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Description: Walchem’s WCU410 Copper Controller and WNI Nickel Controller are optoelectronic on-line analyzers that measure the actual concentration of copper or nickel in solution. They are used in a variety of applications including electroless plating baths and microeth baths
- Equipment / System Type: Specialty / Other
- Process / Technology: Electroless Plating
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Supplier: Technic, Inc.
Description: Designed for small scale testing of copper plating of PCBs plating Mini Electroless Copper Line – Standard Features Seven (7) polypropylene tanks 10 ½” x 6 ½” x 11” deep (3 gallon) One (1) Stainless steel tank 10
- Application / Industry: Printed Circuit Boards (PCB)
- Equipment / System Type: Laboratory / Pilot System
- Process / Technology: Electroless Plating
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Description: Walchem’s WCU410 Copper Controller and WNI Nickel Controller are optoelectronic on-line analyzers that measure the actual concentration of copper or nickel in solution. They are used in a variety of applications including electroless plating baths and microeth baths
- Equipment / System Type: Specialty / Other
- Process / Technology: Electroless Plating
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Supplier: CRC Chrome
Description: CRC Chrome, The Hard Chrome Plating Specialists. Hard Chrome is an electro-chemical process with unique properties that make it ideal for specific purposes, including... Repair and Restore Worn Parts Increase Life of New Parts Corrosion Protection
- Additional Services: Hydrogen Relief Baking, New / OEM Parts, Replating / Used Parts
- Industry: Aerospace, Architectural / Construction, Automotive, Cement / Concrete, Castings / Cast Metal, Commercial / Professional, Chemical / Material Processing, Electronics, Energy / Utilities, Food & Beverage, Government, Machine Tools, Maintenance / MRO, Marine, Medical / Healthcare, Military
- Location: North America, United States Only, Northeast US Only
- Material / Substrate: Copper / Copper Alloys, Iron / Cast Iron, Metal, Nickel / Nickel Alloys, Stainless Steel, Steel / Steel Alloys
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Supplier: Interplex Etch Logic, LLC
Description: -nickel, copper, silver, tin and tin-lead. Certain facilities also provide automated rack and barrel plating services, Phosphorus electroless nickel with co-deposit Teflon and plating on plastic for various needs. To provide its customers with the lowest cost solutions,
- Additional Services: Electropolishing, On-site / Field Plating, Material Selection / Design Assistance, Pickling / Chemical Deburring, Research & Development
- Industry: Aerospace, Automotive, Castings / Cast Metal, Electronics, Machine Tools, Medical / Healthcare, Military Specification
- Location: North America, United States Only, Europe Only, South Asia Only, Near East Only, East Asia / Pacific Only
- Material / Substrate: Aluminum, Copper / Copper Alloys, Metal, Nickel / Nickel Alloys, Precious Metals, Titanium
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Supplier: MacDermid Alpha Electronics Solutions
Description: suppliers at a competitive price in both vertical and horizontal equipment. M-Copper EF is specifically formulated from decades of experience with electroless copper plating and modern innovations, allowing for a revolution in quality and service in a segment of
- Chemical / Process: Copper Plating
- Electroless: Yes
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Supplier: Products Finishing, Inc.
Description: Industrial Plating Services If you have any questions or would like to receive a Free Quote, give us a call anytime at 814-452-4887. Black Chrome Plating Hard Chrome & Polymer Plating Electroless Nickel Plating
- Additional Services: Electropolishing, Hydrogen Relief Baking, New / OEM Parts, Passivation, Pickling / Chemical Deburring, Replating / Used Parts
- Electroless: Yes
- Industry: Aerospace, Architectural / Construction, Automotive, Cement / Concrete, Castings / Cast Metal, Chemical / Material Processing, Electronics, Energy / Utilities, Machine Tools, Maintenance / MRO, Marine, Medical / Healthcare, Military Specification, Oil & Gas, Pipes / Piping, Process Equipment,
- Location: North America, United States Only, Northeast US Only
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Supplier: Paramount Metal Finishing Company
Description: , CL1 & CL2 ASTM-B580 AMS-2471 / AMS2472 Chemical film MIL-C-5541, MIL-DTL-5541 ASTM-B449 / ASTM-B921 Copper MIL-C-14550 ASTM-B734 AMS-2418 Electroless nickel MIL-C-26074 ASTM-B733 AMS-C-26074 Gold MIL-G-45204 ASTM-B488 Hardcoat anodize MIL-A-8625 Type III, CL1
- Additional Services: Hydrogen Relief Baking, New / OEM Parts, Material Selection / Design Assistance, Passivation, Pickling / Chemical Deburring, Replating / Used Parts, Research & Development
- Electroless: Yes
- Industry: Aerospace, Architectural / Construction, Automotive, Castings / Cast Metal, Commercial / Professional, Chemical / Material Processing, Electronics, Energy / Utilities, Food & Beverage, Government, Machine Tools, Maintenance / MRO, Marine, Medical / Healthcare, Military Specification, OEM /
- Location: North America, United States Only, Northeast US Only, Southern US Only
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Supplier: MacDermid Alpha Electronics Solutions
Description: system that fits the needs of the industry. The first stage of the process is a chemical desmear process designed for today’s variety of special resin systems. The process can be tailored to run in vertical or horizontal equipment. The second stage is our advanced electroless
- Chemical / Process: Copper Plating
- Electroless: Yes
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Supplier: Technic, Inc.
Description: System Overview The SEMCON 4000 is an automatic loading and unloading “wet bench” type wafer Under Bump Metalization tool, designed with processes for Nickel and Gold metalization of silicon and Ga/As wafers with aluminum or copper seed layer. The Semcon 4000 tool is
- Application / Industry: Semiconductor / Wafer, Solar / Photovoltaic
- Equipment / System Type: Automated System
- Process / Technology: Electroplating
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Supplier: Boyd
Description: Measuring Machine) Complete assembly solutions including rivets, studs, brackets, NC riveting, auto tapping Various finishes: natural, electroplated (tin, zinc, nickel, gold), electroless plating, powder coating, wet coat painting, polishing), Heat treating including
- Additional Manufacturing Capabilities: Drilling / Tapping, Heat Treating / Stress Relieving, Painting / Powder Coating, Tool Making, CNC Machining, Welding
- Materials: Ferrous Metals, Nonferrous Metals, Other
- Regional Preference: North America, Europe Only, East Asia / Pacific Only, Oceania Only
- Stamping Capabilities: Progressive Dies
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Supplier: Technic, Inc.
Description: purchasing the Basic Program.) Polishing & Buffing (lesson 3) Cadmium, Chromium, and Copper Plating (lesson 6) Gold, Indium, and Iron Plating (lesson 7) Lead, Nickel and Platinum Plating (lesson 8) Silver, Tin and Zinc Plating
- Industry: Electronics
- Technology / Subject: Semiconductors / Microelectronics (ICs)
- Type: Course
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thickness of copper present in the through-hole, the combination of cleaning efficiency and microetch depth can be adjusted to maximize surface preparation without sacrificing direct metallization, electroless or flash plate integrity. Excellent topography provides good bonding behavior under low (read more)
Browse Cleaning Agents and Surface Treatments Datasheets for MacDermid Alpha Electronics Solutions -
process chemicals from desmear through copper Ionic and colloidal activator options Low stress electroless copper deposit for excellent reliability Specialty Applications for IC Substrates Niche specialty processes for high reliability bonding, copper (read more)
Browse Conformal Coatings Datasheets for MacDermid Alpha Electronics Solutions -
-up to your medical equipment > Test connectors to use as adapters, replace parts, or build DIY test leads > Wire & Cable spools up to 1000 ft for DIY/custom test lead assemblies > Contact materials (beryllium copper, brass, stainless-steel, non-magnetic, etc (read more)
Browse Electrical Test Probes Datasheets for E-Z-HOOK, a division of Tektest, Inc.
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Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
It might also need to be clustered with post-EP copper electroless plat- ing equipment to selectively cover copper interconnects with an ultra-thin, highly adherent capping layer system such as CoWP or CoWB.
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ZCACA2001P127
cessfully operating in production using horizontal equipment for electroless copper itself (Ref 80). Plating -on-Plastic.
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ZASMHBA0001265
At present, horizontal desmear is being used in select facilities worldwide, and several facilities are also successfully operating in production using horizontal equipment for electroless copper itself (Ref 69). Plating -on-Plastic.
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Research Progress on Electrochemical Deposition in Electronic Packaging
Electroless copper plating has some advantages, such as simple equipment , easy to operate, without power supply and current density control problems, so copper layer with uniform thickness and high quality can be deposited on the irregular surfaces and insulator surface.
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Degradation of power contacts in industrial atmosphere: plating alternative for silver and tin [circuit breaker applications]
This test showed that Electroless Ni could effectively substitute traditional Ag and Sn plating and protect copper current carrying parts of circuit breaking equipment from damaging corrosion for substantial period of time up to one year without significant discoloration.
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Handbook of Sustainable Engineering
… Electric charges, 1151, 1166 Electric double layer, 1151–1152, 1165, 1167 Electric grid, 164, 172, 174 Electricity, 928–939 Electricity generation, 1024 Electrochemical process, 1150 Electrode, 1150–1172, 1175–1183 Electroless copper plating process, 304, 312–314, 321 … … conductivity, 1159–1160, 1164–1166 Electronic equipments , 1204–1209, 1211 Electronics, 1258 …
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Hydrogen Embrittlement Coverage by U.S. Government Standardization Documents
… ganic Coatings Surface Treatments and Inorganic Coatings on Weapon Systems Lead Plating (Electrodeposited) Coating, Oxide, Black for Ferrous Metals Finishes for Ground Electronic Equipment Chromium Plating , Black (Electrodeposited) Copper Plating (Electrodeposited) Phosphate Coatings … … Tin Cadmium (Electrodeposited) Coatings, Electroless Nickel, Requirements for Gold …
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ZASMHBA0001303
… Resistant to many acids and hot corrosive gases Resistant to many chemicals and corrosive atmospheres; often used in conjunction with copper and chromium; can be applied by electroless plating High electrical conductance; brilliant … … for food and dairy equipment ; good solderability Easily applied …
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The in-situ Annealing of Electroless Deposited Copper Films Using NITD Method for ULSI
INTRODUTION Recently, the copper interconnector prepared by the electroless plating process has received great attention for its lower process temperature, excellent step-coverage capability for via-holes and trenches, and its lower equipment cost [1].
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Corrosion Standards and Control in the Nonferrous Metals Industry
… Plating (Electrodeposited) Impregnation of Metal Castings Coating, Oxide, Black, for Ferrous Metals Finishes, for Ground Signal Equipment Paint, Rubber, Red Fuming Nitric Acid Resistant Plating , Black Chromium (Electrodeposited) Copper Plating (Electrodeposited) Zinc Coating … … Electrodeposited Coating, Nickel-Phosphorus, Electroless Nickel, Requirements for Aluminum …