsesquioxane and diallyl bisphenol A
Abstract Bismaleimide ( BMI ) resins modified with hydrogen silsesquioxane (HSQ) and diallyl bisphenol A (DABPA) (BMI‐HSQ‐DABPA resins) were prepared.
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Synthesis and properties of silicon‐containing bismaleimide resins
… monomers containing silicon atom in the structure, i.e., bis[4‐(4‐maleimidophenylcarbonyloxy)phenyl]dimethylsilane (BMI‐SiE1) and bis[4‐(4‐maleimidophenyloxycarbonyl)phenyl]dimethylsilane (BMI‐SiE2), were designed, synthesized, and polymerized with and without the use of diamine as comonomers to yield novel silicon‐containing BMI resins .
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Preparation and properties of modified bismaleimide resins by novel bismaleimide containing 1,3,4‐oxadiazole
Bismaleimide ( BMI ) resin is a high‐performance thermosetting polymer, but its inherent brittleness hinder a broader range of application.
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The tribological properties of benzoxazine‐bismaleimides composites with functionalized nano‐SiO 2
Abstract To improve the tribological properties of benzoxazine (BOZ) resin, bismaleimides ( BMI ) resin is chosen as organic phase, hyperbranched polysilane functionalized SiO2 nanoparticles (HBPSi‐SiO2) are chosen as inorganic modifiers to prepare HBPSi‐SiO2/BOZ‐BMI composites using high shear and ultrasonic processes.
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Organic/inorganic hybrid bismaleimide resin with octa(aminophenyl)silsesquioxane
Modification of a bismaleimide ( BMI ) resin with OAPS and dipropargyl ether of bisphenol A (DPBPA) was investigated.
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Study on Properties of Low Dieletric loss Resin Matrix
One new high performance modified BMI resin matrix with enhanced processing characteristics, made from 4,4-bismaleimidodiphenyl methane (BDM) and allyl phenyl compounds, allyl epoxy resins and epoxy acrylate resins, were developed.
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Study on properties of low dielectric loss resin matrix
Abstract Allyl phenyl compounds, allyl epoxy resins, and epoxy acrylate resins are adapted to copolymerize with bismaleimide ( BMI ) resins and to modify mechanical properties and processing properties.
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Cure behavior and properties of an epoxy resin modified with a bismaleimide resin
Abstract A bismaleimide ( BMI ) resin was added to an epoxy system composed of N,N′‐tetraglycidyldiaminodiphenyl methane (TGDDM) and diaminodiphenyl methane (DDM).
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Cure behavior and thermal stability of an epoxy: new bismaleimide blends for composite matrices
Abstract A new bismaleimide ( BMI ) resin was synthesized to formulate epoxy(tetraglycidyl diaminodiphenyl methane; TGDDM) – bismaleimide thermoset blends for composite matrix applications.