High Thermal Conductivity Potting Compounds

Description: LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures.

• Use Temperature: -76 to 356 F
• Thermal Conductivity: 0.55 W/m-K
• Dielectric Strength: 254.00000000000054 kV/in
• Industry: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial

Description: more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. High thermal conductivity Low thermal expansion Low CTE Electrically Insulating Excellent chemical

• Thermal Conductivity: 1.38 W/m-K
• Viscosity: 250,000 cP
• Chemical System: Epoxy (EP)
• Type: Thermal Compound / Thermally Conductive

Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock.

• Use Temperature: 2,200 F
• Thermal Conductivity: 0.70671671 W/m-K
• Coeff. of Thermal Expansion (CTE): 3.4 µin/in-F
• Tensile Strength (Break): 100 psi

Description: properties including high thermal conductivity, excellent electrical insulation properties, good physical strength properties and a high degree of flexibility. EP37-3FLFAN has low viscosity with excellent flow characteristics making it ideal as a thermally conductive

• Viscosity: 60,000 to 80,000 cP
• Use Temperature: -452.47 to 250 F
• Thermal Conductivity: 3.6056975 W/m-K
• Coeff. of Thermal Expansion (CTE): 33.333333333333336 to 36.11111111111111 µin/in-F

Description: EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability,

• Viscosity: 400,000 cP
• Use Temperature: -80 to 400 F
• Thermal Conductivity: 5.7 to 6.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 13,333,333.333333332 to 15,555,555.555555556 µin/in-F

Description: 70-3811 is a two component, aluminum filled epoxy system. This system is used for making heat resistance tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a unique

• Viscosity: 48,000 cP
• Use Temperature: -103 to 572 F
• Thermal Conductivity: 2.1634185 W/m-K
• Tensile Strength (Break): 14,500 psi

Description: Sauereisen Zircon Potting Cement No. 13 is primarily used where high electrical insulation and thermal conductivity are desired. No. 13 cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal shock.

• Use Temperature: 2,600 F
• Thermal Conductivity: 1.1538232 to 1.5865069 W/m-K
• Coeff. of Thermal Expansion (CTE): 2.5999999999999996 µin/in-F
• Tensile Strength (Break): 740 psi

Description: Supreme 121AOND is a thermally conductive, electrically insulative epoxy with superior physical strength properties and a high glass transition temperature. It has a paste consistency and a long working life.

• Applied Thickness / Gap Fill: 0.003 to 0.005 inch
• Viscosity: 10,000 to 25,000 cP
• Use Temperature: -80 to 550 F
• Thermal Conductivity: 0.58 to 0.72 W/m-K

Description: Henkel Loctite STYCAST 2762 Black is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal conductivity. It is resistant to

• Thermal Conductivity: 1.37 W/m-K
• Dielectric Strength: 381.0000000000008 kV/in
• Viscosity: 50,000 cP
• Features: Encapsulant / Potting Compound

Description: Henkel Loctite STYCAST 2762 FT Black, formally Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal

• Thermal Conductivity: 1.34 W/m-K
• Dielectric Strength: 400.00000000000006 kV/in
• Viscosity: 250,000 cP
• Features: Encapsulant / Potting Compound

Description: Henkel Loctite STYCAST 2762 FT Black, formerly Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal

• Thermal Conductivity: 1.34 W/m-K
• Dielectric Strength: 400.00000000000006 kV/in
• Viscosity: 250,000 cP
• Features: Encapsulant / Potting Compound

Description: Techsil® HTC is a non-silicone heat transfer compound with a high thermal conductivity (0.9W/mK) designed for thermal coupling of electrical components. HTC is recommended where the efficient and reliable thermal coupling of electrical and electronic

• Use Temperature: -50 to 130 F
• Features: Electronics
• Type: Thermal Compound / Thermally Conductive

Description: Dow DOWSIL™ TC-6020 Thermally Conductive Encapsulant Part B Gray is a two-part silicone elastomer. It offers high thermal conductivity, excellent dielectric properties, and adhesion to aluminum. It is used in the manufacture of electrical and PCB products and modules. 1 kg Can.

• Thermal Conductivity: 2.72 W/m-K
• Elongation: 20.6 %
• Tensile Strength (Break): 139 psi
• Dielectric Strength: 612.1400000000012 kV/in

Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are

• Thermal Conductivity: 1.35574226 W/m-K
• Coeff. of Thermal Expansion (CTE): 16.5 µin/in-F
• Dielectric Strength: 390.0000000000004 kV/in
• Dielectric Constant (Relative Permittivity): 5.21

Description: BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high

• Use Temperature: 140 to 392 F
• Features: Encapsulating / Potting, Leveling / Filling Compound, Thermal Compound / Heat Conductive
• Form / Function: Gap Filling Compound
• Chemical System: Silicone

Description: BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low

• Use Temperature: -76 to 392 F
• Features: Gap Filling Compound, Pad, Thermal / Heat Conductive
• Industry: OEM / Industrial
• Chemical System: Silicone

Description: 50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system

• Viscosity: 3,000 to 90,000 cP
• Use Temperature: -67 to 401 F
• Thermal Conductivity: 1.65862085 W/m-K
• Coeff. of Thermal Expansion (CTE): 16.666666666666668 µin/in-F

Description: The 50-2185FR Potting and Encapsulating Compound has been formulated to provide a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. This system offers excellent heat transfer, low exotherm and excellent electrical

• Viscosity: 27,000 cP
• Use Temperature: -58 to 248 F
• Thermal Conductivity: 1.22593715 W/m-K
• Tensile Strength (Break): 800 psi

Description: Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range of -100°F to +500°F with a glass transition

• Applied Thickness / Gap Fill: 0.004 to 0.006 inch
• Viscosity: 140,000 to 280,000 cP
• Use Temperature: -100 to 500 F
• Tensile Strength (Break): 6,000 to 7,000 psi

Description: LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for

• Viscosity: 25,000 cP
• Chemical System: Epoxy (EP)
• Type: Thermal Compound / Thermally Conductive
• Cure / Technology: Two Component System

Description: encapsulating, assembling, bonding. Is a thick or thin film of cement required? This dictates whether or not an air set or a chemical set cement should be used. 2. Thermal Considerations What is the maximum temperature that the cement must withstand? What degree of thermal

• Use Temperature: 1,796 to 2,597 F
• Thermal Conductivity: 0.5769116 to 1.5865069 W/m-K
• Coeff. of Thermal Expansion (CTE): 6.2 to 12.999999999999998 µin/in-F
• Tensile Strength (Break): 325 to 1,500 psi

Description: MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior

• Industry: Electronics (PCB / SMT Assembly)
• Chemical System: Epoxy (EP)

Description: Sauereisen Electrotemp Cement No. 8 is primarily used where high electrical insulation and thermal conductivity are desired. No. 8 cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal shock. Formulated with

• Use Temperature: 2,600 F
• Thermal Conductivity: 1.1538232 to 1.5865069 W/m-K
• Coeff. of Thermal Expansion (CTE): 2.5999999999999996 µin/in-F
• Tensile Strength (Break): 400 psi

Description: (Known as HYSOL STYCAST 2762-Catalyst 14 ) LOCTITE CAT 14 is a two component high thermal conductivity epoxy encapsulant for electronic components exposed to harsh environments. This material is also ideal for large and complex castings that require high temperature

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound

Description: Sauereisen Insultemp Cement No. 10 is primarily used where high electrical insulation and thermal conductivity are desired. No. 10 is a phosphate-bonded material that cures by a chemical-set and is ideal for potting applications subject to high temperature and/or

• Use Temperature: 2,400 F
• Thermal Conductivity: 1.442279 to 2.3076464 W/m-K
• Coeff. of Thermal Expansion (CTE): 5 µin/in-F
• Tensile Strength (Break): 300 psi

Description: (Known as STYCAST 2850FT ) LOCTITE STYCAST 2850FT is for high thermal conductivity and low outgassing, consider this encapsulant.

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound

Description: (Known as HYSOL STYCAST 2762 Catalyst 17M-1 ) LOCTITE STYCAST 2762 is a two component epoxy encapsulant designed for electronic components exposed to harsh environments. This material is also ideal for large and complex castings that require high temperature resistance and thermal

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound

Description: Techsil® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal

• Features: Electronics, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Liquid, Metal, Plastic, Thermal / Heat Conductive
• Chemical System: Epoxy (EP)
• Cure / Technology: Two Component System

Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.

• Viscosity: 40,000 cP
• Use Temperature: -55 to 150 F
• Thermal Conductivity: 1.15 W/m-K
• Coeff. of Thermal Expansion (CTE): 12.222222222222221 µin/in-F

Description: : it is perfectly adapted for the lead-free solder reflow. Its reactivity enables it to be cured at 150C in less than 2 hours. Its outstanding features are : high ionic purity, high thermal conductivity and good adhesion on current surfaces./span>

• Viscosity: 20,000 cP
• Thermal Conductivity: 7 W/m-K
• Coeff. of Thermal Expansion (CTE): 27.77777777777778 to 94.44444444444444 µin/in-F
• Features: Die Bonding Adhesive / Compound, Electrically Conductive, Filled, Grease / Paste, Thermal / Heat Conductive

Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications

• Viscosity: 8,000 to 10,000 cP
• Use Temperature: -67 to 392 F
• Thermal Conductivity: 1.3 W/m-K
• Coeff. of Thermal Expansion (CTE): 111.11111111111111 µin/in-F

Description: well suited to applications which require low and high temperature bonding, the potting and encapsulation of electrical assemblies, thermal insulation applications and cast-in-place heat shielding. DBT is the recommended catalyst for RTV560. Product Benefits Room temperature

• Use Temperature: -115 to 260 F
• Features: Electronics, Encapsulating / Potting
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide,

• Use Temperature: 900 F
• Chemical System: Ceramic / Inorganic Cement, Silicone
• Features: Electronics, Encapsulating / Potting, Grease / Paste
• Composition: Filled

Description: Electrolube UR5097RP250G

• Features: Encapsulating / Potting Compound, Flame Retardant (e.g. UL 94 Rated), Specialty / Other, Thermal Compound / Interface (Thermally Conductive)