Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: ASTM International
Description: 1.1 This test method covers the laboratory determination of the linear (one-dimensional) coefficient of thermal expansion of rock using bonded electric resistance strain gages. 1.2 This test method is applicable for unconfined pressure conditions over the
-
Supplier: ASTM International
Description: 1.1 This test method covers the laboratory determination of the linear (one-dimensional) coefficient of thermal expansion of rock using bonded electric resistance strain gauges. 1.2 This test method is applicable for unconfined pressure conditions over the
-
Supplier: ASTM International
Description: shall not be used for measurements on materials having a very low coefficient of expansion (less than 1 x 10 6 1°C). For materials having very low coefficient of expansion, interferometer or capacitance techniques are recommended. 1.2 The thermal
-
-
Supplier: ASTM International
Description: 1.1 This test method covers determination of the coefficient of linear thermal expansion for plastic materials having coefficients of expansion greater than 1 µm/(m.°C) by use of a vitreous silica dilatometer. At the test temperatures and under
-
Supplier: Henkel Corporation - Electronics
Description: (Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant ) LOCTITE ECCOBOND 933 one component epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimized stress effects on components and wiring
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
-
Description: ISO 18903:2002 specifies a method for determining the dimensional change of photographic films and papers caused by: variations in equilibrium moisture content due to change in the relative humidity (RH) of the atmosphere (humidity coefficient of expansion);
-
Supplier: CSA Group
Description: ISO 18903:2002 specifies a method for determining the dimensional change of photographic films and papers caused by: variations in equilibrium moisture content due to change in the relative humidity (RH) of the atmosphere (humidity coefficient of expansion);
-
Supplier: Adhesives.org
Description: bonding process. The normal variation of temperature and moisture in the service environment causes the adherends and the adhesive to swell and shrink. The adherends and adhesive are likely to have different thermal and moisture coefficients of expansion.
-
Supplier: Port Plastics, Inc.
Description: SUSTADUR® PET consists of a thermoplastic polyester that is a semi-crystalline material. This material offers good wear resistance, excellent dimensional stability, very low moisture absorption, high wear resistance, high tensile strength and stiffness, and low coefficient
- Features: Other
-
Supplier: MCA - Advanced Materials Division
Description: Techtron® 1000 Polyphenylene Sulfide PPS shapes exhibit outstanding dimensional stability due to their minimal moisture absorption and low coefficient of linear thermal expansion, and easy machinability to close tolerances. Due to these characteristics, this unfilled
- Overall Thickness: 0.25 to 2 inch
- Overall Width / O.D.: 24 to 48 inch
- Overall Length: 24 to 48 inch
- Tensile Strength (Break): 13,500 psi
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and
- Viscosity: 360,500 cP
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System
-
Supplier: Wacker Chemical Corp.
Description: especially well suited for joining materials with different coefficients of thermal expansion. The vulcanized silicone rubber permanently remains elastic over a wide temperature range from -50 °C to +150 °C (-58 °F to +302 °F).
- Use Temperature: -58 to 302 F
- Tensile Strength (Break): 362.5920983929925 psi
- Elongation: 350 %
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic, Textiles / Fabrics
-
Supplier: Norplex-Micarta
Description: P95 consists of woven glass fabric with polyimide resin. The product is engineered to maintain excellent physical properties at 240°C, making it suitable for high temperature applications. It offers a low coefficient of thermal expansion, as well as high mechanical
- Use Temperature: 392 F
- Water Absorption: 0.35 %
- Tensile Strength (Break): 40,000 to 48,000 psi
- Industry: Electronics
-
Supplier: Nytef Group
Description: steadily lose strength as temperatures increase, UNINOR PPO maintains its high stiffness to temperatures in excess of 200°F. In addition, it’s low moisture absorption and low coefficient of thermal expansion contribute to it being one of the most
- Overall Thickness: 0.25 to 4 inch
- Overall Width / O.D.: 0.375 to 8 inch
- Tensile Strength (Break): 15,000 psi
- Elongation: 5 %
-
Supplier: Gelest, Inc.
Description: Nakamura, M.; Ishimura, K. Langmuir 2008, 24, 12228. Safety Hazard Info oral rat, LD50: 12,300 mg/kg Packaging Under Nitrogen 2-(3,4-Epoxycyclohexyl)ethyltrimethoxysilane; (2-trimethoxysilylethyl)cyclohexyloxirane Epoxy functional trialkoxy silane Viscosity: 5.2 cSt Coefficient of
- Flash Point: 294.8 F
- Purity: 97 %
- Features: Metalloids (B, Si, Ge, etc.), Non-Metals (C, N, O, P, S)
-
Description: structure, showing loose, lubricating, easy to absorb moisture, light weight and other properties of white powder, so it is also called “white graphite”. The expansion coefficient of hexagonal boron nitride is equivalent to that of quartz, but its thermal
- Density: 2.2699985673415775 g/cc
- Thermal Conductivity: 33 W/m-K
- Coeff. of Thermal Expansion (CTE): 2 µm/m-C
- Specialty Ceramic Type: Boron Nitride
-
Description: structure, showing loose, lubricating, easy to absorb moisture, light weight and other properties of white powder, so it is also called “white graphite”. The expansion coefficient of hexagonal boron nitride is equivalent to that of quartz, but its thermal
- Density: 2.2699985673415775 g/cc
- Thermal Conductivity: 33 W/m-K
- Coeff. of Thermal Expansion (CTE): 2 µm/m-C
- Specialty Ceramic Type: Boron Nitride
-
Description: structure, showing loose, lubricating, easy to absorb moisture, light weight and other properties of white powder, so it is also called “white graphite”. The expansion coefficient of hexagonal boron nitride is equivalent to that of quartz, but its thermal
- Density: 2.2699985673415775 g/cc
- Thermal Conductivity: 33 W/m-K
- Coeff. of Thermal Expansion (CTE): 2 µm/m-C
- Specialty Ceramic Type: Boron Nitride
-
Description: structure, showing loose, lubricating, easy to absorb moisture, light weight and other properties of white powder, so it is also called “white graphite”. The expansion coefficient of hexagonal boron nitride is equivalent to that of quartz, but its thermal
- Density: 2.2699985673415775 g/cc
- Thermal Conductivity: 33 W/m-K
- Coeff. of Thermal Expansion (CTE): 2 µm/m-C
- Specialty Ceramic Type: Boron Nitride
-
Supplier: DuPont Electronics & Imaging
Description: coefficient of thermal expansion match to copper. Kapton® EN is offered in a wide range of thickness from 5 µm ultra-thin to 50 µm thick, which provides more design flexibility to the customer. The excellent electrical characteristics and chemical etchability inherent to Kapton®
- Features: Dielectric, Other, Specialty / Other
- Applications: Electronics / Microelectronics
-
Supplier: Thermal Ceramics
Description: conductivity Excellent shock resistance Low biopersistence Low moisture absorbency Good tensile strength Constant coefficient of friction Wear resistance Improved control of thermal expansion
- Features: Specialty / Other
-
Inorganic Chemicals and Compounds - N-(2-AMINOETHYL)-3-AMINOPROPYLTRIMETHOXYSILANE, 98% -- SIA0591.1Supplier: Gelest, Inc.
Description: 6.5 cSt γc of treated surfaces: 36.5 mN/m Specific wetting surface: 358 m2/g Coefficient of thermal expansion: 0.8x10-3 Coupling agent for polyamides, polycarbonates (e.g. in CDs), polyesters and copper/brass adhesion Film-forming coupling agent/primer, berglass size
- Flash Point: 302 F
- Purity: 98 %
- Features: Metalloids (B, Si, Ge, etc.), Non-Metals (C, N, O, P, S)
-
Supplier: Total Plastics, Inc.
Description: Natural PPS (polyphenylene sulfide) products offer the broadest resistance to chemicals of any advanced engineering plastic. They have no known solvents below 392°F (200°C) and offer inertness to steam, strong bases, fuels and acids. Minimal moisture absorption and a very low
- Use Temperature: 425 F
- Chemical System: Polysulphide (PPS)
-
Supplier: Greene, Tweed & Co.
Description: most mechanical properties, including strength and stiffness; non-conductive; provides dimensional stability Carbon fibers best strength and stiffness performance; lower density than glass; low coefficient of expansion; improved creep and wear resistance Aramid fibers low
- Industry: Aerospace, Electric Power, Semiconductor / IC's
- Filler: Aramid Fiber, Carbon / Graphite, Fiber Glass
- Material Type: Composite Material, Thermoplastic
- Chemical System: PEEK
-
Supplier: FX PCB Co., Ltd.
Description: signal loss and superior signal integrity in high-frequency circuits. Thermal Stability: With a high glass transition temperature and low coefficient of thermal expansion, PTFE PCBs remain stable and reliable even in extreme temperature environments. Chemical Resistance: PTFE is
-
Supplier: Gelest, Inc.
Description: ΔHvap: 33.9 kJ/mol Critical temperature: 272 °C Coefficient of thermal expansion: 1.4 x 10-3 Reacts to vinylate aryl halides under NaOH-moderated conditions Used as a tether in synthesis of C-glycosides Extensive review of silicon based cross-coupling agents:
- Boiling Point: 197.6 to 199.4 F
- Flash Point: 39.2 F
- Viscosity: 0.7 cps
- Purity: 97 %
-
Supplier: Kuriyama of America, Inc.
Description: Assures the user that they are using a WASTEC designated Piranha® Hose Product. Seamless Thermoplastic Tube - Provides maximum resistance to hydrolysis. High Tensile One or Two Synthetic Fiber Braids - Contributes to low volumetric expansion and eliminates loss of strength from
- Inside Diameter: 0.25 inch
- Outside Diameter: 0.5 inch
- Working Pressure: 4,000 psi
- Temperature Range: 190 F
-
Supplier: Kuriyama of America, Inc.
Description: Assures the user that they are using a WASTEC designated Piranha® Hose Product. Seamless Thermoplastic Tube - Provides maximum resistance to hydrolysis. High Tensile One or Two Synthetic Fiber Braids - Contributes to low volumetric expansion and eliminates loss of strength from
- Inside Diameter: 0.5 inch
- Outside Diameter: 0.83 inch
- Working Pressure: 3,000 psi
- Temperature Range: 190 F
-
Supplier: Kuriyama of America, Inc.
Description: the user that they are using a WASTEC designated Piranha® Hose Product. Polyolefin or Seamless Thermoplastic Tube - Provides maximum resistance to hydrolysis. High Tensile One or Two Synthetic Fiber Braids - Contributes to low volumetric expansion and eliminates loss of strength from
- Inside Diameter: 1 inch
- Outside Diameter: 1.46 inch
- Working Pressure: 2,500 psi
- Temperature Range: 150 F
-
Supplier: Kuriyama of America, Inc.
Description: - Assures the user that they are using a WASTEC designated Piranha® Hose Product. Seamless Thermoplastic Tube - Provides maximum resistance to hydrolysis. High Tensile One or Two Synthetic Fiber Braids - Contributes to low volumetric expansion and eliminates loss of strength from
- Inside Diameter: 0.1875 inch
- Outside Diameter: 0.41 inch
- Working Pressure: 4,000 psi
- Temperature Range: 160 F
-
Supplier: Gelest, Inc.
Description: 29.3 kJ/mol Dipole moment: 1.91 debye Coefficient of thermal expansion: 1.0 x 10-3 Specific heat: 0.8 J/g/°C Vapor pressure, 24 °C: 400 mm Critical temperature: 215-8 °C Critical pressure: 37.7 atm Provides better diastereoselective reductive aldol reaction between an aldehyde
- Boiling Point: 105.8 to 107.6 F
- Flash Point: -18.4 F
- Dipole Moment: 1.91 D
- Viscosity: 0.6 cps
Find Suppliers by Category Top
Featured Products Top
-
Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications.
(read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
The Sporlan Type See-All moisture liquid indicator combines two functions of moisture and liquid indication into a single economical product. The indicator is a porous filter paper that is sensitive to moisture. A green dark color indicates the refrigerant is dry. A yellow color indicates (read more)
Browse Sight Windows Datasheets for Parker Sporlan Division -
speed data in environments where there is high vibration, moisture, salt, dirt and debris. It can also be used for off-road vehicles, ruggedized factory automation and robotics signal applications. The Max-M12 family of connectors is based on IEC 61076-2-101 and SAE J2839. They are backward (read more)
Browse Electrical Connectors Datasheets for Amphenol Communications Solutions -
Zerodur® (Schott Glass) Zerodur® is a glass ceramic with an extremely low thermal expansion coefficient. Zerodur is a glass ceramic made by Schott Glass that is designed and formulated to exhibit (read more)
Browse Glass Fabrication Services Datasheets for Insaco, Inc. -
resistivity and insulation properties prevent unwanted electrical interference and enhance circuit performance. Good Match with Silicon: AlN's thermal expansion coefficient closely matches that of silicon (read more)
Browse Specialty Ceramics Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
across the shell, roof, and base of the storage tank, with all joints and penetrations tightly sealed to prevent air or moisture ingress. Flexible connections can accommodate the tank’s expansion and contraction, while vapor barriers can control condensation and corrosion. Paying attention to these (read more)
Browse Insulation Jacketing Datasheets for Mid-Mountain Materials, Inc. -
coefficient of resistance (TCR) ensures minimal expansion under heat, maintaining consistent resistance and long-term stability. Isabellenhütte is experienced in developing high-reliability current-sense resistors for mission (read more)
Browse Current Sensing Resistors Datasheets for Isabellenhutte USA -
environments. Very low moisture uptake (0.03%) Other Characteristics of Fluon+PFA EA-2000 resins In addition to characteristics important to its use with CCL, these adhesive resins feature: Superior heat resistance (read more)
Browse Resins and Compounds Datasheets for AGC Chemicals Americas, Inc. -
alumina, thermal expansion rate similar to silicon, high specific strength, low density and non-toxic. Therefore, the "lightness" of electronic components using aluminum nitride ceramics is really enviable. But there are gains and losses. At present, aluminum nitride substrate is facing a big dilemma (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Key Features: Thermal conductivity exceeds 6 W/(m•K) Applicable in very thin bond lines Low thermal resistance Low coefficient of thermal expansion Used for bonding and sealing applications. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc.
Conduct Research Top
-
Unfilled Liquid Crystal Polymers
. cryogenic temperatures without growing brittle, and have a low coefficient of thermal expansion.
More Information Top
Indicates content that may require registration and/or purchase.
-
Investigation Into the Deterioration of Paintings, and Photographs using Computerized Modeling of Stress Development
the photographic gelatins cast in our laboratory and measured under quasi-equilibrium restrained conditions, once the nonlinear moisture coefficient expansion was taken into consideration.
-
Electrochemical migration failure on FR-4 PCB by hygro-thermo-vapor pressure coupled analysis
Hygroscopic strains arise due to mismatch of coefficient moisture expansion (CME).
-
An approach on underfill material selection for the low-k Flip Chip Plastic Ball Grid Array (FCPBGA)
comprehensive selection method by adding another three factors which were modeling, coefficient moisture expansion (CME) and filler settlement.
-
Reliability analysis and hygro-thermo-mechanical design for MEMS-based pressure sensor
Differential swelling occurs along the interfacial materials and consequent hygroscopic stresses/strains arise due to mismatch of coefficient moisture expansion (CME).
-
The humidity and thermal characteristics of die-attach (DA) and its impact on the package reliability
The Characteristics of all the materials in the SIP are showed in Table2, such as Young’s modulus (E), Poisson’s ratio (υ), Coefficient thermal expansion (CTE) and Coefficient moisture expansion (CME).
-
Hygric characterization of woven glass/epoxy composites
moisture expansion coefficients are approximately 0.08 and 0.09, with a standarddeviation of 0.01.
-
Polymer-coated fiber Bragg grating for relative humidity sensing
The resulting uncertainty in the measurement is 4%RH and the response time of the sensor and the moisture expansion coefficient of polyimide were obtained from a series of experimental investigations and cross compared with the results of previous work.
-
Effects of moisture-dependent properties of constituents on the hygroscopic stresses in composite structures
The moisture expansion coefficient of the matrix was considered con- stant during the diffusion process, and the variations observed in Fig. 2 were caused only by the moisture-dependent mechanical properties.
-
Integrated Theory for Predicting the Hygrothermomechanical Response of Advanced Composite Structural Components
The per- centage dimensional changes versus weight changes ( moisture expansion coefficients ) are summarized in Table 2.
-
Moisture and transverse dimensional changes during air-drying of small green hardwood wafers
In this paper, the term ,, moisture expansion coefficient " X is defined as follows: X=aS/aM .