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  • Bonding in Microsystem Technology
    Anodic bonding seals these parts.
  • Encyclopedia of Microfluidics and Nanofluidics
    The bond sealed up to the tested gage pressure of about 32,500 Pa which is high enough to seal against the pump pressures of typical microfluidic pumps (see Table 1).
  • Encyclopedia of Microfluidics and Nanofluidics
    The bond sealed up to the tested gage pressure of about 32,500 Pa which is high enough to seal against the pump pressures of typical microfluidic pumps (see Table 1).
  • Fuel Cell Science and Engineering: Materials Processes Systems and Technology 2 Volume Set
    Scott Weil Introduction 301 Solid Oxide Fuel Cells (SOFCs) 301 Functional Requirements for pSOFC Seals 304 Sealing Techniques 306 Rigid Bonded Seals 308 Glass and Glass – Ceramic Sealants 309 Ceramic Seals 318 Compressive Seals 319 Metal Gaskets 320 Mica-Based Seals …
  • Springer Handbook of Nanotechnology
    … A. Kovac: Silicon fusion bonding and deep reactive ion etching: A new technology for microstructures, Sens. Actuators A 52, 132–139 (1996) 52.55 C.H. Hsu, M.A. Schmidt: Micromachined struc- tures fabricated using a wafer- bonded sealed cavity process, Solid State …
  • Springer Handbook of Nanotechnology
    … T. A. Kovac: Silicon fusion bonding and deep reactive ion etching: A new technology for mi- crostructures, Sensors Actuators A 52, 132–139 (1996) 56.55 C. H. Hsu, M. A. Schmidt: Micromachined struc- tures fabricated using a wafer- bonded sealed cavity process.
  • http://dspace.mit.edu/bitstream/handle/1721.1/43545/38502766-MIT.pdf?sequence=2
    These micromechanical devices can be integrated monolithically with electronics using a wafer- bonded sealed cavity process and a low- temperature thermocompression metal-to-metal bonding technique.
  • Frick / Knöll building construction lesson 1
    … many cases component of "tubs" for seal against pressing water, either as component with high water penetrating resistance, briefly WU concrete (" white tub, " s. section 17.4.6), or as flat seal base for bonded seals (" black tubs, " …
  • Microsystems and Nanotechnology
    … 1996), “Silicon fusion bonding and deep reactive ion etching: A new technology for microstructures,” Sensors and Actuators, A52: 132 139 [48] Hsu C. H. and M. A. Schmidt, (1994), “Micromachined structures fabricated using a wafer- bonded sealed cavity process,” Solid …