Products/Services for CPU Interposer
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Interposers - (12 companies)Interposers are special connecting devices that are used to interface one socket to another. They can be prototyped without tooling charges, and maybe used in both board-to-board and flex-to-board applications. Selecting interposers requires... -
CPU Coolers - (142 companies)CPU fans and coolers are integrated fans and heat sink assemblies packaged to provide optimum cooling performance, often for specific processors. CPU coolers are heat sinks which are specifically designed to remove waste heat generated by a central... -
CPU Chips - (79 companies)CPU chips or central processing unit chips are used in digital computers and are the semiconductor component where most calculations take place. Specifications. Specifications include: Clock speed. Internal register size. Data input/output (I/O) bus... -
CPU Cards and Modules - (107 companies)CPU cards and modules are computer boards that contain the central processing unit (CPU) of a computer. A CPU module is a connectorized CPU with the external logic required to allow it to function. CPU cards and modules are specified by CPU speed... -
Microprocessor Chips (MPU) - (336 companies)Microprocessor chips (MPU) are silicon devices that serve as the central processing unit (CPU) in computers. They contain thousands of electronic components and use a collection of machine instructions to perform mathematical operations and move... -
PC Enclosures - (153 companies)...processing unit (CPU), keyboard, and printer into one cabinet. How to Select PC Enclosures. PC enclosures are designed to protect personal computers (PCs) in industrial or office environments. They prevent the ingress of environmental contaminants...
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Heat Sinks - (454 companies)...longevity. A list of devices which commonly use heat sinks is found below. Computers: central processing units (CPU) and graphics cards. Heat sinks became essential to computers in the 1990s when processor speeds, and therefore the heat generated...
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Computer Motherboards - (295 companies)...between the central processing unit (CPU) and the peripherals. Therefore, the processor or CPU type is an important specification to consider when selecting computer motherboards. Choices include processors from Intel and AMD. Specifications. In addition...
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Heat Pipes - (65 companies)Heat pipes are self-contained heat pumps that can transport heat at high rates over fairly substantial distances with no external pumping power.
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Computers - (1701 companies)...the identical (yet different) components of a desktop PC. Image credit: Nikkis | Microsoft. All general-purpose computers require the following hardware components: CPU. The central processing unit (CPU) is the core of the modern computer and is responsible...
Product News
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Molex Signal Tech Industrial Ltd.
EZiCoax Single-piece Coax for Interposer Solutions and defence operations. A recognized pioneer in spring probe technology, Smiths Interconnect brings decades of expertise to the design of spring-compliant contacts and interposer connectors. EZiCoax leverages this heritage, employing spring probe technology in both its center and outer conductors to create a fully compliant connection between printed circuit boards (PCBs). The smallest coax offering has a low profile down to a 3.30 mm board-to-board distance and can be used on a pitch as small... (read more)Browse Coaxial Connectors Datasheets for Molex Signal Tech Industrial Ltd. -
Pleora Technologies Inc.
Bandwidth and CPU Benefits for Imaging GigE Vision is the most common transport layer standard in the machine vision industry today, but as bandwidth increases there are key processing challenges to consider for device designers and system integrators. To understand the challenge requires a brief overview on the basics of the GigE Vision standard. GigE Vision is based on the User Datagram Protocol (UDP) from computer networking to ensure low latency transmission, and integrates a packet resend mechanism to guarantee delivery for... (read more) -
Rego Electronics Inc.
CPU Coolers for Intel® Sockets 1155/1156/1150 CPU Rego Cooler Information-. Part Number : RG3223. Solution : 2U & Up Server. CPU Socket : 1155 / 1156 / 1150. Outline Dimension : 90.75 x 89.50 x 65.25mm. Heat Sink : 78.0 x 62.5 x 61.6mm, Copper Base & Aluminum Fins with Heatpipes embedded. Fan : 60 x 60 x 25 mm, Two Ball Bearing, Manufacturer : Sanyo Denki. Connector Type : 4 ways (PWM Function). Thermal Resistance : 0.18 ?/W ( TDP(max) : 150 Watts ). Noise Level : 44 d B(A). Storage Temperature : - 30? ~ + 70?. Operating Temperature : - 10... (read more)Browse CPU Coolers Datasheets for Rego Electronics Inc. -
ToneCooling Technology Co., Ltd
CPU Cooling Plate | IT Innovation for Efficiency Data Centers and Cloud Computing: As data centers expand to meet growing demands, efficient cooling becomes essential. Hygon CPU liquid cooling plates ensure stable performance, enhancing the reliability and longevity of data center infrastructure. Scientific Research and Simulation: High-performance computing is crucial for scientific research and simulations. The Hygon CPU liquid cooling plate combo provides the thermal management needed to accelerate research and improve accuracy. Enterprise... (read more)Browse CPU Coolers Datasheets for ToneCooling Technology Co., Ltd -
ToneCooling Technology Co., Ltd
Sunway CPU Liquid Cooling Plates Liquid Cooling Plates for Sunway High-Performance CPUs. As computing performance continues to increase, effective thermal management has become essential for maintaining system stability and efficiency. High-performance processors generate significant heat, requiring advanced cooling technologies to ensure reliable operation in modern computing environments. Sunway CPU liquid cooling plates provide efficient heat dissipation and stable thermal control for high-performance computing systems... (read more)Browse CPU Coolers Datasheets for ToneCooling Technology Co., Ltd -
Dongguan Sheen Electronic Technology Co., Ltd.
Thermal Paste for CPU and GPU Cooling High-performance CPUs and GPUs generate significant heat, and effective cooling depends on more than just the heatsink. Thermal paste plays a key role by filling the tiny air gaps between the chip and the heat sink, helping heat move out of the component more efficiently. This formula is designed for stable, long-term thermal contact under continuous operation. It conforms well to uneven surfaces, supports reliable heat transfer during repeated thermal cycling, and helps maintain consistent... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
ToneCooling Technology Co., Ltd
Liquid Cooling Plates for CPUs/GPUs Modern processors often operate under high heat flux, sustained workloads, and thermal throttling risks. Air cooling may struggle to dissipate heat effectively, leading to unstable performance, reduced lifespan, and energy inefficiency in high-performance systems. Liquid cooling plates provide direct and efficient heat removal. * Direct liquid-to-plate heat transfer improves cooling efficiency. * Uniform heat spreading reduces hotspots. * Supports high-power loads in AI and rendering systems. *... (read more)Browse CPU Coolers Datasheets for ToneCooling Technology Co., Ltd -
ToneCooling Technology Co., Ltd
Custom Heat Sinks for CPU, Amp, Routing - Paste For efficient cooling of your electronic CPU, amplifier boards, and routing components, opt for our custom aluminum heat sink. The integrated thermal paste and aluminum block ensure superior heat dissipation, protecting your devices from overheating. Whether you need a specific size, shape, or configuration, our heat sink can be tailored to your unique requirements. Trust our customizable solution for long-lasting thermal management. (read more)Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
ToneCooling Technology Co., Ltd
Advanced Liquid Cooling for Data Center CPUs In modern data centers and high-performance computing environments, effective thermal management is essential. CPUs powering enterprise servers, cloud platforms, and AI workloads generate immense heat, and without proper cooling, performance can drop due to thermal throttling, while hardware longevity is compromised. The advanced liquid cooling plate offers a tailored solution to these challenges. Engineered from high-quality copper or aluminum with microchannel or fin structures, it delivers... (read more)Browse CPU Coolers Datasheets for ToneCooling Technology Co., Ltd -
Dongguan Sheen Electronic Technology Co., Ltd.
5W Thermal Grease for CPU and Heatsink Cooling In electronic cooling, the interface between a heat source and a heatsink often decides how well the whole system performs. Even when the heatsink is installed correctly, microscopic gaps and surface pits can trap air and reduce heat transfer efficiency. That is why thermal grease remains a practical choice for CPU cooling and other high-power electronic assemblies. SG560-50 thermal grease is designed to improve contact between the CPU and heatsink by filling small gaps and displacing air... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd.
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ZCP2008ISTFA490
The CPU interposer is used to execute scripts to determine which data bits or address bits, if any, are corrupted.
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A Layout-Aware Test Methodology for Silicon Interposer in System-in-a-Package
Hardware Cost of Test Interposer CPU _Time (seconds .
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http://www-cs.intel.com/content/dam/doc/design-guide/855gm-855gme-chipset-platform-design-guide.pdf
ITP_CLK to CPU ITP Interposer Layout Example..................................................73 Figure 33.
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http://www-cs.intel.com/content/dam/doc/design-guide/855pm-chipset-platform-guide.pdf
ITP_CLK to CPU ITP Interposer Layout Example .................................................
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http://www-us-east.intel.com/content/dam/doc/design-guide/852gm-chipset-platform-guide.pdf
Pair to pair overall length matching requires knowledge of the package lengths of various CPUs, and the GMCH, as well as the effective length of the CPU socket/ interposer if used.
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http://www-cs.intel.com/content/dam/doc/design-guide/852gm-chipset-82801db-io-controller-hub-embedded-platform-guide.pdf
Pair-to-pair overall length matching requires knowledge of the package lengths of various CPUs, and the GMCH, as well as the effective length of the CPU socket/ interposer if used.
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http://www-cs.intel.com/content/dam/doc/design-guide/852gme-852gmv-852pm-chipset-platforms-guide.pdf
Pair to pair overall length matching requires knowledge of the package lengths of various CPUs, and the GMCH, as well as the effective length of the CPU socket/ interposer if used.
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects > Through-Silicon-Via (TSV) Interposer Reliability
Thus, a TSV interposer connecting the CPU and memory in certain 3-D configurations could be an effective solution to resolve these issues.
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http://www.intel.com/content/dam/www/public/us/en/documents/design-guides/xeon-with-512-kb-l2-cachel-e7500-chipset-guide.pdf
• DC voltage drop from VCC_ CPU to the processor interposer pin VCCA should be < 33 mV, which in practice implies series R < 1.1 Ω; this also means pass band (from DC to 1 Hz) attenuation < 0.5 dB for VCC_CPU …
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http://www-us-east.intel.com/content/dam/doc/design-guide/xeon-e7500-e7501-chipset-guide.pdf
• DC voltage drop from VCC_ CPU to the processor interposer pin VCCA should be < 33 mV, which in practice implies series R < 1.1 Ω; this also means pass band (from DC to 1 Hz) attenuation < 0.5 dB for VCC_CPU …
