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Supplier: Techsil Limited
Description: Momentive CRTV5120 is a high performance, semi-conductive silicone adhesive. This one-part RTV offers fast cure and a resistivity of 200 - 800 ohm-cm. CRTV5120 offers a primer less adhesion to many metals, plastics and glass. This product is ideal for gaskets & seals for electronics
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrically Conductive
- Rubber Based / Elastomeric: Yes
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Supplier: Techsil Limited
Description: Momentive CRTV5120 is a high performance, semi-conductive silicone adhesive. This one-part RTV offers fast cure and a resistivity of 200 - 800 ohm-cm. CRTV5120 offers a primerless adhesion to many metals, plastics and glass. This product is ideal for gaskets & seals for electronics
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrically Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Rubber Based / Elastomeric: Yes
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Description: The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K. ? Available in various thicknesses from 0.3 to 10.0 mm. ? Highly
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 9
- Dielectric Strength: 2.03E-4 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Techsil Limited
Description: Techsil® Zemrex C200 is a semi-conductive paste silicone adhesive which offers primer less adhesion to a range of substrates including many metals, plastics and glass. Zemrex C200 uses a moisture vapor cure system, which release an acetic vapor from the sealant surface during cure. Due
- Compound Type: Electrically Conductive
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ? Available in various thicknesses from 0.5 to 5.0 mm
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 7.5
- Dielectric Strength: 2.03E-4 kV/in
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Description: The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m·K. ? High bonding performance. ? Good stability, long
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Thermal Conductivity: 1.2 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST TGR 1500A, High Performance, Value Compound for High-End Computer Processors BERGQUIST® TGR 1500A is a high performance, thermally conductive compound intended for use as a thermal interface material between a high end computer processor and a heat sink. Other high watt
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Thermal Conductivity: 1.5 W/m-K
- Use Temperature: 302 F
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Supplier: Epoxies Etc...
Description: 50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package.
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features Low volume resistivity Thixotropic paste Solvated Excellent adhesion to many substrates Application SEMICOSIL® 979 EC is an electrically conductive adhesive for use
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST LIQUI BOND TLB EA1800, Thermally Conductive, Two-Part, Epoxy Based, Liquid-dispensable Adhesive BERGQUIST® LIQUI BOND TLB EA1800 is a two-component, epoxy based, liquid-dispensable adhesive. BERGQUIST LIQUI BOND TLB EA1800 has a thermal conductivity of 1.8 W/mK. BERGQUIST LIQUI
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Thermal Conductivity: 1.8 W/m-K
- Use Temperature: 40 to 257 F
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot.
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Dielectric Strength: 300 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Description: The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K. ? Available in various thicknesses from 0.3 to 10.0 mm. ? Highly
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 5.6
- Dielectric Strength: 1.27E-4 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ABP 8163F-1, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8163F-1 non-conductive die attach adhesive is designed for LED and sensor manufacturing applications High thermal conductivity High reflectivity Excellent anti-yellowing properties
- Compound Type: Thermally Conductive
- Thermal Conductivity: 0.8000 W/m-K
- Viscosity: 21000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity and reworkability. Thermally conductive Reworkable Unfilled
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
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Description: Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a
- Chemical / Polymer System Type: Epoxy (EP), Silicone
- Compound Type: Electrically Conductive
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Semiconductors / IC Packaging
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Description: Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves
- Chemical / Polymer System Type: Epoxy (EP), Silicone
- Compound Type: Electrically Conductive
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Semiconductors / IC Packaging
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Description: Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire drawing problems, greatly saving production costs and waste. It is suitable for automatic adhesive dispensing, with excellent adhesive output
- Chemical / Polymer System Type: Epoxy (EP), Silicone
- Compound Type: Electrically Conductive
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Semiconductors / IC Packaging
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: Thermally conductive silicone pad is a kind of thermally conductive medium, which is used to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat dissipation device. It is specially produced for the design scheme of
- Carrier / Backing Material: Plastic / Polymer, Silicone
- Features: Anti-static / ESD Control, Dielectric / Insulating, Electrically Conductive, Other
- Temperature Resistance: -40 to 200 C
- Thickness: 0.0118 to 0.2362 inches
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Material Form: Grease / Paste
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 970 TC A/B is a pasty, but still flowable addition-curing, two component elastomeric silicone that cures at elevated temperature to an thermally conductive silicone rubber. Special features two-component thermal conductivity pasty, still
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Description: BERGQUIST® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry Applications: OEM / Industrial
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Supplier: Chemence Inc.
Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed
- Cure Type / Technology: Single Component System
- Industry: Electronics
- Substrate / Material Compatibility: Plastic
- Viscosity: Up to 150000 cP
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Supplier: Chemence Inc.
Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when
- Cure Type / Technology: Single Component System
- Industry: Electronics
- Substrate / Material Compatibility: Metal, Plastic
- Viscosity: 11000 to 14000 cP
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Supplier: ThreeBond International, Inc.
Description: conductive filler. They are used to connect various electrical contacts and for conduction. Silver, nickel, carbon, etc. are used as the electro-conductive fillers, and epoxy resin, urethane resin, silicone resin, and synthetic rubber are used as binders. With different options
- Chemical / Polymer System Type: Silicone
- Composition: Filled
- Compound Type: Electrically Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass,
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Material Form: Grease / Paste
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Supplier: Gelest, Inc.
Description: Safety Packaging Under Nitrogen
- Chemical / Polymer System Type: Silicone
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
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Supplier: Techsil Limited
Description: Techsil® TIM11021G is a silicone compound that provides high thermal conductivity. It exhibits virtually no oil separation and minimal weight loss at elevated temperatures, which contributes to stability of TIM interface under broad operational temperature ranges. Techsil® TIM- 11021G
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Rubber Based / Elastomeric: Yes
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Supplier: Gelest, Inc.
Description: Safety Packaging Under Nitrogen
- Industry: Other
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Supplier: Master Bond, Inc.
Description: MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace,
- Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 77.78 to 94.44 µin/in-F
- Composition: Unfilled
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 975 TC is a 1-part thermally conductive paste that is curing into self-adhesive gap filling silicone. The thermal paste is able to efficiently fill finest gaps of heat generating and ablating substrates and thus helps to minimize contact resistance. Thermal resistivity is
- Coeff. of Thermal Expansion (CTE): 8.33 µin/in-F
- Cure Type / Technology: Single Component System
- Dielectric Strength: 279 kV/in
- Elongation: 10 %
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Dielectric Strength: 203 kV/in
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N700C is made of non-silicon resin material and none low-molecular-weight siloxane. N700C helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Dielectric Strength: 203 kV/in
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N800B is made of non-silicon resin material and none low-molecular-weight siloxane. N800B helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Dielectric Strength: 203 kV/in
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Supplier: Master Bond, Inc.
Description: Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 61.11 to 77.78 µin/in-F
- Composition: Unfilled
- Compound Type: Thermally Conductive
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Supplier: Budnick Converting, Inc.
Description: SCT20 is a 2 mil double linered electrically conductive silicone transfer tape that is designed for demanding electronics, aerospace, medical, and high-temperature applications. The unique silicone pressure-sensitive adhesive (PSA) conducts electricity anisotropically through
- Peel Strength / Adhesion: 2 lbs/in
- Type: Transfer
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® SC-309 is a two component, thermally conductive silicone encapsulant that is used for electrical/electroni c encapsulating applications. It provides low stress on components, environmental resistance, and excellent flame retardancy. Resin, 1 gal Pail.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 599 kV/in
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® SC-309 is a two component, thermally conductive silicone encapsulant that is used for electrical/electroni c encapsulating applications. It provides low stress on components, environmental resistance, and excellent flame retardancy. Hardener, 1 gal Pail.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 599 kV/in
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Supplier: CHT USA Inc.
Description: CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 470 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 20 to 51 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
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Featured Products Top
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heat generating components. Once installed, Fujipoly’s unique thermally conductive silicone-based materials efficiently remove excess heat to the surrounding environment or nearby heatsinks. Depending on thickness and your selection of Sarcon® TR or HR (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
directly impacts the performance and lifespan of the devices. To solve this problem, SHEEN thermal conductive silicone sheets have been introduced into Bluetooth speaker designs, acting like an invisible pair of wings that allow the music to soar and release its true charm. SHEEN (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Complex shapes of silicone rubber consisting of different properties such as conductive and non-conductive segments, or color coding. Specifically custom designed to eliminate multiple extruded components by combining different elements into one unitized design. Quick turnaround and cost (read more)
Browse Elastomers and Rubber Compounds Datasheets for Fujipoly® America Corp. -
Why are silicones used in LED & Lighting applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life (read more)
Browse Datasheets for CHT USA Inc. -
Heat cured 1-part silicone adhesives cure in minutes reducing production time and improving output. Using platinum catalysts, they do not produce any harmful by-products, which make them suitable for a wide range of applications including electronics. 1-part - no need for (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
Complex shapes of silicone rubber consisting of different properties such as conductive and non-conductive segments, or color coding. Specifically custom designed to eliminate multiple extruded components by combining different elements into one unitized design. (read more)
Browse Elastomers and Rubber Compounds Datasheets for Fujipoly® America Corp. -
BRIMFLEX B200 Silicone Rubber covered fiberglass sleeving is an excellent inorganic high & low temperature insulating material. B200 provides greater mechanical strength because it is more con-centric, homogeneous and denser than conventional dip coated Silicone Rubber Fiberglass sleeving (read more)
Browse Electrical Insulators Datasheets for BRIM Electronics, Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Industrial Adhesives Datasheets for CHT USA Inc. -
Why are silicones used in LED & Lighting applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc.
Conduct Research Top
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Highly Conductive Insulation for Large, High-Speed Machines
. This paper investigates functional electrical insulation integrity of highly thermally-conductive silicone-impregnated-fiberglass insulation through short-term, highly accelerated aging tests. This insulation system offers up to three times the thermal conductivity of traditional insulation, which
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Electrically Conductive Adhesives
to electronics manufacturing. ECAs are typically composed of an epoxy resin but can also be made of UV cure and silicone adhesives. To overcome the high resistivity of these compounds, the adhesive is loaded with upward of 80 percent conductive materials. These adhesives can be applied in any number of usual
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Silver Filled, Electrically Conductive Adhesives
In the realm of electrically conductive epoxies and silicone, there is nothing like silver. Not only does silver have very high electrical conductivity, it also retains its low resistance over many years, even decades. This is much more desirable than other metals that are highly conductive
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Key Benefits of Choosing Non-Silicone Gap Filler Material
As its name suggests, thermal interface materials (TIMs) are used to optimize thermal heat transfer between various interfaces. Generally, thermal gap fillers are made from a silicone polymer and add various auxiliary materials such as ceramic particles, silicone oil and thermally conductive
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Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination
This paper presents a case history of a failure analysis performed on a die bond adhesion failures. Silicone contamination caused intermittent adhesive failures at the die back metallization/conductive epoxy interface. The source of the silicone contamination was identified as the adhesive film
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Silicone Based Insulation Material for High Speed/Voltage Rotating Machines
on silicone, epoxy, polyester, polyesterimide, and other polymers. Among all of these insulation materials, silicone based insulation best fits into many rotating machinery applications because of stability across a wide temperature range and the ability for highly thermally conductive designs
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Silicone Based Electrical Insulation Material for High Speed/Voltage Rotating Machines
on silicone, epoxy, polyester, polyesterimide, and other polymers. Among all of these insulation materials, silicone based insulation best fits into many rotating machinery applications because of stability across a wide temperature range and the ability for highly thermally conductive designs
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Best Non Conductive One Component Epoxy Adhesive Glue For Automotive Plastic to Metal
Design engineers have the privilege to choose from a flurry of options when it comes to joining plastic to metal. Some of the options are easy to apply than others. Silicone, advanced epoxy, UV cure adhesive solutions, and cyanoacrylate are some of the best options engineers use in this regard
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Best Non Conductive One Component Epoxy Adhesive Glue For Automotive Plastic to Meta
Design engineers have the privilege to choose from a flurry of options when it comes to joining plastic to metal. Some of the options are easy to apply than others. Silicone, advanced epoxy, UV cure adhesive solutions, and cyanoacrylate are some of the best options engineers use in this regard
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Case Study - Repositionable Thermal Interface
Our customer, an EMI shielding manufacturer, was producing a conductive, semi-cured silicone at their local location. They reached out to Budnick in hopes of finding a solution for a new application. The customer's new thermal interface material required a repositionable adhesive that would
More Information Top
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Performance of different types of time domain reflectometry probes for water content measurement in partially saturated rocks
Using seven different rock types, we demonstrate that carefully applied conductive silicone fillings can eliminate gap effects in the case of the penetration‐type probes.
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Microactuators and Micromechanisms
Electrical Performance of Electrically Conductive Silicone Rubber in Dependence on Tensile Load According to Various Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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DC current voltage characteristics of silicone rubber filled with conductive carbon black
The reason for this deviation is the unbalance between the heat generated and the heat loss of conductive silicone rubber during the measurement.
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The 15th International Conference on Biomedical Engineering
First is the hybrid conductive silicone construction is shown and the best way to use as force sensor is presented.
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Thermal conductivity of silicone rubber filled with ZnO
Such thermally conductive silicone rubbers are widely used in aviation, electronic devices, and so on.
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Novel heat‐conductive composite silicone rubber
Furthermore, a new type of thermally conductive silicone rubber composites, possessing thermal conductivity of 0.92 W/mK, good electrical insulation, and mechanical properties, was developed using electrical glass cloth as reinforcement.
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