Products/Services for CMP Paste
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Abrasive Compounds and Abrasive Slurries - (281 companies)Abrasive compounds and abrasive slurries are used to improve surface finish or flatness. They consist of fine abrasives in slurry, bar, powder, or paste form. Types of Abrasive Compounds and Abrasive Slurries There are many different types... -
Laps and Lapping Tools - (55 companies)Laps and lapping tools are used for precision surface finishing, often in conjunction with loose abrasive compounds. -
Buffs and Buffing Wheels - (106 companies)Buffs and buffing wheels are used to hold finishing compounds and polish parts made of metal, plastic, ceramic, glass, wood, stone, silicon, or optical materials. -
Chemical Mechanical Planarization (CMP) Slurries - (20 companies)Chemical mechanical planarization (CMP) slurries consist of surface active chemicals and microabrasive grains in a liquid dispersion. Chemical mechanical planarization (CMP) slurries are liquid dispersions containing active chemicals...
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Honing, Lapping, and Super-finishing Machines - (129 companies)...mirrors finishes are common), and produces a close fit between mating surfaces. Lapping media, compounds, pastes, or slurries consist of fine-grained loose abrasive particles suspended in a viscous or liquid carrier. Examples of carriers include... -
Superabrasives and Diamond Tools - (386 companies)Superabrasives and diamond tools include grinding wheels, abrasive saw blades, wheel dressers, single-point tools, and other products that use diamond or cubic boron nitride (CBM) abrasive grains.
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Semiconductor Foundry Services - (175 companies)Processes Performed. Semiconductor foundry services perform processes such as chemical mechanical polishing (CMP), physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing, dry etching, wet etching, photolithography, wafer...
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Semiconductor Wet Process Equipment - (122 companies)Semiconductor wet process equipment performs a variety of wet processing applications including etching, washing, chemical mechanical polishing (CMP), and spin coating in semiconductor or microelectronics manufacturing. Semiconductor wet process...
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Nanomaterials - (253 companies)...of biomarkers and cells, electronics such as mircoprocessors and nanorobotos,. NanopowdersImage Credit: TPL, INC. Composed of nanoparticles having an average diameter below 50nm. Targeted drug delivery, solid fuels, conducting pastes, and specialized...
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Solder - (266 companies)Solders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together. Solder is a metal alloy used to join metals together. The term...
Product News
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Beijing Grish Hitech Co., Ltd.
High-efficiency CMP Slurry The acidic pH value is stable, maintaininga high and stable polishing rate. Combines rough and fine polishing into a single process, greatly reducing process-ing costs and improving processingefficiency. The total time of traditional rough polishing and fine polishing is 6-9 hours, and high-efficiency CMP can be used for 2-3 hours to meet polishing requirements. After polishing with high-efficiency CMP, the Ra values that can be achieved on the carbon and silicon surfaces of silicon carbide... (read more)Browse Abrasive Compounds and Abrasive Slurries Datasheets for Beijing Grish Hitech Co., Ltd. -
MacDermid Alpha Electronics Solutions
Alpha® Solder Pastes Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for applications such as fine feature printing, low temperature processing, and many others. Alpha's (R) solder pastes are available in a wide range of alloy offerings, including low-Ag SACX Plus (R) that offers excellent soldering performance at an alloy cost approximately 30% less than SAC305. The SACX Plus (R) alloy is also offered in Alpha (R) solder bar, preforms, wire, and spheres for assured alloy... (read more)Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
Dongguan Sheen Electronic Technology Co., Ltd.
Thermal Paste for CPU and GPU Cooling High-performance CPUs and GPUs generate significant heat, and effective cooling depends on more than just the heatsink. Thermal paste plays a key role by filling the tiny air gaps between the chip and the heat sink, helping heat move out of the component more efficiently. This formula is designed for stable, long-term thermal contact under continuous operation. It conforms well to uneven surfaces, supports reliable heat transfer during repeated thermal cycling, and helps maintain consistent... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
MacDermid Alpha Electronics Solutions
Next-generation Ultra-low Voiding Solder Paste ALPHA OM-362, next-generation ultra-low voiding solder paste. This lead-free, zero-halogen, no-clean paste can deliver less than 10% voiding on Bottom Termination Components (BTCs). The design characteristics of BTCs create void removal challenges during the soldering process, which can lead to ineffective thermal dissipation and mechanical strength in post-reflow applications. Low-voiding solder pastes are an important material in improving board level reliability by reducing this effect... (read more)Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
MacDermid Alpha Electronics Solutions
New Packaging Option - ALPHA Argomax Sinter Paste To meet customer requirements, MacDermid Alpha is now able to supply a jar which has a hole in the bottom (dispense port) from which paste can be dispensed. The new jar with dispense port is in addition to standard jars and the 600 gram and 3000 gram cartridges already available. The new jar reduces material waste, allowing customers to utilize >=99% of the ALPHA Argomax sinter paste, and reduces downtime changing containers with the jar available in sizes up to 250 grams. The jar is compatible... (read more) -
Keystone Electronics Corp.
New 20mm Pin-In-Paste Coin Cell Retainers Keystone Electronics has introduced Pin-in-Paste packaging for their popular thru-hole mountable coin cell battery retainers. These new, retainers are specifically designed for Pin-in-Paste (PIP) soldering using solder paste and reflow technology to attach through-hole (THM) components to a printed circuit board (PCB). Using these new retainers allows users to solder simultaneously in a single reflow cycle, which can save time, reduce costs, and decrease thermal stress on the board... (read more)Browse Battery Holders Datasheets for Keystone Electronics Corp. -
Dongguan Sheen Electronic Technology Co., Ltd.
High-Temperature Thermal Paste for Food Utensils making low thermal resistance essential. After multiple material evaluations failed during high-temperature aging tests, the customer tested Sheen SG560 thermal paste. During validation, SG560 demonstrated excellent wettability, forming a uniform interface with a minimum bond line thickness of 0.05 mm, effectively eliminating air gaps. Long-duration exposure at 150 C showed no hardening, no powdering, and no loss of thermal performance. With a deformation temperature exceeding 200 C, the material... (read more)Browse Conductive Compounds Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
ARDE Barinco, Inc.
Mix, Knead, Stir High Viscosity Mixtures and Paste The helical blades create a positive folding action that results in fast, efficient mixing of high-viscosity liquids, pastes, dry or moist powders...even media as viscous as wet sand. All Double Helixx mixers ensure thorough mixing throughout the entire batch because they operate in planetary fashion. Larger models accomplish this by either a motorized base that rotates the mixing vessel, or mechanical rotation of the dual mixing tools themselves. Medium-size models have a free-swivelling base... (read more)Browse Industrial Mixers Datasheets for ARDE Barinco, Inc. -
MacDermid Alpha Electronics Solutions
ALPHA® OM-565 HRL3 Low Temperature Solder Paste ALPHA OM-565 HRL3 low temperature solder paste is designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 C and superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HIP). The ALPHA OM-565 chemistry enhances electrochemical performance over existing low melt point solders and provides excellent compatibility when used in combination with alternative ALPHA... (read more)Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
MacDermid Alpha Electronics Solutions
ALPHA OM-220 Ultra-low Temperature Solder Paste ALPHA OM-220 innovative chemistry enables peak reflow temperatures below 150 C, making it ideal for soldering heat sensitive components and sub-assemblies. ALPHA OM-220 permits cascaded / hierarchical soldering, as well as novel hermetic sealing solutions. This technology is well suited for a broad range of end use applications including computers, smartphones, various consumer electronics, in-cabin automotive electronics, and medical devices. Key Benefits: Low reflow peak temperature < 150 C. (read more)Browse Solder Datasheets for MacDermid Alpha Electronics Solutions
More Information
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Physicochemical Properties and Biocompatibility of White Dextrin Modified Injectable Calcium–Magnesium Phosphate Cement
The results showed that WD imparted anti‐washout to the as‐ CMP paste , whereas MPC simultaneously improved the paste anti‐washout and fast‐setting.
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Vasovagal Syncope
Table 23.2 Clinical features suggesting a cardiac etiology of syncope Family history: Early myocardial infarction Unexplained sudden death in family members <40 years old Known familial arrhythmia or heart disease (LQTS, SQTS, CMP ) Past medical history: Symptoms suggesting heart disease Known …
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Effect of rhBMP‐2 on tibial plateau fractures in a canine model
In the BMP and CPX groups, the BMP or CMP paste was then injected into the subchondral void using a 3.0 cc syringe and 18-gauge spinal needle.
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Microelectronic Applications of Chemical Mechanical Planarization
Past CMP technologies have been notorious for the high number of defects they produce and as a consequence actually slowing yield learning rather than enhancing it.
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http://dspace.mit.edu/bitstream/handle/1721.1/3901/IMST005.pdf?sequence=2
Past CMP test masks have generally consisted primarily of “up” regions with smaller areas of down .
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Curating Research Careers The Cedar Mesa Project, Uta
The publications, reports, and records produced by past CMP research .
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First Joint Meeting of The Wound Healing Society and the European Tissue Repair Society
Collagen Microbeads Paste ( CMP ) is a sterile paste of microbeads prepared with human type Ill+I collagen (crosslinked by periodic acid) by a prilling process (Dumas et al., 1992, Drug Dev.
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http://dspace.mit.edu/bitstream/handle/1721.1/17983/57189433-MIT.pdf?sequence=2
In Chapter 2, we provided an in depth examination of past CMP .
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Pharmacist prescribing in Northern Ireland: a quantitative assessment
In this present study, onerous paperwork associated with the CMP was cited as a barrier when pharmacists first qualified; in the past CMPs (supplementary prescribing only) were con- sidered restrictive, time consuming and unsuitable in get- ting agreement from the IP [8].
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A diode-based bolometer implemented on micromachined CMOS technology for terahertz radiation detection
[4] Courtois, B., Di Pendina, G., and Torki, K., “MEMS fabrication at CMP : past and present,” MEMS: Technology, Fabrication Processes and Applications, Nova Science Publishers, (2009).
