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Supplier: Win Source Electronics
Description: Manufacturer: Aavid, Thermal Division of Boyd Corporation Category: Fans, Thermal Management- Thermal- Heat Sinks Series: 5731 Package: Bulk Product Status: Active Type: Top Mount Package Cooled: TO-252 (DPak) Attachment Method: SMD Pad Length: 0.315" (8.00mm) Shape:
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Supplier: Win Source Electronics
Description: Manufacturer: Wakefield-Vette Category: Fans, Thermal Management -Thermal- Heat Sinks Series: 217 Package: Bulk Product Status: Active Package Cooled: D²Pak (TO-263), SOL-20, SOT-223, TO-220 Thermal Resistance @ Forced Air Flow: 16.00°C/W @ 200 LFM Material: Copper
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1205655-CR201-25AE Category: Fans, Thermal Management>Thermal - Heat Sinks Series: CR Type: Board Level, Vertical Package: Box Length: 0.984" (25.00mm) Standard Package: 4 Material: Aluminum Alloy Shape: Rectangular, Fins Package
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1355174-V6560W Category: Fans, Thermal Management - Thermal - Heat Sinks Fake Threat In the Open Market: 32 pct. Type: Board Level MSL Level: 1 (Unlimited) Mfr: Assmann WSW Components Package: Tray Product Status: Active HTSUS: 8473
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Supplier: Boyd
Description: heat sink, an Aavid fan, attachment hardware, and thermal interface material. These drop-in solutions provide localized, device specific cooling which increases the performance of the heat sink as well as the reliability of your FPGA/BGA device. Aavid
- Device: Active Heat Sink
- Fan Voltage: 5 VDC, 12 VDC
- Material: Aluminum
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Supplier: Boyd
Description: variety of speeds, voltages, and function types. A number of ball bearing fans are in stock and available for purchase online, however Aavid manufactures hundreds more options as well as custom fans and fan systems. All standard fans can be paired with an Aavid
- Application: Industrial/Commercial
- Bearings: Ball / Roller
- Motor Type: DC
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Supplier: Xoxide
Description: The MCP35X-HS is an optional heatsink compatible with all Swiftech MCP35XX series pumps (MCP350, 355, 35B, 35X). The heatsink is intended to provide additional cooling to pumps running under high stress and/or high ambient temperature conditions. The substantial reduction in operating
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Supplier: Xoxide
Description: Enhance your cooling performance with the Thermalright AXP-140 Low Profile High Performance Heat Sink. This low profile CPU cooler incorporates a unique down draft style of air cooling that makes it perfectly ideal for an HTPC case. This innovative down draft air flow is
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Supplier: Boyd
Description: , and attachment methods, including clip attach, solder anchors, push pin, and tape for easy assembly. Aavid Fans and Thermal Interface Materials can be added for a fully optimized cooling solution that can be quickly and easily mounted to your device. Standard BGA/FPGA heat
- Device: Active Heat Sink
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Supplier: Sunon, Inc.
Description: Sunon offers cooling modules with three types of configurations to choose from – a passive standalone heat sink, passive heat sink with heat pipe(s), and a heat sink with fan (also fan sink) with or without heat
- Application: Industrial/Commercial
- Blower / Fan Type: Axial Fan
- Maximum Air Flow: 1.8 to 3 SCFM
- Motor Type: 50/60 Hz AC
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Supplier: Boyd
Description: Caustic Etched Silk Screened Chromated (RoHS Compliant) Washed Combine any Aavid extruded heat sink with an Aavid thermal interface material and fan for a full, reliable cooling solution.
- Device: Passive Heat Sink
- Material: Aluminum
- Width: 100 to 700 mm
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Supplier: SECO
Description: suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes
- Device: Passive Heat Sink
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Supplier: ODG (Origin Data Global)
Description: Heat Sinks
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Supplier: Dynatron Corp.
Description: provides silent gaming cooling solution. EVO11 utilizing special fin shape design, 7 heatpipes link aluminum base with powerful 120mm fan and bracket offer max. airflow that propelled across the dissipating surface of the cooler. Universal All-in-One design is compatible with all
- Device: Active Heat Sink
- Fan Airflow: 80.6 SCFM
- Fan Noise: 36.5 dB
- Fan Speed: 2200 rpm
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Supplier: Corsair Memory
Description: , and the surface is planed to increase heat transfer efficiency. Dual speed-selectable 120mm fans, mounted on rubber studs, spin quietly in a push-pull configuration for optimum airflow. Protect your valuable investment in your CPU, and enjoy faster overclocking performance. Features
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Supplier: Xoxide
Description: Are 120mm fans just not cutting it anymore? Do you need the biggest, baddest fan around? Then you need the new AeroCool Streamliner 140mm fan. That's right, 140mm. This huge fan stretches a whopping 14 centimeters across, yet will still fit any 120mm fan
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Supplier: Rego Electronics Inc.
Description: REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to
- Device: Active Heat Sink
- Fan Noise: 46 dB
- Fan Speed: 5500 rpm
- Heat Sink Fin Style: Other
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Supplier: MAYA Heat Transfer Technologies Limited
Description: Thermally sensitive and critical components placement Heat sinks modeling Spacing requirements between critical parts Predicting fan operating conditions Volume and mass flow estimations Computing pressure inlet/outlet gradients and head losses
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Supplier: Richardson RFPD
Description: MaxiTHERM-HD3™ Bonded Fin Forced Convection Series #1 heat sinks provide more effective cooling per cubic inch of space compared to extruded heat sinks. Exceptionally low thermal resistance values in forced convection applications are achieved with Series #1
- Heat Sink Fin Style: Bonded Fin
- Thermal Resistance: 0.0240 °C / W
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Supplier: Computer Network Accessories, Inc.
Description: Single application heatsink compound; White. 1 oz. soft pack. -40~204 (degrees C); Thermal Conductivity: 0.0009.
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Supplier: FX PCB Co., Ltd.
Description: performance and offer a cheap fix for thermal problems. Using heat sink PCBs will guarantee that your product works without fans or other cooling devices. The PCB’s thermal performance is achieved by transferring the heat produced by the components over time
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Electronic and Instrument Enclosures - Raspberry Pi 5 HEATSINK CASE with COOLING FAN -- RPF-5 SeriesSupplier: Takachi Electronics Enclosure Co., Ltd.
Description: Heatsink case with cooling fan for Raspberry Pi 5.Equipped with a highly efficient heat-sink top cover and thermal conductive sheets.*Raspberry Pi board is not included.
- Features: Screw-on Cover
- Material: Aluminum
- Mounting: Desktop
- Shape: Rectangular
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Supplier: RS Components, Ltd.
Description: FHP08 processor cooling fan,12V 6000rpm - Electronics Heating & Cooling - Heatsinks
- Height: 32 mm
- Length: 61.8 mm
- Width: 50 mm
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Supplier: Continental Fan Manufacturing, Inc.
Description: vibration free operation. The AMP is completely speed controllable. Both motor and impellerare located directly in the air stream, where the impeller acts as arotating "heat sink" with excellent heat dissipation and efficientmotor cooling. Near zero speeds can be achieved
- Air Flow Rate: 600 to 1695 SCFM
- Applications: Air Handling Units / HVAC, Product / Process Cooling
- Design Configuration: Axial
- Environment: Clean Air / Gas, Dirty Air / Gas
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Supplier: Xoxide
Description: /70A Peak(Powerful Single Rail) Ultra-Tight Voltage Regulation (+VDC @ 1.5%) 4 x PCI-E & 16 x Drive Connectors NVIDIA® SLI Certified (up to Dual GTX260) Ultra-High Reliability (200,000 Hr. MTBF) Heavy-Duty Caps, Inductors, Heat Sinks, & More
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Supplier: Takachi Electronics Enclosure Co., Ltd.
Description: Heat dissipation and cooling via the utilization of extruded aluminum heat-sink side plates. Rounded corners gives it an elegant feel. Aluminum extrusion parts provides high structural durability. Suitable for use as small-type fan less PC, digital audio equipment, and so
- Depth: 0.7874 to 2.76 inch
- Length / Height: 3.5 to 8.98 inch
- Material: Aluminum
- Width/Diameter: 5.12 to 7.09 inch
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Supplier: ToneCooling Technology Co., Ltd
Description: dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat
- Device: Liquid Cooler/Cold Plate
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Supplier: Cable Depot Inc.
Description: Silicone Heat Sink Compound
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Supplier: Power Amp Design
Description: . The PAD131 monitors the substrate temperature output of the host power amplifier and adjusts its cooling fan rpm to keep the heat sink temperature to 65OC or less where possible. Many power amplifier applications either do not require maximum cooling or the
- AC Input Phase: Single Phase
- Configuration: IC / PCB-Mounted
- Continuous Output Current: 0.2100 amps
- Features: Self-Configuration / Auto-tuning
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Supplier: ABSOPULSE Electronics Ltd.
Description: conventional designs. The unit operates over a wide temperature range of -40ºC to 85ºC for full specification. In addition, all heat generating components are installed on aluminum heat-sink blocks which are thermally coupled to the heatsink fins and cooled by natural
- DC Input Voltage: 21 to 150 volts
- DC Output Power: 300 watts
- DC Output Voltage: 24 to 125 volts
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Supplier: ToneCooling Technology Co., Ltd
Description: -term reliability, allowing stable performance in various harsh environments. Versatile Applications: Vapor Chambers can be combined with other cooling solutions, such as heat sinks and fans, to further enhance cooling performance. Electronics and
- Device: Cold Plate
- Height: 6 mm
- Length: 110 mm
- Width: 92 mm
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Supplier: Rego Electronics Inc.
Description: engineers will integrate heat pipes, vapor chambers, cooling fans into a tailor made thermal module. would you like to know more details? Our engineers and account managers will give you the full picture about the advantage of customized solutions as follows: - Space saving -
- Analytical Services: Performance Prediction (Lifetime Analysis)
- Heat Exchanger Design: Heat Sink Design
- Industry Served: Computer, Electronics
- Location: North America, United States Only, East Asia / Pacific Only
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Supplier: Rosenberg USA
Description: D50-A2: 2GDSu35 133x126R (133-mm diameter impeller / 115-Volt) 1-Speed Fans with a larger air exhaust flange for Heat Sink cooling
- Air Flow Rate: 315 SCFM
- Applications: Air Handling Units / HVAC, Other
- Design Configuration: Other
- Drive Options: Direct Drive
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Supplier: VAST STOCK CO., LIMITED
Description: CPU & Chip Coolers Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
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Supplier: ToneCooling Technology Co., Ltd
Description: with other cooling solutions, such as heat sinks and fans, to further enhance cooling performance. Electronics and Computing Applications: Used in high-performance computing systems, graphics cards, and other electronic devices to manage heat and prevent
- Operating Power: 1500 watts
- Total Length: 1.18 to 11.81 inch
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?Performance Validation ? 25% better thermal transfer than JEDEC standard heatsinks (tested @ 15W/in² heat flux) ? 5000+ hr salt spray certified for industrial environments (ASTM B117) ? -40°C to 150°C operational range with <3% thermal resistance (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
High-Performance Aluminum Heat Sink for Effective Thermal Management Aluminum heat sinks are designed to effectively dissipate heat from critical components, ensuring optimal performance across various applications. With exceptional thermal conductivity, they enhance cooling (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
due to excess heat, especially in high-demand applications. Our aluminum heat sinks offer the perfect solution with customized designs for maximum (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
sinks may not always meet application requirements due to limitations in size, material performance, or thermal capacity. Tone Cooling provides precision-engineered custom heat sinks designed to optimize heat (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
Our custom heat sinks provide superior thermal performance and precise heat management for a wide range of applications. Engineered for efficient cooling, these heat sinks are ideal for electronics that demand high thermal control and reliability. Key features include (read more)
Browse Heat Pipes Datasheets for ToneCooling Technology Co., Ltd -
specifications Call to Action Upgrade your thermal management with our Custom Black Aluminum Heat Sink. Designed for efficiency and durability, it’s the perfect solution for high-power memory modules. Contact us today to discuss your custom cooling needs! (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
Cooling: Maintains low temperatures for smooth and reliable chip operation Ensure your electronic components stay cool and perform at their best with our compact black heat sinks. Ideal for enhancing the efficiency of your DIY and professional projects. Order now for top-notch thermal management! (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
impact overall performance. Tone Cooling Copper Heat Sinks are engineered for applications requiring efficient heat transfer and stable thermal performance. Compared with conventional aluminum solutions, copper offers superior thermal conductivity, helping (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
Electronic devices often face overheating issues that can reduce performance, shorten lifespan, and increase maintenance costs. Our high-efficiency copper heat sink is engineered to tackle these challenges, providing reliable thermal dissipation even in space (read more)
Browse Heat Pipes Datasheets for ToneCooling Technology Co., Ltd -
cooling solutions, ceramic bearing fans offer several advantages: Improved reliability: Enhanced heat (read more)
Browse Zirconium Oxide and Zirconia Ceramics Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd
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Electrical Considerations of Fan Cooling
The article covers the electrical considerations for connecting the cooling fan of Power Amp Design power op amps to the signal circuits. All of the power op amps currently produced by Power Amp Design rely on an integrated heat sink and fan to provide adequate cooling for the amplifier
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Managing Heat Transfer With Potting Compounds
Today's electronic designs are smaller in size and deliver more power, which requires that they run at higher temperatures. In order to maintain long life and high reliability, they must be able to dissipate that heat efficiently. Fans, vents and other cooling devices take up valuable design space
More Information Top
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ENCYCLOPEDIA OF THERMAL PACKAGING - SET 1: THERMAL PACKAGING TECHNIQUES (A 6-VOLUME SET)
Optimization of piezoelectric oscillating fan cooled heat sinks for electronics cooling applications, IEEE Transactions on Components and Packaging Technology (CPMT) 33(1) (2010) 25–31.
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Energy efficient thermal management of electronic components using solid-liquid phase change materials
C. Results for Fan Cooled Heat Sinks .
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Thermal Performance Characteristics of Integrated Cooling Solutions Consisting of Multiple Miniature Fans
Overall, the results provide recommendations in the design of fan cooled heat sinks utilising multiple axial fans for jet impingement and an understanding of the flow physics which occur within this compact cooling solution design. .
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Thermoelectrics enhanced air cooling limits and improvement techniques: Experimental and computational studies
The experimental setup consisted of a fan cooled heat sink , TEC, and a thermal test board with lidded processor package, as is shown in Fig. 2.
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High efficiency thermophotovoltaic microgenerators
To do this, we modeled a fan cooled heat sink —fan cooling was chosen because even a modest air flow can greatly reduce the size of the heat sink necessary for a given thermal resistance, thus increasing the energy density relative to…
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The Report Committee for David Harrison O’Dell
Certifies that this is the approved version of the following report:
Wireless Power Transfer in the Classroom
Pactech PA‐4FANZ fan cooled heat sink .
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Least-energy optimization of forced convection plate-fin heat sinks
HEATSINKSECONDLAW ANALYSIS Heat dissipation from a high temperature heat source, such as an operating microprocessor, to a low temperature sink represented by the ambient surrounding air, by means of a fan cooled heat sink device, will always result in the generationof entropy.
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Least-energy optimization of forced convection plate-fin heat sinks
Heat dissipation from a high temperature heat source, such as an operating microprocessor, to a low temperature sink repre- sented by the ambient surrounding air, by means of a fan cooled heat sink device, will always result in the generation of entropy.
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A compact multi-channel fluorescence sensor with ambient light suppression
…C = slot containing the UVA-LED, D = immersion probe, E = back of slot A, circuit board for the detector, amplifier and lock-in (for details, see section 2.1), F = back of slot C, fan cooled heat sink for stabilizing the temperature…
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Schaffner Add Heat Sinks To Product Range
The product range encompasses single component PCB mounted heat sinks through to high-performance, fan cooled heat sink assemblies and liquid coolers.