Products & Services
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Supplier: Mi-Tech Metals
Description: Small space, big capacity. Mi-Tech developers designed our copper tungsten composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion
- Device: Passive Heat Sink
- Material: Copper, Mixed Material, Other Materials
- Mounting: Other
- Thermal Resistance: 0.5490 °C / W
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Supplier: Xoxide
Description: Heat Sink Dimensions (mm): 130(l) x 65 (w) x 159 (h) LED Color: Blue Life time MTTF at 40C (h): 100'000 Noise Level (dBA): 10 - 26.8 Number of LEDs: 4 Static Pressure (mmAq): 2.66 Warranty (years): 3 Weight (g): 720 (heatsink and fan
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Supplier: Xoxide
Description: /754/939/940. 100% copper heatsink with aerodynamically optimized “tunnel” design for maximum cooling efficiency. Innovative and patented, curved heatpipe design for a heat transfer capacity of up to six heatpipes with the use of just three. 0.2mm ultra-slim fins
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Supplier: Xoxide
Description: FEATURES: Powerful Cooling Performance Optimally designed aluminum fins disperse heat away from the CPU via 6 of high performance heatpipes by utilizing I.H.D technology, while the high capacity 120mm Triple fans quickly cools the heatsink for stable operation of
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Supplier: Xoxide
Description: 4 lines of heat pipe More than 2,360 cm² heat dissipation area Automatic fan speed control by temp. sensor (800-2300 rpm; normally under 1500 rpm) Optimized air flow design Polished copper base High performance thermal grease
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Supplier: RS Components, Ltd.
Description: High performance channel style heatsink with folded back fins. Greater cooling capacity in a minimum of space when mounted horizontally. Folded back fin design maximizes surface area without increasing the vertical space For Use With = Dual TO-220 Length = 36.83mm Width = 2.55mm Height
- Height: 19.99 mm
- Length: 36.83 mm
- Thermal Resistance: 12.4 °C / W
- Width: 2.55 mm
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Supplier: RCD Components, Inc.
Description: HEAT SINK WATER COOLED Choice of insulated stranded wires embedded into case, standard units featuring lug terminals, straight lead wires, 4-terminal design or male fast-on terminal. Benefits: Widest selection in the industry! 5 to 1000 Watt 0.005?
- Features: Heat Sink, Water Cooled
- Resistance Range: 0.1000 to 51000 ohms
- Standard and Compliances: RoHS Compliant
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Supplier: SAE International
Description: We have previously reported on the development of a novel active heat sink (AHS) for high-power electronic components offering unparalleled capacity in high-heat flux handling and temperature control. AHS employs convective heat transfer in a working fluid
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Description: in telecommunications technology since it can be processed using both thick and thin film technologies. As a result, Aluminum Nitride ceramic is utilized as a substrate for semiconductors as well as high-power electronic devices, housings, and heat sinks. Typical Features
- Dielectric Strength: 2.00E7 V/m
- Material Type: Aluminum Nitride
- Thermal Conductivity: 180 to 200 W/m-K
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Description: , such as: Heat sinks & heat spreaders Substrates for electronic packages Substrates & insulators for microelectronic devices & opto electronic devices Laser heat management components Electrical insulators Molten metal fixtures
- Applications: Electrical / HV Parts
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Material Type: Aluminum Nitride, Specialty Ceramic
- Thermal Conductivity: 170 W/m-K
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Description: , such as: Heat sinks & heat spreaders Substrates for electronic packages Substrates & insulators for microelectronic devices & opto electronic devices Laser heat management components Electrical insulators Molten metal fixtures
- Applications: Electrical / HV Parts
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Material Type: Aluminum Nitride, Specialty Ceramic
- Thermal Conductivity: 170 W/m-K
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Supplier: CSA Group
Description: Air-Conditioning & Air-Source Heat Pump Equipment and existing minimum and high efficiency levels of performance. Annex B, which contains the uniform test method for measuring the energy consumption of central air conditioners and heat pumps, is from Appendix M of the United
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Supplier: ABSOPULSE Electronics Ltd.
Description: possible. The mechanical construction has no internal wiring, which increases withstand capacity for vibration and contributes to long-term reliability. In addition, the internal boards are conformal coated for immunity to humidity and contamination. All heat generating components are
- DC Input Voltage: 42 to 125 volts
- DC Output Power: 1000 watts
- DC Output Voltage: 24 to 125 volts
- Number of Outputs: 1 to 2 #
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Supplier: TSI Group, Inc.
Description: B/E Aerospace is experienced in all aspects of thermal management, and brazing is our specialty. As the leading thermal management company with best-in-class brazing technology, B/E Aerospace provides customers with single source brazed assemblies, and can deliver "extra-capacity" from one of
- Additional Services: Assembly, CAD / CAM Support, Design Assistance, High Volume Production, Low to Mid Volume Production, Machining, Testing and Inspection
- Industry Served: Aerospace / Avionics, Electronic / IC Packages, Heat Sinks / Thermal Management, Process Equipment (Heat Exchangers, Tanks, etc.), Specialty / Other
- Location: North America, United States Only, Northeast US Only, Southwest US Only
- Materials: Aluminum
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Supplier: Betatronix LLC
Description: integrated them on a common shaft axis with precision conductive plastic potentiometers. We can supply single- or multi-pole, single- or multi-position, positive detented "on-off" rotary switches, high-current (10 amp) cam-actuated microswitches, and lower current printed circuit board-type
- Category / Application: Automotive, Aerospace, Current Sensing Resistor, Dynamic Braking Resistor, Fusible Resistor, General Use, Harmonic Filter Resistor, High-Current Resistor, High-Frequency Resistor, High-Voltage Resistor, Industrial, Medical, Precision Resistor, Power Resistor, Railway Resistor,
- Dielectric Strength: 500 kilovolts
- Features: Heat Sink, Non-Inductive, Air Cooled, Water Cooled, Non-Flame Coating, Fireproof Case, Electrically Isolated Case, ESD Protection, NEMA Enclosure, Military Standards
- Mounting / Packaging: Surface Mount (SMT / SMD), Bolt-on (Chassis), Panel Mount, Other
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Supplier: Ohmite Manufacturing Co.
Description: Wirewound Heatsinksble Radial Terminal Features: • Flameproof and inorganic • Higher power rating due to heat sink capacity • All welded construction • Nonhygroscopic • High surge construction Options:
- Configuration: Single Resistor
- Features: Fireproof Case
- Power Rating: 20 to 150 watts
- Resistance Range: 0.0500 to 100000 ohms
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Description: properties in terms of heat sink dissipation, and thermal and power cycling tolerance. Ceramics have a large heat capacity and great thermal conductivity. The exceptional electrical and thermal conductivity of thick copper foil lays a good foundation for welding and wire
- Applications: Battery / Fuel Cell, Construction & Building / Architectural, Electrical / HV Parts, Electronics / RF-Microwave
- Material Type: Aluminum Nitride, Alumina / Aluminum Oxide, Specialty Ceramic
- Performance Features: Metallized / Silvered
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Supplier: Visual Sound, Inc.
Description: specifically studied using F.E.A. simulators and the necessary heat transfer to the dissipative structure has been improved. The heat sink concept has been further improved by using an air-diffractor that offers high thermal capacity and has been designed to force
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Supplier: Corsair Memory
Description: Product Description High-performance 12GB Dominator GT kit for triple channel systems, 1866MHz, 9-9-9-24, 1.65V Key Features Maximize your system memory capacity for ultimate performance Specially selected RAMs for overclocked performance Includes XMP
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Supplier: Corsair Memory
Description: Product Description High-performance 12GB Dominator GT kit for triple channel systems, 2000MHz, 9-10-9-27, 1.65V Key Features Maximize your system memory capacity for ultimate performance Specially selected RAMs for overclocked performance Includes
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Description: High power electrical insulators Power electronics Heat spreaders Heat sinks Water cooled heatsinks Laser heatsink power rectifiers Laser components Fixtures and insulators for semiconductor manufacturing chambers
- Material Type: Aluminum Nitride
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Description: High power electrical insulators Power electronics Heat spreaders Heat sinks Water cooled heatsinks Laser heatsink power rectifiers Laser components Fixtures and insulators for semiconductor manufacturing chambers
- Material Type: Aluminum Nitride
- Shape / Form: Plate / Board (e.g., Fiberboard)
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Supplier: Fab Masters Company, Inc.
Description: during the welding process. Microscopic welding: Microscopic welding allows smaller more precise welds with less heat input. Which means less distortion and little or no heat sink. This allows welding of smaller parts with tighter tolerances. Stainless Steel welding
- Additional Services: Testing and Inspection, Low to Mid Volume Production, Robotic Welding, CAD / CAM Support, Machining, Other
- Arc / Resistance Welding: MIG (GMAW), TIG (GTAW)
- Materials: Aluminum, Steel - Stainless, Steel - Structural, Steel - Tool, Other
- Regional Preference: North America, United States Only, Midwest US Only
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Description: industries, such as: Heat sinks & heat spreaders Substrates for electronic packages Substrates & insulators for microelectronic devices & opto electronic devices Laser heat management components Electrical insulators Molten metal fixtures
- Applications: Electrical / HV Parts
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Material Type: Aluminum Nitride, Specialty Ceramic
- Thermal Conductivity: 170 W/m-K
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Description: devices. The thermal conductivity of aluminum nitride is more than 170W/(mk), it has good thermal shock resistance, and can be used in a high temperature environment of 2200?.. Therefore, aluminum nitride ceramic products are an ideal choice for many industries, such as: Heat
- Applications: Electrical / HV Parts
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Material Type: Aluminum Nitride, Specialty Ceramic
- Thermal Conductivity: 170 W/m-K
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Supplier: TapeOnline.com
Description: Lacie - 2big Quadra 4TB - 301432UThe 2big Quadra features four RAID levels, four interfaces and a modern, sleek heat sink design. With 4 terabytes of storage space this 2big Quadra can hold up to eight hours of HD video.The 2big Quadra is a 2-bay solution with customizable RAID modes
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Supplier: TapeOnline.com
Description: LaCie 2big Quadra RAID Hard Drive - 2TB (301352U)The 2big Quadra features four RAID levels, four interfaces and a modern, sleek heat sink design. With 2 terabytes of storage space this 2big Quadra can hold up to four hours of HD video.The 2big Quadra is a 2-bay solution with
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Supplier: TapeOnline.com
Description: LaCie 2big Quadra RAID Hard Drive - 6TB (301561U)The 2big Quadra features four RAID levels, four interfaces and a modern, sleek heat sink design. With 6 terabytes of storage space this 2big Quadra can hold up to twelve hours of HD video.The 2big Quadra is a 2-bay solution with
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Supplier: ABSOPULSE Electronics Ltd.
Description: to high levels of shock and vibration. Cooling is by internal conduction to the walls of the IP66 enclosure and by baseplate to an external chassis or cabinet wall, with additional convection via the outside surface. If installed on a heat-sinking surface, cooling is further enhanced
- DC Input Voltage: 14.4 to 154 volts
- DC Output Power: 300 watts
- DC Output Voltage: 12 to 110 volts
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Supplier: SAE International
Description: . Theoretically, the residual heat-sinking capability of the engine could be used to cool down the transmission medium of the hydraulic retarder, in order to ensure the proper functioning of the hydraulic retarder. Never the less, the hydraulic retarder is always placed at the tailing head of
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Supplier: RS Components, Ltd.
Description: ) Dual Channel Kits operate at 1.6V. Built in support: Extreme Memory Profile (XMP) version 1.3. Instant overclocking on the third-generation Intel^® Coreâ?¢ Ivy Bridge series of processors. PCB construction (8-layer) and high purity aluminium finned heat sinks Desktop
- Applications: Personal Computing
- Capacity: 8000 MB
- Clock Speed: 2133 MHz
- Form Factor: DIMM
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Supplier: RS Components, Ltd.
Description: ) Dual Channel Kits operate at 1.6V. Built in support: Extreme Memory Profile (XMP) version 1.3. Instant overclocking on the third-generation Intel^® Coreâ?¢ Ivy Bridge series of processors. PCB construction (8-layer) and high purity aluminium finned heat sinks Desktop
- Applications: Personal Computing
- Capacity: 8000 MB
- Clock Speed: 2400 MHz
- Form Factor: DIMM
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Supplier: FX PCB Co., Ltd.
Description: copper printed circuit boards have a better capacity to transfer higher voltage, electricity, and heat dissipation. These printed circuit boards also have reduced thermal strain for more electricity transfer facilities. All these benefits allow heavy copper PCBs to be used in
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Supplier: WATTCO
Description: is an easy process with the use of only two screws in the entire installation process. The capacity of the resistive loads will depend on the nature of the heat sink it is being used in. For use with individual applications, they can be adopted and varied in functionality to fit
- Control Signal Output: Switch / Relay Output
- Control Technique: Limit / Set Point Control
- Form Factor: Panel / Chassis Mount
- Media: Liquid, Gas / Air
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Supplier: Rehrig Pacific Company
Description: 't allow the container to hold liquids for other purposes.Capacity: 6.0 Gallons (23.3 liters) Features: Made with durable, washable, 100% recyclable, high density poly-ethylene (HDPE) resin Attractive open-diamond design Drop front gives easy access under sinks
- Application: Shipping
- Type: Bin
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Supplier: RS Components, Ltd.
Description: reverse bias sources. Analog nature of trip events minimise upstream inductive spikes. Helps reduce design costs with single component placement and minimal heat sinking requirements Diode Configuration = Single Nominal Zener Voltage = 13.4V Number of Elements per Chip = 1 Mounting
- Diode Type: Zener Diodes
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Supplier: Advantech
Description: instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various
- Operating System: LynxOS®
- Technology: VPX
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Supplier: DEPRAG, Inc.
Description: Efficiency High drive capacity and precision highly dynamic EC motors with up to 90% efficiency rating lower screwdriver operating temperature power density is increased by factor 2 extremely compact footprint: 50 Nm with screwdriver diameter 36 mm
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Supplier: Advantech
Description: . Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial
- Operating System: LynxOS®
- Technology: VPX
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Featured Products Top
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Custom Heat Sinks for High-Performance Thermal Management Modern electronic systems require effective thermal management to maintain performance and reliability. Standard heat (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
Forging is a manufacturing process involving metal shaping by localized compressive forces. Rego's Precision Forge Technology is capable to produce both aluminum and copper heat sinks. These sinks are processed with high pressure, below temperatures of 300°C. Under this circumstance, forged (read more)
Browse Heat Sinks Datasheets for Rego Electronics Inc. -
PCB AND HEAT SINK MOUNTING We offer a wide variety of heat sink mounting designs that suit your most demanding applications—including high-precision resistors for laboratory applications. Several intelligent (read more)
Browse Resistors Datasheets for Isabellenhutte USA -
Our Custom Black Aluminum Heat Sink is engineered to deliver superior thermal management for high-power memory modules, combining precision design with advanced materials. With compact dimensions of (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
Electronic devices often face overheating issues that can reduce performance, shorten lifespan, and increase maintenance costs. Our high-efficiency copper heat sink is engineered to tackle these challenges, providing reliable thermal dissipation even in space (read more)
Browse Heat Pipes Datasheets for ToneCooling Technology Co., Ltd -
The Aluminium Profile (D01-008) is a high-performance Aluminum Profile Heat Sink, part of the D01 Series Aluminum Heat Sink (D01-001, D01-002, etc.), designed as a critical Power Equipment Thermal Management Component for efficient heat dissipation in various power systems. Constructed from 6063 (read more)
Browse Heat Sinks Datasheets for TPS Elektronik GmbH -
Our custom heat sinks provide superior thermal performance and precise heat management for a wide range of applications. Engineered for efficient cooling, these heat sinks are ideal for electronics that demand high thermal control and reliability. Key features include (read more)
Browse Heat Pipes Datasheets for ToneCooling Technology Co., Ltd -
due to excess heat, especially in high-demand applications. Our aluminum heat sinks offer the perfect solution with customized designs for maximum (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
The Alumina Ceramic Heat Sink Insulator Plate is made from high (read more)
Browse Thermal and Refractory Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
High-Performance Aluminum Heat Sink for Effective Thermal Management Aluminum heat sinks are designed to effectively dissipate heat from critical components, ensuring optimal performance across various applications. With exceptional thermal conductivity, they enhance cooling (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd
Conduct Research Top
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Press-Fit Current Carrying Capacity - Part 3
and the solder-free nature of press-fit zone components allows engineers to optimize manufacturing processes, even if the product includes large heat sinks, multiple internal substrates, and complex control circuitry, all with different thermal coefficient of expansion (CTE) characteristics
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Putting WFI to Work in Juncos
products, including Epogen, Neupogen and Enbrel. Expanding facilities require expanding water capabilities. The most recent $400 million, 500,000-square-foot expansion included the design and implementation of a new Water-for-Injection (WFI) system, with USP-grade water processed by a high-capacity
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Restarts automatically
If no luck, then install a higher capacity heat sink fan.
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Liquid Metal Fast Breeder Reactor program. Volume II. Environmental statement
…d i a t e d fuel, both from the AEC and commercial reactors. thoroughly proven, safe, f l e x i b l e technique that o f f e r s a high capacity heat sink , good shielding, and the…
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Alternatives for managing wastes from reactors and post-fission operations in the LWR fuel cycle. Volume 3. Alternatives for interim storage and transportation
High capacity heat sink available to absorb heat upon loss of normal cooling systems; demonstrated technology in reactor and reprocessing plant fuels storage basins; capable of handling high heat fluxes; water serves as a confinement barrier in the event of container failure…
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Current supply for high-Tc superconductor testing
At this case temperature, the transistor can operate with a continuous power dissipation of 120W; however, a high capacity heat sink is required to hold the case tempera- ture below 93 "C at this power dissipation.
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Engineering Design of a Fission Converter-Based
Moreover, lower normal operating temperature provides higher heat sink capacity for accident conditions.
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Journal of Propulsion and Power > Additives to Improve Fuel Heat Sink Capacity in Air/Fuel Heat Exchangers
This is the highest heat sink capacity that was obtained for any of the compounds tested in this study.
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Hypersonic Airbreathing Missile
The fuselage is constructed of a material with a high heat sink capacity and is covered with a thermal protective shield and lined with an internal insulating blanket.
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On the Use of Wire-Coil Inserts to Augment Tube Heat Transfer
Using the heat sink available in the fuel is generally favored because the fuel has a higher heat sink capacity than air.