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Supplier: ASTM International
Description: expansion of a plastic is composed of a reversible component on which are superimposed changes in length due to changes in moisture content, curing, loss of plasticizer or solvents, release of stresses, phase changes and other factors. This test method is
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Supplier: ASTM International
Description: 1.1 This test method covers determination of the coefficient of linear thermal expansion for plastic materials having coefficients of expansion greater than 1 x 106 1°C by use of a vitreous silica dilatometer. At the test temperatures and under
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Supplier: ASTM International
Description: 1.1 This test method covers determination of the coefficient of linear thermal expansion for plastic materials having coefficients of expansion greater than 1 × 10-6/°C by use of a vitreous silica dilatometer. At the test temperatures and under
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Supplier: ASTM International
Description: 1.1 This test method covers determination of the coefficient of linear thermal expansion for plastic materials having coefficients of expansion greater than 1 × 10-6/°C by use of a vitreous silica dilatometer. At the test temperatures and under
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Supplier: Henkel Corporation - Electronics
Description: (Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant ) LOCTITE ECCOBOND 933 one component epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimized stress effects on components and wiring
- Industry: Electronics
- Use: Encapsulant / Potting Compound
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Description: ISO 18903:2002 specifies a method for determining the dimensional change of photographic films and papers caused by: variations in equilibrium moisture content due to change in the relative humidity (RH) of the atmosphere (humidity coefficient of expansion);
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Supplier: Adhesives.org
Description: process. The normal variation of temperature and moisture in the service environment causes the adherends and the adhesive to swell and shrink. The adherends and adhesive are likely to have different thermal and moisture coefficients of expansion.
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Supplier: CSA Group
Description: ISO 18903:2002 specifies a method for determining the dimensional change of photographic films and papers caused by: variations in equilibrium moisture content due to change in the relative humidity (RH) of the atmosphere (humidity coefficient of expansion);
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Supplier: Port Plastics, Inc.
Description: SUSTADUR® PET consists of a thermoplastic polyester that is a semi-crystalline material. This material offers good wear resistance, excellent dimensional stability, very low moisture absorption, high wear resistance, high tensile strength and stiffness, and low coefficient
- Industry: Other
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Supplier: Wacker Chemical Corp.
Description: weathering, ageing, moisture, and UV light. The fully cured rubber can withstand expansioncompression cycles for many years and is therefore especially well suited for joining materials with different coefficients of thermal expansion. The vulcanized silicone rubber
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temperature Curing, Reactive / Moisture Cured, Single Component System
- Elongation: 300 %
- Industry: OEM / Industrial
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Supplier: Wacker Chemical Corp.
Description: cycles for many years and is therefore especially well suited for joining materials with different coefficients of thermal expansion. The vulcanized silicone rubber permanently remains elastic over a wide temperature range from -50 °C to +150 °C (-58 °F to +302 °F).
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temperature Curing, Reactive / Moisture Cured, Single Component System
- Elongation: 350 %
- Features: Non-corrosive Cure
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Viscosity: 360500 cP
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Supplier: Norplex-Micarta
Description: P95 consists of woven glass fabric with polyimide resin. The product is engineered to maintain excellent physical properties at 240°C, making it suitable for high temperature applications. It offers a low coefficient of thermal expansion, as well as high mechanical
- Form / Shape: Film / Sheet
- Industry: Electronics
- Material Type / Grade: Flame Retardant (e.g. UL 94 Rated), UL Approved
- Reinforcement / Filler Material: Fabric, Fiber Glass
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Description: nitride has graphite layered structure, showing loose, lubricating, easy to absorb moisture, light weight and other properties of white powder, so it is also called “white graphite”. The expansion coefficient of hexagonal boron nitride is equivalent to that
- Coeff. of Thermal Expansion (CTE): 2 µm/m-C
- Density: 2.27 g/cc
- Material Type: Boron Nitride, Specialty Ceramic
- Shape / Form: Spout / Nozzle (Launder Pouring / Atomization)
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Description: nitride has graphite layered structure, showing loose, lubricating, easy to absorb moisture, light weight and other properties of white powder, so it is also called “white graphite”. The expansion coefficient of hexagonal boron nitride is equivalent to that
- Coeff. of Thermal Expansion (CTE): 2 µm/m-C
- Density: 2.27 g/cc
- Material Type: Boron Nitride, Specialty Ceramic
- Thermal Conductivity: 33 W/m-K
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Description: nitride has graphite layered structure, showing loose, lubricating, easy to absorb moisture, light weight and other properties of white powder, so it is also called “white graphite”. The expansion coefficient of hexagonal boron nitride is equivalent to that
- Coeff. of Thermal Expansion (CTE): 2 µm/m-C
- Density: 2.27 g/cc
- Material Type: Boron Nitride, Specialty Ceramic
- Thermal Conductivity: 33 W/m-K
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Description: nitride has graphite layered structure, showing loose, lubricating, easy to absorb moisture, light weight and other properties of white powder, so it is also called “white graphite”. The expansion coefficient of hexagonal boron nitride is equivalent to that
- Coeff. of Thermal Expansion (CTE): 2 µm/m-C
- Density: 2.27 g/cc
- Material Type: Boron Nitride, Specialty Ceramic
- Thermal Conductivity: 33 W/m-K
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Supplier: MCA - Advanced Materials Division
Description: Techtron® 1000 Polyphenylene Sulfide PPS shapes exhibit outstanding dimensional stability due to their minimal moisture absorption and low coefficient of linear thermal expansion, and easy machinability to close tolerances. Due to these characteristics, this unfilled
- Chemical / Polymer System Type: Polysulphide / PPS
- Form / Shape: Plate, Rod / Round Stock
- Industry: Other
- Overall Length: 24 to 48 inch
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Supplier: DuPont Electronics & Imaging
Description: dimensional stability, lay-?at, high modulus, and a coef?cient of thermal expansion match to copper. Kapton® EN is offered in a wide range of thickness from 5 µm ultra-thin to 50 µm thick, which provides more design ?exibility to the customer. The excellent
- Applications: Electronics / Microelectronics, Other
- Applications & Features: Dielectric
- Materials Processed: Specialty / Other
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Supplier: Thermal Ceramics
Description: Low biopersistence Low moisture absorbency Good tensile strength Constant coefficient of friction Wear resistance Improved control of thermal expansion
- Type: Specialty / Other
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Supplier: Greene, Tweed & Co.
Description: structural and mechanical parts; improve most mechanical properties, including strength and stiffness; non-conductive; provides dimensional stability Carbon fibers best strength and stiffness performance; lower density than glass; low coefficient of expansion; improved creep
- Chemical / Polymer System Type: PEEK, Specialty / Other
- Filler Material: Aramid Fiber, Carbon / Graphite, Fiber Glass
- Industry: Aerospace, Electric Power, Semiconductor / IC's
- Material Type / Grade: Composite Material, Thermoplastic
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Supplier: Gelest, Inc.
Description: ; Triethoxyethylsilane Viscosity: 0.70 cSt ?Hvap: 32.6 kJ/mol ?c of treated surfaces: 26.3 mN/m Vapor pressure, 50 °C: 10 mm Critical temperature: 314 °C Specific heat: 1.80 J/g/° Coefficient of thermal expansion: 1.5 x 10-3 Trialkoxy silane
- Flash Point: 104 F
- Ionic Component: Metalloids (B, Si, Ge, etc.), Non-Metals (C, N, O, P, S)
- Purity: 97 %
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Inorganic Chemicals and Compounds - N-(2-AMINOETHYL)-3-AMINOPROPYLTRIMETHOXYSILANE, 98% -- SIA0591.1Supplier: Gelest, Inc.
Description: l)prpyl]ethylenediam ine, DAMO Diamino functional trialkoxy silane Viscosity: 6.5 cSt ?c of treated surfaces: 36.5 mN/m Specific wetting surface: 358 m2/g Coefficient of thermal expansion: 0.8x10-3
- Flash Point: 302 F
- Ionic Component: Metalloids (B, Si, Ge, etc.), Non-Metals (C, N, O, P, S)
- Purity: 98 %
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Supplier: Gelest, Inc.
Description: .44 cSt ?Hcomb: 3,483 kJ/mol ?Hform: 716 kJ/mol Dipole moment: 1.33 debye Vapor pressure, 36 °C: 100 mm Coefficient of thermal expansion: 1.3 x 10-3 Provides hydrophobic surface treatments in vapor phase applications Dialkoxy silane
- Ionic Component: Metalloids (B, Si, Ge, etc.), Non-Metals (C, N, O, P, S)
- Purity: 99 %
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Supplier: Gelest, Inc.
Description: ; Dimethoxydimethylsil ane Contains methanol Viscosity, 20 °: 0.44 cSt ?Hcomb: 3,483 kJ/mol ?Hform: 716 kJ/mol Dipole moment: 1.33 debye Vapor pressure, 36 °C: 100 mm Coefficient of thermal expansion: 1.3 x 10-3 Provides hydrophobic surface treatments in vapor phase applications
- Flash Point: 17.6 F
- Ionic Component: Metalloids (B, Si, Ge, etc.), Non-Metals (C, N, O, P, S)
- Purity: 95 %
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Supplier: FX PCB Co., Ltd.
Description: low dissipation factor, ensuring minimal signal loss and superior signal integrity in high-frequency circuits. Thermal Stability: With a high glass transition temperature and low coefficient of thermal expansion, PTFE PCBs remain stable and reliable even in extreme temperature
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Supplier: Polyplastics USA, Inc.
Description: thermal expansion coefficient give the resin superior dimensional stability. Electrical properties are also superior, and only small changes in electrical properties are exhibited as a result of moisture absorption. Dielectric breakdown voltage is also high. Both
- Chemical / Polymer System Type: Polyester (PET, PBT)
- Coeff. of Thermal Expansion (CTE): 22.22 to 55.56 µin/in-F
- Compound Type: Molding Resin
- Deflection Temperature (@ 264 psi, 1.8 MPa): 403 F
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Supplier: Nytef Group
Description: many amorphous materials that tend to steadily lose strength as temperatures increase, UNINOR PPO maintains its high stiffness to temperatures in excess of 200°F. In addition, it’s low moisture absorption and low coefficient of thermal expansion contribute to it
- Chemical / Polymer System Type: Polyphenylene Oxide (PPO)
- Elongation: 5 %
- Filler Material: Fiber Glass
- Form / Shape: Plate, Rod / Round Stock
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Supplier: Nytef Group
Description: properties. Unlike many amorphous materials that tend to steadily lose strength as temperatures increase, UNINOR PPO maintains its high stiffness to temperatures in excess of 200°F. In addition, it’s low moisture absorption and low coefficient of thermal expansion
- Chemical / Polymer System Type: Polyphenylene Oxide (PPO)
- Elongation: 25 %
- Filler Material: Unfilled
- Form / Shape: Plate, Rod / Round Stock
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Supplier: Nytef Group
Description: exhibits excellent toughness. UNITRON PPS’s extremely low moisture absorption rate and its low coefficient of thermal expansion contribute to this being one of the most dimensionally stable thermoplastic materials available. UNITRON PPS offers superior electrical
- Chemical / Polymer System Type: Polysulphide / PPS
- Elongation: 6 %
- Form / Shape: Plate, Rod / Round Stock
- Hollow / Tubular Stock: Yes
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Supplier: Total Plastics, Inc.
Description: coefficient of linear thermal expansion, combined with Quadrant’s proprietary stress relieving processes, make these PPS products ideally suited for precise tolerance machined components. In addition, PPS products exhibit excellent electrical characteristics and are inherently
- Chemical / Polymer System Type: Polysulphide (PPS)
- Use Temperature: 425 F
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Supplier: CoorsTek
Description: , and making CeraCheck instrumentation especially useful in high temperature and high-humidity environments. Repeatable Accuracy In comparison to steel or granite, CoorsTek high-purity ceramic materials have a low coefficient of thermal expansion, providing consistent and
- Mounting / Loading Options: Handheld / Portable
- Type: Gage Block / Master
- Units: English, Metric
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Supplier: CoorsTek
Description: , and making CeraCheck instrumentation especially useful in high temperature and high-humidity environments. Repeatable Accuracy In comparison to steel or granite, CoorsTek high-purity ceramic materials have a low coefficient of thermal expansion, providing consistent and
- Mounting / Loading Options: Handheld / Portable
- Type: Gage Block / Master
- Units: English, Metric
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Supplier: CoorsTek
Description: , and making CeraCheck instrumentation especially useful in high temperature and high-humidity environments. Repeatable Accuracy In comparison to steel or granite, CoorsTek high-purity ceramic materials have a low coefficient of thermal expansion, providing consistent and
- Mounting / Loading Options: Handheld / Portable
- Type: Gage Block / Master
- Units: English, Metric
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Supplier: CoorsTek
Description: , and making CeraCheck instrumentation especially useful in high temperature and high-humidity environments. Repeatable Accuracy In comparison to steel or granite, CoorsTek high-purity ceramic materials have a low coefficient of thermal expansion, providing consistent and
- Mounting / Loading Options: Handheld / Portable
- Type: Gage Block / Master
- Units: English, Metric
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Supplier: Kuriyama of America, Inc.
Description: eliminates loss of strength from moisture absorption. Abrasion Resistant Polyurethane - Polyurethane cover provides exceptional cut, abrasion and fungus resistance. Slither® Cover - Cover is ultra slippery; allows hose to maneuver around and through difficult sewer bends
- Inside Diameter: 0.7500 inch
- Outside Diameter: 1.18 inch
- Product Form: Hose (including Duct)
- Temperature Range: 150 F
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Supplier: Kuriyama of America, Inc.
Description: eliminates loss of strength from moisture absorption. Abrasion Resistant Polyurethane - Polyurethane cover provides exceptional cut, abrasion and fungus resistance. Slither® Cover - Cover is ultra slippery; allows hose to maneuver around and through difficult sewer bends
- Inside Diameter: 0.6250 inch
- Material: Thermoplastics
- Outside Diameter: 0.9100 inch
- Product Form: Hose (including Duct)
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Supplier: Kuriyama of America, Inc.
Description: eliminates loss of strength from moisture absorption. Abrasion Resistant Polyurethane - Polyurethane cover provides exceptional cut, abrasion and fungus resistance. Slither® Cover - Cover is ultra slippery; allows hose to maneuver around and through difficult sewer bends
- Inside Diameter: 1.25 inch
- Outside Diameter: 1.8 inch
- Product Form: Hose (including Duct)
- Temperature Range: 150 F
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Supplier: Kuriyama of America, Inc.
Description: and eliminates loss of strength from moisture absorption. Abrasion Resistant Polyurethane - Polyurethane cover provides exceptional cut, abrasion and fungus resistance. Slither® Cover - Cover is ultra slippery; allows hose to maneuver around and through difficult sewer bends
- Inside Diameter: 0.2500 inch
- Material: Thermoplastics
- Outside Diameter: 0.5000 inch
- Product Form: Hose (including Duct)
Find Suppliers by Category Top
Featured Products Top
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Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications.
(read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
The Sporlan Type See-All moisture liquid indicator combines two functions of moisture and liquid indication into a single economical product. The indicator is a porous filter paper that is sensitive to moisture. A green dark color indicates the refrigerant is dry. A yellow color indicates (read more)
Browse Sight Windows Datasheets for Parker Sporlan Division -
Zerodur® (Schott Glass) Zerodur® is a glass ceramic with an extremely low thermal expansion coefficient. Zerodur is a glass ceramic made by Schott Glass that is designed and formulated to exhibit (read more)
Browse Glass Fabrication Services Datasheets for Insaco, Inc. -
resistivity and insulation properties prevent unwanted electrical interference and enhance circuit performance. Good Match with Silicon: AlN's thermal expansion coefficient closely matches that of silicon (read more)
Browse Specialty Ceramics Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
across the shell, roof, and base of the storage tank, with all joints and penetrations tightly sealed to prevent air or moisture ingress. Flexible connections can accommodate the tank’s expansion and contraction, while vapor barriers can control condensation and corrosion. Paying attention to these (read more)
Browse Insulation Jacketing Datasheets for Mid-Mountain Materials, Inc. -
coefficient of resistance (TCR) ensures minimal expansion under heat, maintaining consistent resistance and long-term stability. Isabellenhütte is experienced in developing high-reliability current-sense resistors for mission (read more)
Browse Current Sensing Resistors Datasheets for Isabellenhutte USA -
environments. Very low moisture uptake (0.03%) Other Characteristics of Fluon+PFA EA-2000 resins In addition to characteristics important to its use with CCL, these adhesive resins feature: Superior heat resistance (read more)
Browse Resins and Compounds Datasheets for AGC Chemicals Americas, Inc. -
alumina, thermal expansion rate similar to silicon, high specific strength, low density and non-toxic. Therefore, the "lightness" of electronic components using aluminum nitride ceramics is really enviable. But there are gains and losses. At present, aluminum nitride substrate is facing a big dilemma (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Key Features: Thermal conductivity exceeds 6 W/(m•K) Applicable in very thin bond lines Low thermal resistance Low coefficient of thermal expansion Used for bonding and sealing applications. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
What are the design considerations for step glass windows? Tolerance control of step height and width. Compatibility with mounting structure. Compatibility of coefficients of thermal expansion. Requirements for flatness and parallelism of optical surfaces. Environmental sealing performance (if required). (read more)
Browse Optical Windows Datasheets for Changchun Yutai Optics Co., Ltd.
Conduct Research Top
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Unfilled Liquid Crystal Polymers
. cryogenic temperatures without growing brittle, and have a low coefficient of thermal expansion.
More Information Top
Indicates content that may require registration and/or purchase.
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Investigation Into the Deterioration of Paintings, and Photographs using Computerized Modeling of Stress Development
the photographic gelatins cast in our laboratory and measured under quasi-equilibrium restrained conditions, once the nonlinear moisture coefficient expansion was taken into consideration.
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Electrochemical migration failure on FR-4 PCB by hygro-thermo-vapor pressure coupled analysis
Hygroscopic strains arise due to mismatch of coefficient moisture expansion (CME).
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An approach on underfill material selection for the low-k Flip Chip Plastic Ball Grid Array (FCPBGA)
comprehensive selection method by adding another three factors which were modeling, coefficient moisture expansion (CME) and filler settlement.
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Reliability analysis and hygro-thermo-mechanical design for MEMS-based pressure sensor
Differential swelling occurs along the interfacial materials and consequent hygroscopic stresses/strains arise due to mismatch of coefficient moisture expansion (CME).
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The humidity and thermal characteristics of die-attach (DA) and its impact on the package reliability
The Characteristics of all the materials in the SIP are showed in Table2, such as Young’s modulus (E), Poisson’s ratio (υ), Coefficient thermal expansion (CTE) and Coefficient moisture expansion (CME).
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Hygric characterization of woven glass/epoxy composites
moisture expansion coefficients are approximately 0.08 and 0.09, with a standarddeviation of 0.01.
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Polymer-coated fiber Bragg grating for relative humidity sensing
The resulting uncertainty in the measurement is 4%RH and the response time of the sensor and the moisture expansion coefficient of polyimide were obtained from a series of experimental investigations and cross compared with the results of previous work.
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Effects of moisture-dependent properties of constituents on the hygroscopic stresses in composite structures
The moisture expansion coefficient of the matrix was considered con- stant during the diffusion process, and the variations observed in Fig. 2 were caused only by the moisture-dependent mechanical properties.
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Integrated Theory for Predicting the Hygrothermomechanical Response of Advanced Composite Structural Components
The per- centage dimensional changes versus weight changes ( moisture expansion coefficients ) are summarized in Table 2.
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Moisture and transverse dimensional changes during air-drying of small green hardwood wafers
In this paper, the term ,, moisture expansion coefficient " X is defined as follows: X=aS/aM .