Dielectric Elastomer

Description: DEA 288 Epsilon - Dielectric Analyser Customized Test Conditions The multi-functional design of the DEA 288 Epsilon (including furnace or laboratory press) allows for the application of a great variety of different test conditions such as heat, cold, humidity

• Display & Special Features: Computer Interface / Networkable, Laboratory / Batch
• Property Analyzed: Other
• Test Media / Material: Adhesives / Coatings, Polymers (Plastics, Elastomers), Other

Description: 20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix ratio.

• Cure Type / Technology: Thermosetting / Crosslinking, Room Temperature Curing, Two Component System
• Dielectric Constant (Relative Permittivity): 3.57
• Dissimilar Substrates: Yes
• Features: Electrical Insulation / Dielectric Material

Description: Elastomer - RTV 1 - Acetic curing - off-white Flowable, adhesive and good mechanical properties Quick curing and Dielectric properties Properties Viscosity 250000 Hardness Sha 37 Description Bonding in the aeronautics industry, Electrical insulation, Coating of fabrics for thermal

• Chemical / Polymer System Type: Silicone
• Dielectric Constant: 2.9
• Dielectric Strength: 533 kV/in
• Elongation: 290 %

Description: "Elastomer - RTV 2 - polyaddition heat curing - High optical clarity Solventless, Very low viscosity, Quick curing, Long potlife, Good thermal resistance, Excellent dielectric performances " Properties Viscosity 4000 Hardness Sha 52

• Chemical / Polymer System Type: Silicone
• Elongation: 115 %
• Filler Material: Unfilled
• Industry: Electronics, Optoelectronics

Description: Elastomer - RTV 2 - polyaddition heat curing - Black Solventless, Very low viscosity, Quick curing, Long potlife, Excellent dielectric performances, High thermal and Fire resistance (UL 94 V0) Properties Viscosity 3200 Hardness Sha 48

• Chemical / Polymer System Type: Silicone
• Dielectric Constant: 3.2
• Dielectric Strength: 457 kV/in
• Elongation: 170 %

Description: Silicone is a synthetic elastomer with excellent elongation, creep, tear strength, dielectric strength (at high voltage), thermal conductivity adn fire resistance at extreme temperatures. This makes silicone rubber one of the elastomers of choice in many extreme environments.

• Gasket Type: Sheet / Die-cut
• Material: Silicone Rubber
• Operating Temperature: -80 to 400 F
• Thickness: 0.0625 to 0.2500 inch

Description: This two component urethane series are low durometer (25-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. They have outstanding thermal cycling properties, low glass transition

• Coeff. of Thermal Expansion (CTE): 127 µin/in-F
• Compound Type: Encapsulating / Potting
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
• Dielectric Constant (Relative Permittivity): 4.5

Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid which is

• Chemical / Polymer System Type: Silicone
• Coating Type: Electrical Insulation / Dielectric
• Coeff. of Thermal Expansion (CTE): 4.44 µin/in-F
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System

Description: APTIV film 1100 Series APTIV 1100 Series are mineral filled semi-crystalline films where filler content is available at several loadings. Thicknesses start from 12 microns upwards. The 1100 Series film is typically specified where either a higher modulus or lower coefficient of thermal expansion is

Description: APTIV film 2100 Series APTIV 2100 Series are mineral filled amorphous films where filler content is available at several loadings. Thicknesses range from 12 microns upward. The 2100 Series film is typically specified for processing to semi-crystalline form using a thin-gauge thermoforming process

Description: APTIV film 2000 Series APTIV 2000 Series are unfilled amorphous films available in thicknesses from 6 microns up to 300 microns. The 2000 Series films are typically selected for processing to semi-crystalline form using a thin gauge thermoforming process or when ductility and a level of optical

Description: APTIV film 1300 Black APTIV 1300 Black cosmetic grade film provides the same properties as the natural color film. It is a suitable option when dark color is a design requirement for applications such as acoustic speakers and thermal acoustic insulation. Thicknesses range from 50 to 100 microns.

Description: cure Can be cured in closed assemblies Low shrinkage Technical Properties Uncured Consistency: Pourable, self-levelling Color: Blue Cured Shore Hardness: 60 Shore A Elongation: 250% Dielectric Strength: 17.7kv/ mm Operating Temperature: -60°C to +204°C

• Chemical / Polymer System Type: Silicone
• Compound Type: Molding Resin
• Use Temperature: -76 to 399 F

Description: cure Can be cured in closed assemblies Low shrinkage Technical Properties Uncured Consistency: Pourable, self-levelling Color: Blue Cured Shore Hardness: 60 Shore A Elongation: 250% Dielectric Strength: 17.7kv/ mm Operating Temperature: -60°C to +204°C

• Chemical / Polymer System Type: Silicone
• Compound Type: Molding Resin
• Use Temperature: -76 to 399 F

Description: cure Can be cured in closed assemblies Low shrinkage Technical Properties Uncured Consistency: Pourable, self-levelling Color: Blue Cured Shore Hardness: 60 Shore A Elongation: 250% Dielectric Strength: 17.7kv/ mm Operating Temperature: -60°C to +204°C

• Compound Type: Molding Resin
• Use Temperature: -76 to 399 F

Description: to metal and resists weathering and water washout. Rubber and plastic O-rings, gaskets and seals. FEATURES Wide service temperature range (-40°C/-40°F to 200°C/392°F) Excellent water resistance Compatible with many plastics and elastomers Low vapor pressure Low volatility Meets several global

• Applications: Automotive / Transportation, Electrical / Electronic, Marine, Food Grade / Contact (FDA H1)
• Chemistry / Constituents: Silicone, Synthetic / Semi-synthetic
• Density / Specific Gravity (@15.6°C, 60°F): 1 specific gravity
• Dielectric Strength: 1.77E7 V/m

Description: ELASTOSIL® RT K is a pourable, condensationcuring, two-component silicone rubber that vulcanizes at room temperature. Special features excellent flowability and good self-deaeration medium Shore A hardness (approx. 45) good dielectric properties

• Chemical / Polymer System Type: Silicone
• Compound Type: Casting Resin
• Elongation: 130 %
• Filler Material: Unfilled

Description: is currently being developed to market maturity as part of a joint project sponsored by the German Federal Ministry of Education and Research. ELASTOSIL® silicone film is ideal for use as a dielectric precision layer in innovative, future-oriented electronics applications based on so

• Chemical / Polymer System Type: Silicone
• Dielectric Strength: 2032 to 2540 kV/in
• Electrical Resistivity: 1.00E15 ohm-cm
• Elongation: 450 %

Description: • Similar to Norprene®, with FDA compliant materials • Excellent for food and dairy applications • Good flow consistency • Heat and ozone resistant • Heat sealable, nonaging, and nonoxidizing • High dielectric constant • FDA compliant; NSF listed, Standard 51

• Material Choices: Rubber / Silicone / Elastomer Tubing
• Maximum Inside Diameter / Size: 0.1220 inch
• Pressure Rating: 40 psi
• Temperature Range: 270 F

Description: • Similar to Norprene®, with FDA compliant materials • Excellent for food and dairy applications • Good flow consistency • Heat and ozone resistant • Heat sealable, nonaging, and nonoxidizing • High dielectric constant • FDA compliant; NSF listed, Standard 51

• Material Choices: Rubber / Silicone / Elastomer Tubing
• Maximum Inside Diameter / Size: 0.0630 inch
• Pressure Rating: 40 psi
• Temperature Range: 270 F

Description: EMI absorber EMI SHIELDING: Boyd’s LectroShield fabric-over-foam, conductive foam, elastomers, adhesives, and metal foils are designed to manage interference energy, improving reliability and efficiency in device performance. These solutions are ideal for EMI RFI shielding applications

• Application: EMI / RFI Shielding
• Foam Type: Flexible, Rigid
• Form / Shape: Fabricated Shapes / Parts (Molded, Cast)
• Material / Composition: Plastic / Polymer, Elastomer / Rubber

Description: resistance to acids/alkalies. • Heat sealable, nonaging, and nonoxidizing. • High dielectric constant. • PerfectPositionâ„¢ tubing retention marks indicate the exact placement of tubing in the pump head to provide the best performance and life of the tubing

• Material Choices: Rubber / Silicone / Elastomer Tubing
• Maximum Inside Diameter / Size: 0.5000 inch
• Pressure Rating: 35 psi
• Temperature Range: 275 F

Description: resistance to acids/alkalies. • Heat sealable, nonaging, and nonoxidizing. • High dielectric constant. • PerfectPositionâ„¢ tubing retention marks indicate the exact placement of tubing in the pump head to provide the best performance and life of the tubing

• Material Choices: Rubber / Silicone / Elastomer Tubing
• Maximum Inside Diameter / Size: 0.7480 inch
• Pressure Rating: 30 psi
• Temperature Range: 275 F

Description: Filled epoxy system. Very high performance material designed for difficult bonding applications. This material will bond to stencil foil without holes and can withstand high heat and harsh chemical environments. Requires heat assist.

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Dielectric Constant (Relative Permittivity): 4.3
• Features: Electrically Insulating / Dielectric

Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products.

• Coeff. of Thermal Expansion (CTE): 20 to 51 µin/in-F
• Cure Type / Technology: Two Component System
• Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
• Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Paper / Paperboard, Plastic, Rubber / Elastomer, Wood / Wood Product

Description: Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements.

• Chemical / Polymer System Type: Epoxy (EP)
• Dielectric Constant (Relative Permittivity): 4.3
• Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting, Flexible / Dampening
• Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging

Description: etched PTFE involve bonding to elastomers to produce laminated diaphragms, as well as the application of pressure sensitive adhesives in the production of PTFE pressure sensitive tapes. In all the above applications, the lamination or adhesive application is usually accomplished with a primer

• Adhesive: None / Non-adhesive
• Backing: Fluoropolymer, Plastic / Polymer, Specialty / Other
• Dielectric Strength: 9.84E7 V/m
• Features: Dielectric / Insulating, Thermally Insulating / Insulative

Description: 10-3001 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. 10-3001 is also very safe to use due to the absence of harmful solvents and toxic chemicals in the formulation.

• Chemical / Polymer System Type: Epoxy (EP)
• Dielectric Constant (Relative Permittivity): 3.11
• Dielectric Strength: 550 kV/in
• Dissimilar Substrates: Yes

Description: 10-3216 is a toughened, flexible, and impact resistant epoxy adhesive. 10-3216 is a two component system that forms strong structural bonds at room temperature. This unique adhesive system provides high peel and shear strengths. 10-3216 is excellent for bonding many metals and woods, most plastics

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 44.44 µin/in-F
• Dielectric Constant (Relative Permittivity): 4.1
• Dielectric Strength: 630 kV/in

Description: CHEMFILM® DF1100 is a multilayer cast PTFE film, fully fused with one surface modified to render it receptive to many conventional adhesives, elastomers, resins and potting compounds. The surface treatment was developed to assure that its application over pure PTFE would not degrade or

• Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF)
• Elongation: 400 %
• Filler Material: Unfilled
• Industry: General Industrial, Other

Description: BRIMFLEXä BSR Silicone Rubber tubing is an extremely elastic and stable high temperature & low temperature tubing. Besides being extremely flexible, it has excellent mechanical strength (tear resistance) tensile strength, elongation, and weather resistance), and outstanding dielectric

• Application: General Purpose
• Design Units: English
• Function: Electrical Tubing / Sheathing
• Material Choices: Rubber / Silicone / Elastomer Tubing

Description: MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace,

• Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
• Chemical / Polymer System Type: Silicone
• Coeff. of Thermal Expansion (CTE): 77.78 to 94.44 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.7

Description: Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, UV curable adhesive system with excellent strength properties.

• Applied Thickness / Gap Fill: 1.00E-3 to 0.0030 inch
• Chemical / Polymer System Type: Specialty / Other
• Coeff. of Thermal Expansion (CTE): 30.56 to 33.33 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: Master Bond EP53TC is a thermally conductive, electrically insulating two part epoxy that combines good physical properties and the ability to transfer heat rapidly and effectively.

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 7.78 to 8.89 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Dissimilar Substrates: Yes

Description: Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices. This epoxy was tested against many sterilization methods, such as autoclaving, STERRAD®, Cidex® and Steris®,

• Applied Thickness / Gap Fill: 0.0040 to 0.0060 inch
• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 19.44 to 22.22 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.5

Description: Cuming Microwave manufactures a family of flexible, carbon loaded, polyurethane foam microwave and radar absorbers. These are all electrically resistive materials which attenuate RF energy through ohmic loss. These carbon-based microwave absorbers such as C-RAM MT have high dielectric loss

• Application: EMI / RFI Shielding
• Foam Type: Open Cellular, Flexible
• Form / Shape: Stock Shape (Bar, Sheet, etc.), Film / Sheet
• Material / Composition: Plastic / Polymer, Elastomer / Rubber

Description: ELASTOSIL® A 8 is a one part UV curable silicone elastomer. Special features Rapid UV cure Solvent-free Shadow cure Low viscosity Application ELASTOSIL® A 8 is a protective coating designed to be used as a gasket saturant.

• Chemistry: Resin Base / Polymer Binder, Silicone
• Dielectric Strength: 1.97E7 V/m
• Features: Dielectric, Protective, Waterproof / Water Repellant
• Form: Liquid