High K Dielectric Materials

Description: High-K substrates are used for circuit miniaturization. DLI offers complete fabrication services!

• Applications: Electronics / RF-Microwave
• Coeff. of Thermal Expansion (CTE): 0.5500 to 10.1 µm/m-C
• Length: 1 to 4 inch
• Material Type: Alumina / Aluminum Oxide, Aluminum Nitride, Quartz, Silica / Silicate Materials

Description: Morgan Electro Ceramics announces the release of our new piezoceramic materials, the PZT-5K HD series, for use in medical sensors and low power medical devices. The new materials are specifically formulated with high coupling values and improved dielectric

• Material Type: Piezoelectric Ceramic
• Max Use / Curie Temperature: 150 to 365 C

Description: products with complex shapes and high precision requirements. Although glass ceramics are brittle and hard materials, as long as the processing route and clamping mode are reasonably determined, the machining method is paid attention to, and the cutting parameters are accurately

• Material Type: Glass Ceramic, Silica / Silicate Materials
• Thermal Conductivity: 1.71 W/m-K

Description: use Tungsten steel drill when pursuit of high efficiency . Thread Tapping: The tapping of machinable ceramics is somewhat different from the tapping of metal materials. The gaps between the holes and the holes to be tapped should be larger than those of the metal

• Material Type: Glass Ceramic, Silica / Silicate Materials
• Thermal Conductivity: 1.71 W/m-K

Description: BERGQUIST SIL PAD TSP K900, The Original, Thermally Conductive, Polyimide-Based Insulator BERGQUIST® SIL PAD® TSP K900 uses a specially developed film which has high thermal conductivity, high dielectric strength and is very durable. BERGQUIST SIL PAD TSP

• Dielectric Constant (Relative Permittivity): 0.0050
• Thermal Conductivity: 0.9000 W/m-K
• Use Temperature: 140 to 356 F

Description: The U100-A2K-NL is combined with the 10D20BD.2 mirror. The U100 mount coupled with the 10D20BD.2 mirror is an ideal packaged set for standard laboratory applications. Note that each item will be packaged separately for shipment. U100-A2K-NL is a Precision Clear Edge Mirror Mount, 1.0

• Diameter/Width: 25.4 mm
• Mirror Coatings: Dielectric, Other Mirror Coating
• Mirror Materials: Other Mirror Material
• Mirror Shape: Round, Other

Description: AS17 is an advanced insulation material composed of a fiber composite made from porous silica, aluminum nitride, and other materials, with an extremely low thermal conductivity of 0.028 W/m·K. AS17 is notable for its ability to prevent thermal runaway, its ultra-low density, and

• Features: Electrical Insulation / Dielectric Material, Thermal Insulation / Heat Insulating
• Form: Film / Sheet, Pad, Specialty / Other
• Industry: Optoelectronics / Photonics, Semiconductors / IC Packaging, Electronics, Electrical Power / HV
• Thermal Conductivity: 0.0280 W/m-K

Description: bonded material with hexagonal crystal structure.AlN has excellent thermal, mechanical and electrical properties, such as high thermal conductivity, low dielectric constant, high electrical resistivity, low density and a thermal expansion coefficient that matches well

• Coeff. of Thermal Expansion (CTE): 3 to 4.5 µm/m-C
• Dielectric Constant (Relative Permittivity): 9.66 to 10.6 #
• Loss Tangent (tan δ ): 3.00E-4 #
• Material Type: Aluminum Nitride

Description: Aluminum Nitride Tube Properties High thermal conductivity,(170-23 0W/mK), up to 9.5 times than that of Alumina Similar coefficient of thermal expansion to that of silicon(Si) Higher electric insulation, and Smaller dielectric constant Higher mechanical strength (450MPa

• Coeff. of Thermal Expansion (CTE): 3 to 4.5 µm/m-C
• Dielectric Constant (Relative Permittivity): 9.66 to 10.6 #
• Loss Tangent (tan δ ): 3.00E-4 #
• Material Type: Aluminum Nitride

Description: W/m*K through-plane. In high performance applications, 3M boron nitride cooling fillers offer a lower cost-in-use than conventional mineral- and oxide-based filled compounds. Our engineered particle geometry provides optimum processability for injection molding and extrusion, even at

• Applications: Other
• Material Type: Boron Nitride
• Shape / Form: Fabricated / Custom Shape

Description: BERGQUIST SIL PAD TSP K1300, High Performance, Film reinforced, Silicone based Insulator BERGQUIST®SIL PAD TSP K1300 is a high performance insulator. It combines special film with a filled silicone rubber. The result is a product with good cut-through properties and

• Use Temperature: 76 to 356 F

Description: BERGQUIST SIL PAD TSP K1100, Thermally Conductive, The Medium Performance Polyimide-Based Insulator BERGQUIST® SIL PAD® TSP K1100 is a medium performance, film-based thermally conductive insulator. The film is coated with a silicone elastomer to deliver high performance and

• Dielectric Constant (Relative Permittivity): 0.0040
• Features: Leveling / Filling Compound
• Thermal Conductivity: 1.1 W/m-K
• Use Temperature: 140 to 356 F

Description: Aluminium Nitride (AlN) has an astonishingly high thermal conductivity of 180-200 W/m·K. Aluminium Nitride is particularly well suited for electrical engineering applications due to its excellent electrical insulating characteristics. Aluminium Nitride is an ideal material for

• Dielectric Strength: 2.00E7 V/m
• Material Type: Aluminum Nitride
• Thermal Conductivity: 180 to 200 W/m-K

Description: Advantages Of Aluminum nitride ceramic gasket Aluminum nitride ceramic gasket has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss. It is an

• Applications: Electrical / HV Parts
• Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
• Material Type: Aluminum Nitride, Specialty Ceramic
• Thermal Conductivity: 170 W/m-K

Description: Advantages Of Aluminum nitride backing plate Aluminum nitride backing plate has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss. It is an

• Applications: Electrical / HV Parts
• Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
• Material Type: Aluminum Nitride, Specialty Ceramic
• Thermal Conductivity: 170 W/m-K

Description: Thermal Wire and Cable offers a truly unique flexible, nonmetallic solid sheath thermocouple wire designed for extremely high-temperature applications. The cable is easy to bend and work with and is terminated with conventional tools. Designed to replace MI cable which is difficult to bend

• Elements / Pairs: 2
• Features: Shielded
• Gauge Thickness: 20 Gauge
• Insulation Material: Other

Description: Thermal Wire and Cable offers a truly unique flexible, nonmetallic solid sheath thermocouple wire designed for extremely high-temperature applications. The cable is easy to bend and work with and is terminated with conventional tools. Designed to replace MI cable which is difficult to bend

• Elements / Pairs: 2
• Features: Shielded
• Gauge Thickness: 20 Gauge
• Insulation Material: Other

Description: for delicate and sensitive electronic components. ? Excellent flame resistance, achieving a UL94 V-0 rating. ? Outstanding electrical insulation properties, with dielectric strength up to 8 kV/mm. ? No cracking or dripping, ensuring good stability in both high and low

• Chemical / Polymer System Type: Silicone
• Dielectric Constant (Relative Permittivity): 5.5
• Dielectric Strength: 1.27E-4 kV/in
• Industry: Electronics

Description: for delicate and sensitive electronic components. ? Excellent flame resistance, achieving a UL94 V-0 rating. ? Outstanding electrical insulation properties, with dielectric strength up to 8 kV/mm. ? No cracking or dripping, ensuring good stability in both high and low

• Chemical / Polymer System Type: Silicone
• Dielectric Constant (Relative Permittivity): 7
• Dielectric Strength: 1.27E-4 kV/in
• Industry: Electronics

Description: providing shock absorption. ? High electrical insulation, with dielectric strength up to 8 kV/mm. ? Excellent flame resistance, achieving a UL94 V-0 rating. ? Curing time adjustable based on temperature. ? Two-component structure for easy storage. ? Can

• Chemical / Polymer System Type: Silicone
• Dielectric Constant (Relative Permittivity): 4
• Industry: Electronics
• Thermal Conductivity: 2 W/m-K

Description: LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its

• Applied Thickness / Gap Fill: 0.0098 to 0.0177 inch
• Chemical / Polymer System Type: Silicone
• Dielectric Strength: 4 to 6 kV/in
• Features: Electrical Insulation / Dielectric, UL Approved

Description: heat dissipation with thermal conductivity of 170 W/m K Non-toxic alternative to BeO Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors High dielectric strength

• Features: Dielectric / Insulating
• Materials of Construction: Specialty / Other

Description: LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.

• Applied Thickness / Gap Fill: 0.0197 to 0.3937 inch
• Chemical / Polymer System Type: Silicone
• Dielectric Strength: 8 kV/in
• Features: Electrical Insulation / Dielectric, UL Approved

Description: LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It’s suitable for high power

• Applied Thickness / Gap Fill: 0.0059 inch
• Chemical / Polymer System Type: Silicone
• Features: UL Approved
• Industry: Electronics

Description: EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
• Dielectric Constant (Relative Permittivity): 4.6

Description: Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Features: Electrically Conductive Compound (Adhesive, Grease), Electrical Insulation / Dielectric Material, EMI / RFI Shielding Material, Anti-static / ESD Control
• Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material

Description: SEMICOSIL® 988/1K is a non-slump, thermally curable, addition curing one-part silicone rubber. Special features ready-to-use, one-part system thixotropic transparent medium hardness high flexibility (low-stress-adhesive ) rapid heat cure excellent primerless adhesion to many substrates

• Chemical / Polymer System Type: Silicone
• Composition: Single Component System
• Cure Type / Technology: Thermosetting / Crosslinking
• Dielectric Strength: 584 kV/in

Description: Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm°K thermal performance with supporting laser flash data. Room temperature cure.

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Features: Electrical Insulation / Dielectric

Description: Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures with a convenient one-to-one (1:1) mix ratio by weight or volume. It has an unusual blend

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 33.33 to 36.11 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Dielectric Constant (Relative Permittivity): 6.4 to 6.6

Description: = 1 kV dc, 400 V ac Mounting Type = Through Hole Tolerance = ±20% Series = A72 Application = High Voltage/Current Length = 28mm Dimensions = 11 (Dia.) x 28mm Dielectric = PP Dielectric Material Family = Polypropylene Film

• Capacitance Range: 0.0220 microF
• Capacitance Tolerance: 20 (+/- %)
• Electrostatic Capacitors: Polypropylene
• Mounting Style: Through Hole Technology (THT)

Description: Power Supplies Lead Pitch = 9.5mm Dielectric = Polypropylene Dielectric Material Family = Polypropylene (PP) Terminal Type = Hockey Stick Crimp Package/Case = K

• Capacitance Range: 0.0470 microF
• Capacitance Tolerance: 5 (+/- %)
• DC Rated Voltage Range (WVDC): 200 volts
• Electrostatic Capacitors: Polypropylene

Description: Cornell Dubilier 715P Orange Drop series capacitors have a polypropylene plastic film dielectric. The 715P series capacitors are ideal for applications where high AC current flow is found, as in certain solid-state TV vertical circuits, r-f generators and pulse-forming networks where

• Capacitance Range: 0.0068 microF
• Capacitance Tolerance: 5 (+/- %)
• Electrostatic Capacitors: Polypropylene
• Operating Temperature: 85 C

Description: = 1 kV dc, 400 V ac Mounting Type = Through Hole Tolerance = ±20% Series = A72 Application = High Voltage/Current Length = 28mm Dimensions = 11 (Dia.) x 28mm Dielectric = PP Dielectric Material Family = Polypropylene Film Delivery on production packaging - Box.

• Capacitance Range: 0.0220 microF
• Capacitance Tolerance: 20 (+/- %)
• Electrostatic Capacitors: Polypropylene
• Mounting Style: Through Hole Technology (THT)

Description: a wide variety of materials. Ferrite was founded out of the Raytheon SMDO group in 1983 and has continued to innovate new technologies in both the high power microwave device field and in the industrial realm while improving efficiencies and pioneering new applications. The combination

• Application: Drying, Firing / Sintering, Other
• Heat Source / Transfer: RF / Microwave / Dielectric
• Process Temperature: 600 to 1800 C

Description: This paper describes the development of a lead free, high temperature ceramic capacitor material having the base composition of (Na 0.5 Bi 0.5 ) TiO 3 . The goal is to modify this structure to create a material that has the relative permittivity of barium titanate with extended

Description: biological particle manipulation involved therapy. The performances of transducers greatly rely on the properties of the piezoelectric materials and transduction structures, including piezoelectric coefficient (d), electromechanical coupling coefficient (k), dielectric

Description: biological particle manipulation involved therapy. The performances of transducers greatly rely on the properties of the piezoelectric materials and transduction structures, including piezoelectric coefficient (d), electromechanical coupling coefficient (k), dielectric

Description: Thermal Wire and Cable offers a truly unique flexible, nonmetallic solid sheath thermocouple wire designed for extremely high-temperature applications. The cable is easy to bend and work with and is terminated with conventional tools. Designed to replace MI cable which is difficult to bend

• Elements / Pairs: 2
• Features: Extension Wire, Shielded
• Gauge Thickness: 20 Gauge
• Insulation Material: Other

Description: Thermal Wire and Cable offers a truly unique flexible, nonmetallic solid sheath thermocouple wire designed for extremely high-temperature applications. The cable is easy to bend and work with and is terminated with conventional tools. Designed to replace MI cable which is difficult to bend

• Elements / Pairs: 2
• Features: Extension Wire, Shielded
• Gauge Thickness: 20 Gauge
• Insulation Material: Other

Description: For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 7.22 to 8.33 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System

Description: operated at pressures ranging from 10 Pa up to 10 kPa. To avoid creep and hysteresis, the nanoX 400SG / 200CAP is equipped with a high resolution measurement sensor. In combination with a psj-controller, high stability, linearity, repeatability, and accuracy are achieved during

• Capacitance: 10200 nF
• Diameter or Height: 32 mm
• Electrical Connectors: LEMO™ Connector
• Length: 52 mm

Description: Manufacturer: Taiyo Yuden Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 1063250-HMK316BJ154K L-T Packaging: Tape and Reel Voltage Rating: 100 V Length: 3.2 mm Voltage: 100 V Mounting: SMD (SMT) Capacitance

• Capacitance Range: 0.1500 microF
• Capacitance Tolerance: 10 (+/- %)
• DC Rated Voltage Range (WVDC): 100 volts
• Electrostatic Capacitors: Ceramic

Description: . Excellent Non-Creep Characteristics Very High Thermal Conductivity; 2.50 W/m.K Wide Operating Temperature Range: -50°C to +130°C White Color Enables Treated Parts to Be Easily Identified Low in Toxicity

• Chemical / Polymer System Type: Silicone
• Features: Electrical Insulation / Dielectric
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Grease / Paste

Description: interface materials, we recommend stringent testing before selecting a material for your application. For more information, please refer to the product TDS or contact our Technical Support Team for solutions. Superior Thermal Conductivity even at High Temperatures 3.0

• Chemical / Polymer System Type: Silicone
• Features: Electrical Insulation / Dielectric
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Grease / Paste

Description: SARCON® PG130A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely

• Applied Thickness / Gap Fill: 0.0118 to 0.0787 inch
• Dielectric Strength: 330 kV/in
• Features: Electrical Insulation / Dielectric
• Industry: Electronics, Semiconductors / IC Packaging

Description: MODULAR TYPE 2.9 INCH L X 1 INCH W X 2.3 INCH H SIZE COPPER/ALUMINUM CONDUCTOR MATERIAL UL APPROVAL 600 VAC VOLTAGE RATING 350 AMPERE CURRENT RATING NO COVER TYPE 90 DEG C TEMPERATURE RATING HIGH DIELECTRIC HIGH IMPACT

• Approvals: UL Listing Mark
• Current Rating: 350 amps
• Operating Temperature: 90 C
• Terminal Block Type: Power Distribution Block