Products & Services
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Supplier: Boyd
Description: Standard Aavid fan heat sink combinations are pre-assembled full thermal solutions for a variety of board level applications. Save time and space and increase thermal performance with these compact solutions. Aavid Fan Heat Sink Combinations are each
- Voltage: 12 VDC, 5 VDC
- Device: Active Heat Sink
- Material: Aluminum
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Supplier: Newark, An Avnet Company
Description: Heat Sink and Cooling Fan; Thermal Resistance:3.8°C/W; Color:Black RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: FAN COOLED HEAT SINK, SS, 45X9.6X30MM ROHS COMPLIANT: YES
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Supplier: Newark, An Avnet Company
Description: HEAT SINK, FAN COOLED, 24V; Thermal Resistance:0.2K/W; External Height - Metric:83mm; External Width - Metric:160mm; External Length - Metric:150mm; Flow Rate Max:80m³/h; Noise Rating:48dBA; Heat Sink Mounting:Surface Mount RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: HEAT SINK; PACKAGES COOLED:TO-220; THERMAL RESISTANCE:3.3 C/W; EXTERNAL HEIGHT - METRIC:50MM; EXTERNAL WIDTH - METRIC:41.91MM; EXTERNAL LENGTH - METRIC:25.4MM; EXTERNAL DIAMETER - METRIC:-; HEAT SINK MATERIAL:ALUMINIUM ROHS COMPLIANT: YES
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Supplier: Win Source Electronics
Description: Manufacturer: Aavid, Thermal Division of Boyd Corporation Category: Fans, Thermal Management- Thermal- Heat Sinks Series: 5731 Package: Bulk Product Status: Active Type: Top Mount Package Cooled: TO-252 (DPak) Attachment Method: SMD Pad Length: 0.315" (8.00mm) Shape:
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Supplier: Boyd
Description: attachment methods, including clip attach, solder anchors, push pin, and tape for easy assembly. Aavid Fans and Thermal Interface Materials can be added for a fully optimized cooling solution that can be quickly and easily mounted to your device. Standard BGA/FPGA heat sinks and
- Device: Active Heat Sink
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Supplier: Win Source Electronics
Description: Alternative Parts (Cross-Reference): Cross Manufacturer: Ohmite Category: Fans, Thermal Management Thermal Heat Sinks Series: W Package: Tray Product Status: Active Type: Board Level, Vertical Package Cooled: TO-220 Attachment Method: Clip and PC Pin Shape: Rectangular,
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Supplier: Boyd
Description: Extruded aluminum is one of the most popular and cost efficient heat sink fabrication methods. Aavid maintains the world's largest portfolio of extruded heat sink profiles with over 5,000 tooled shapes. Aavid extruded heat sink profiles range from simple
- Width: 100 to 700 mm
- Material: Aluminum
- Device: Passive Heat Sink
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1101523-1542003-2 Category: Fans, Thermal Management>Thermal - Heat Sinks Type: Top Mount Package: Tray Standard Package: 350 Material: Aluminum Shape: Cylindrical Package Cooled: BGA Attachment Method: Clip Diameter: 1.375" (34.92mm) OD Thermal
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Supplier: Win Source Electronics
Description: Manufacturer: Wakefield-Vette Category: Fans, Thermal Management -Thermal- Heat Sinks Series: 217 Package: Bulk Product Status: Active Package Cooled: D²Pak (TO-263), SOL-20, SOT-223, TO-220 Thermal Resistance @ Forced Air Flow: 16.00°C/W @ 200 LFM Material: Copper
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Supplier: Boyd
Description: For high volume production, Aavid zipper fins are the most cost efficient method for high fin density heat sinks. These fins are made from a stamped material, typically aluminum or copper, and are folded into shape with interlocking grooves. The fins are then typically soldered,
- Material: Aluminum, Copper
- Features: Other
- Device: Passive Heat Sink
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Supplier: ToneCooling Technology Co., Ltd
Description: heat sinks solutions for industrial and OEM applications. ToneCooling provides expert insights on how […] What Is Choosing Heat Sink Computers Cpu? This guide on Choosing the right heat provides key insights for engineers and […] Introduction — Heat
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Supplier: SECO
Description: the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes
- Device: Passive Heat Sink
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Supplier: ToneCooling Technology Co., Ltd
Description: expert insights on how […] What Is Choosing Heat Sink Computers Cpu? This guide on Choosing the right heat provides key insights for engineers and […] Introduction — Heat sink skiving Heat sink skiving is a big deal in the electronics industry. This
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Supplier: SECO
Description: the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes
- Device: Passive Heat Sink
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Supplier: SECO
Description: the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes
- Device: Active Heat Sink
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Supplier: SECO
Description: the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes
- Device: Passive Heat Sink
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Supplier: ODG (Origin Data Global)
Description: HEAT SINK
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Supplier: FX PCB Co., Ltd.
Description: problem with the dissipation of heat loss from processors. There are various ways to connect a heat sink to the heat source. A separate metal heat sink must be made to fabricate a heat sink PCB. Then, producers will affix this heat
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Supplier: Richardson RFPD
Description: maxiTHERM-HD3™ Bonded Fin Forced Convection Series #1 heat sinks provide more effective cooling per cubic inch of space compared to extruded heat sinks. Exceptionally low thermal resistance values in forced convection applications are achieved with ""Series #1"" models,
- Thermal Resistance: 0.028 °C / W
- Heat sink Fin Style:: Bonded Fin
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Supplier: Xoxide
Description: may result in increased components life. The MCP35X-HS heatsink is designed to operate either in passive mode (without a fan), or can also be fitted with an optional 80x15mm fan. It is bolted to the pump base and mated via a thermal pad. Feet terminated by rubber bushing for
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Supplier: Sunon, Inc.
Description: Sunon offers cooling modules with three types of configurations to choose from – a passive standalone heat sink, passive heat sink with heat pipe(s), and a heat sink with fan (also fan sink) with or without heat pipe(s) to
- Maximum Air Flow: 1.8 to 3 SCFM
- Motor Type: 50/60 Hz AC
- Blower/Fan Type: Axial Fan
- Application: Industrial/Commercial
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Supplier: Xoxide
Description: Weight: 550g (Heatsink only) Total Height of Heatsink: 70.2 mm Heat Pipes: 6 x Heat Pipes w/ Nickel-Plating Heatsink Base : Copper Recommended Fans (Optional): 120mm or 140mm Fan Compatibility: CPU Compatibility: Supports Intel Socket 775 Motherboard / Socket 1366
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Supplier: Computer Network Accessories, Inc.
Description: Single application heatsink compound; White. 1 oz. soft pack. -40~204 (degrees C); Thermal Conductivity: 0.0009.
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Electronic and Instrument Enclosures - Raspberry Pi 5 HEATSINK CASE with COOLING FAN -- RPF-5 SeriesSupplier: Takachi Electronics Enclosure Co., Ltd.
Description: Heatsink case with cooling fan for Raspberry Pi 5. Equipped with a highly efficient heat-sink top cover and thermal conductive sheets. *Raspberry Pi board is not included.
- Material: Aluminum
- Mounting Type: Desktop
- Shape: Rectangular
- Features: Screw-on Cover
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Supplier: Xoxide
Description: Are 120mm fans just not cutting it anymore? Do you need the biggest, baddest fan around? Then you need the new AeroCool Streamliner 140mm fan. That's right, 140mm. This huge fan stretches a whopping 14 centimeters across, yet will still fit any 120mm fan holes
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Supplier: Xoxide
Description: Are 120mm fans just not cutting it anymore? Do you need the biggest, baddest fan around? Then you need the new AeroCool Streamliner 140mm fan. That's right, 140mm. This huge fan stretches a whopping 14 centimeters across, yet will still fit any 120mm fan holes
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Supplier: Rego Electronics Inc.
Description: REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to
- Length: 88 mm
- Width: 88 mm
- Height: 25.9 mm
- Weight: 175.00000000000003 g
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Supplier: Rego Electronics Inc.
Description: REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to
- Length: 83 mm
- Width: 83 mm
- Height: 25.500000000000004 mm
- Weight: 260 g
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Supplier: Allied Electronics, Inc.
Description: Tubeaxial Cooling Fans, Sealed Ball Bearing, Block Termination Silent operation Locked rotor and polarity protection Tubeaxial cooling fans, radial blowers and heat sink AC fans with sealed ball bearing.
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Supplier: Allied Electronics, Inc.
Description: Tubeaxial Cooling Fans, Sealed Ball Bearing, Block Termination Silent operation Locked rotor and polarity protection Tubeaxial cooling fans, radial blowers and heat sink AC fans with sealed ball bearing.
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: Cooling Fan Xeon E/X55xx Product overview: BXSTS100P_-_Passive_Heat_Sink from Intel is an Embedded Microprocessor MPU for edge computing, industrial HMI, embedded Linux systems, communication gateways, and high-performance control platforms. It is useful for engineers and buyers comparing
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Supplier: ToneCooling Technology Co., Ltd
Description: These rely on heat sinks and natural convection for cooling, suitable for lower TDP CPUs and environments with good airflow. Active Coolers: Utilize fans to force air through the heat sink, providing more effective cooling for higher TDP CPUs. Liquid Coolers: Offer
- Device: Active Heat Sink, Passive Heat Sink
- Material: Aluminum, Copper
- Features: Other Materials
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Supplier: MAYA Heat Transfer Technologies Limited
Description: placement Heat sinks modeling Spacing requirements between critical parts Predicting fan operating conditions Volume and mass flow estimations Computing pressure inlet/outlet gradients and head losses Identifying recirculation areas and hot spot issues NX Electronic Systems
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?Performance Validation ? 25% better thermal transfer than JEDEC standard heatsinks (tested @ 15W/in² heat flux) ? 5000+ hr salt spray certified for industrial environments (ASTM B117) ? -40°C to 150°C operational range with <3% thermal resistance (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
The USUSTK C1020 Copper Skived Fin Heat Sink is designed for component-level electronic cooling in industrial equipment, power electronics and automation systems. Manufactured from C1020 oxygen-free copper, the heat sink combines precision skiving with CNC machining. The fins are formed (read more)
Browse Heat Sinks Datasheets for USUSTK LIMITED -
High-Performance Aluminum Heat Sink for Effective Thermal Management Aluminum heat sinks are designed to effectively dissipate heat from critical components, ensuring optimal performance across various applications. With exceptional thermal conductivity, they enhance cooling (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
due to excess heat, especially in high-demand applications. Our aluminum heat sinks offer the perfect solution with customized designs for maximum (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
sinks may not always meet application requirements due to limitations in size, material performance, or thermal capacity. Tone Cooling provides precision-engineered custom heat sinks designed to optimize heat (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
As power density continues to increase in photovoltaic inverters and energy storage PCS, conventional extruded heat sinks often struggle to provide sufficient cooling within limited installation space. Skived fin heat (read more)
Browse Heat Sinks Datasheets for USUSTK LIMITED -
specifications Call to Action Upgrade your thermal management with our Custom Black Aluminum Heat Sink. Designed for efficiency and durability, it’s the perfect solution for high-power memory modules. Contact us today to discuss your custom cooling needs! (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
Cooling: Maintains low temperatures for smooth and reliable chip operation Ensure your electronic components stay cool and perform at their best with our compact black heat sinks. Ideal for enhancing the efficiency of your DIY and professional projects. Order now for top-notch thermal management! (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
impact overall performance. Tone Cooling Copper Heat Sinks are engineered for applications requiring efficient heat transfer and stable thermal performance. Compared with conventional aluminum solutions, copper offers superior thermal conductivity, helping (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
Electronic devices often face overheating issues that can reduce performance, shorten lifespan, and increase maintenance costs. Our high-efficiency copper heat sink is engineered to tackle these challenges, providing reliable thermal dissipation even in space (read more)
Browse Heat Pipes Datasheets for ToneCooling Technology Co., Ltd
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Electrical Considerations of Fan Cooling
The article covers the electrical considerations for connecting the cooling fan of Power Amp Design power op amps to the signal circuits. All of the power op amps currently produced by Power Amp Design rely on an integrated heat sink and fan to provide adequate cooling for the amplifier
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Managing Heat Transfer With Potting Compounds
Today's electronic designs are smaller in size and deliver more power, which requires that they run at higher temperatures. In order to maintain long life and high reliability, they must be able to dissipate that heat efficiently. Fans, vents and other cooling devices take up valuable design space
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ENCYCLOPEDIA OF THERMAL PACKAGING - SET 1: THERMAL PACKAGING TECHNIQUES (A 6-VOLUME SET)
Optimization of piezoelectric oscillating fan cooled heat sinks for electronics cooling applications, IEEE Transactions on Components and Packaging Technology (CPMT) 33(1) (2010) 25–31.
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Energy efficient thermal management of electronic components using solid-liquid phase change materials
C. Results for Fan Cooled Heat Sinks .
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Thermal Performance Characteristics of Integrated Cooling Solutions Consisting of Multiple Miniature Fans
Overall, the results provide recommendations in the design of fan cooled heat sinks utilising multiple axial fans for jet impingement and an understanding of the flow physics which occur within this compact cooling solution design. .
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Thermoelectrics enhanced air cooling limits and improvement techniques: Experimental and computational studies
The experimental setup consisted of a fan cooled heat sink , TEC, and a thermal test board with lidded processor package, as is shown in Fig. 2.
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High efficiency thermophotovoltaic microgenerators
To do this, we modeled a fan cooled heat sink —fan cooling was chosen because even a modest air flow can greatly reduce the size of the heat sink necessary for a given thermal resistance, thus increasing the energy density relative to…
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The Report Committee for David Harrison O’Dell
Certifies that this is the approved version of the following report:
Wireless Power Transfer in the Classroom
Pactech PA‐4FANZ fan cooled heat sink .
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Least-energy optimization of forced convection plate-fin heat sinks
HEATSINKSECONDLAW ANALYSIS Heat dissipation from a high temperature heat source, such as an operating microprocessor, to a low temperature sink represented by the ambient surrounding air, by means of a fan cooled heat sink device, will always result in the generationof entropy.
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Least-energy optimization of forced convection plate-fin heat sinks
Heat dissipation from a high temperature heat source, such as an operating microprocessor, to a low temperature sink repre- sented by the ambient surrounding air, by means of a fan cooled heat sink device, will always result in the generation of entropy.
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A compact multi-channel fluorescence sensor with ambient light suppression
…C = slot containing the UVA-LED, D = immersion probe, E = back of slot A, circuit board for the detector, amplifier and lock-in (for details, see section 2.1), F = back of slot C, fan cooled heat sink for stabilizing the temperature…
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Schaffner Add Heat Sinks To Product Range
The product range encompasses single component PCB mounted heat sinks through to high-performance, fan cooled heat sink assemblies and liquid coolers.