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Supplier: Henkel Corporation - Industrial
Description: catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. High thermal conductivity Low thermal expansion Low CTE Electrically Insulating
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 1.38 W/m-K
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Supplier: Sauereisen, Inc.
Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock.
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 3.4 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Dielectric Strength: 254 kV/in
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Supplier: Master Bond, Inc.
Description: EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability,
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 1.33E7 to 1.56E7 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermal Compound / Thermally Conductive
- Form / Function: Gap Filling Compound, Encapsulant / Potting Compound
- Use Temperature: 140 to 392 F
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Encapsulants and Potting Compounds - Techsil® Non Silicone Heat Transfer Compound 620gm -- TEOT04005Supplier: Techsil Limited
Description: Techsil® HTC is a non-silicone heat transfer compound with a high thermal conductivity (0.9W/mK) designed for thermal coupling of electrical components. HTC is recommended where the efficient and reliable thermal coupling of electrical and electronic
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Use Temperature: -50 to 130 F
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Supplier: Master Bond, Inc.
Description: properties including high thermal conductivity, excellent electrical insulation properties, good physical strength properties and a high degree of flexibility. EP37-3FLFAN has low viscosity with excellent flow characteristics making it ideal as a thermally
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 33.33 to 36.11 µin/in-F
- Composition: Unfilled
- Compound Type: Electrically Conductive, Electrical Insulation / Dielectric
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Supplier: Sauereisen, Inc.
Description: Sauereisen Zircon Potting Cement No. 13 is primarily used where high electrical insulation and thermal conductivity are desired. No. 13 cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal shock.
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 2.6 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Master Bond, Inc.
Description: Supreme 121AOND is a thermally conductive, electrically insulative epoxy with superior physical strength properties and a high glass transition temperature. It has a paste consistency and a long working life.
- Applied Thickness / Gap Fill: 0.0030 to 0.0050 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 25 to 27.78 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Epoxies Etc...
Description: 70-3811 is a two component, aluminum filled epoxy system. This system is used for making heat resistance tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a unique
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: OMEGA Engineering, Inc.
Description: degree of thermal conductivity is needed? What degree of thermal expansion is allowed? These parameters are then matched to the appropriate cement. 3. Substrate What materials will the cement be in contact with? 4. Application Considerations Pot life, set time, method of
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 6.2 to 13 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System, Two Component System
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Supplier: OMEGA Engineering, Inc.
Description: conductivity is needed? What degree of thermal expansion is allowed? These properties are then matched to the appropriate cement. 3. Solvent 10% Sodium Hydroxide. However it's difficult to remove cured cement. 4. Substrate What materials will the cement be in contact with?
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 2.6 to 12.4 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System, Two Component System
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Supplier: Epoxies Etc...
Description: 50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 16.67 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2762 FT Black, formerly Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 400 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2762 FT Black, formally Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 400 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2762 Black is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal conductivity. It is resistant to
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 381 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: Thermal conductivity: 1.0 W/m-K Ultra-conforming, designed for fragile and low-stress applications Ambient and accelerated cure schedules 100% Solids – no cure by-products Excellent low and high temperature mechanical and chemical stability
- Dielectric Constant (Relative Permittivity): 0.0050
- Material Type: Gap Filling Compound
- Thermal Conductivity: 1 W/m-K
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good chemical resistance, good electrical insulation properties, high thermal conductivity,
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.2 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: .007" spacer beads Pot Life - 15 min, 60 min, 600 min Cartridges - 50cc, 400cc Kits - 1200cc, 10 gallon Custom made configurations available upon request Benefits Thermal conductivity: 2.0 W/m-K Ultra-conforming, designed for fragile and low
- Dielectric Constant (Relative Permittivity): 0.0070
- Material Type: Gap Filling Compound
- Thermal Conductivity: 2 W/m-K
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Supplier: Epoxies Etc...
Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.72 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Techsil Limited
Description: Techsil® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Epoxies Etc...
Description: The 50-2185FR Potting and Encapsulating Compound has been formulated to provide a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. This system offers excellent heat transfer, low exotherm and excellent electrical
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Techsil Limited
Description: . RTV560 is well suited to applications which require low and high temperature bonding, the potting and encapsulation of electrical assemblies, thermal insulation applications and cast-in-place heat shielding. DBT is the recommended catalyst for RTV560. Product Benefits Room
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Encapsulants and Potting Compounds - Momentive RTV560 Red Electronic Silicone +DBT 12lb -- MOSI02088Supplier: Techsil Limited
Description: . RTV560 is well suited to applications which require low and high temperature bonding, the potting and encapsulation of electrical assemblies, thermal insulation applications and cast-in-place heat shielding. DBT is the recommended catalyst for RTV560. Product Benefits Room
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Encapsulants and Potting Compounds - Thermally Conductive Epoxy Polysulfide Adhesive -- EP21TPFL-1AOSupplier: Master Bond, Inc.
Description: fluids and related compounds. With an elongation of 150-200%, EP21TPFL-1AO offers a high degree of flexibility and it can withstand intense thermal cycling and mechanical shock. Its low viscosity makes it well suited for potting/encapsulatio nn.
- Chemical / Polymer System Type: Polysulfide, Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 61.11 to 72.22 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 12.22 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Aremco Products, Inc.
Description: , zirconium oxide, and zirconium silicate, offer unique properties with respect to operating temperature, thermal conductivity, dielectric and mechanical strength. Ceramacast™ products are supplied as one- or two-part systems. One-part systems are mixed with water or a specialty binder
- Chemical / Polymer System Type: Silicone, Ceramic / Inorganic Cement
- Composition: Filled
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
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Supplier: RS Components, Ltd.
Description: A two part thixotropic potting and encapsulating compound, protecting electronic devices. Exceptional high temperature properties. Applications include areas where the operating temperature will be up to 200°C. 1:1 Ratio. Excellent flexibility. Flame retardant. High
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.8000 W/m-K
- Use Temperature: -76 to 392 F
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Supplier: RS Components, Ltd.
Description: A two part general purpose potting and encapsulating compound. Protecting electronic devices. Exceptional high temperature properties applications up to +200°C. 1:1 Ratio. Excellent flexibility. Flame retardant. Thick section cure. Chemical and water resistant Product Material
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.6000 W/m-K
- Use Temperature: -58 to 392 F
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Supplier: RS Components, Ltd.
Description: High degree of toughness Product Material = PUR Package Type = Pack Package Size = 250 g Special Properties = Encapsulating Compound, Flame Retardant, Thermal Conductivity Cure Time = 24 h Hardness = 85 Shore A Thermal Conductivity = 0.65W/mK Colour = Black
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.6500 W/m-K
- Use Temperature: -40 to 230 F
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Supplier: Henkel Corporation - Electronics
Description: (Known as STYCAST 2850FT ) LOCTITE STYCAST 2850FT is for high thermal conductivity and low outgassing, consider this encapsulant.
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: RS Components, Ltd.
Description: The CP Series of Vishay wirewound resistors. All models are highly reliable and of extremely good quality. High performance for low cost. High power to size ratio. Various ohms available. Special inorganic potting compound and ceramic case provide high
- Power Rating: 5 watts
- Resistance Range: 100 ohms
- Technology / Construction: Wirewound Resistor
- Temperature Coefficient (TCR): 300 ±ppm/°C
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Featured Products Top
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& Potting materials like the ELAN-tim® products for insulation purposes supports the heat management in the converters. The products have high thermal conductivity and dissipate heat away fast from the sensitive components (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
the material cures in place and will not run or slump. The compound requires a relatively low heat cure of 85°C for 2-3 hours, is thermally conductive and electrically non-conductive. “Supreme 3DM-85 is designed for heat sensitive components that cannot withstand high temperatures (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
plastics. This high strength system delivers tensile lap shear, tensile and compressive strength of 1,800-2,000 psi, 6,000-7,500 psi and 15,000-17,000 psi, respectively. This electrically insulative compound features a thermal conductivity of 10 (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
pot life of 7-9 hours at room temperature for a 100 gram mass. Upon curing, EP29LPAO exhibits low exotherm, even in large volumes. This dimensionally stable formulation has low shrinkage upon cure, both linearly and volumetrically. EP29LPAO delivers a thermal conductivity of 9 (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
controllers, drive systems, and power units. Thermal potting adhesives are typically two-component composite materials based on silicone, epoxy, or polyurethane resins, filled with high thermal conductivity powders. These materials offer excellent (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
due to their outstanding thermal conductivity and protective properties. Enhancement of Thermal Conductivity Efficiency Thermal potting compounds are primarily used to fill the gap between the chip and the heat sink in RF modules. These compounds create a (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
sensitive components (Bectron®, CONAP®). Epoxy and silicone potting materials that provide protection for high temperature applications (Epoxylite®, (read more)
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Static Dissipative / Electrical Conductive Thermal Conductivity EMI Shielding Reduced Permeation Elevated Temperature Performance Masterbatch Overview: Graphene (read more)
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Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
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QSil-553 2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to (read more)
Browse Conductive Compounds Datasheets for CHT USA Inc.
Conduct Research Top
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Managing Heat Transfer With Potting Compounds
and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control
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Performance Analysis and Thermal Modeling of a High-Energy-Density Prebiased Inductor
The dc inductor (choke) considered in this paper is manufactured us- ing a novel technique incorporating high thermal conductivity potting compound and a high copper-fill-factor preformed coil [15]–[17].
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Thermal analysis of a high energy density pre-biased choke
The choke is manufactured using a novel technique incorporating high thermal conductivity potting compound and a high copper fill-factor preformed coil [4], [5].
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Evaluation of heat transfer characteristic of Aluminum Nitride (AlN) potting compound for the end windings of permanent magnet synchronous machines
This paper introduces Aluminum Nitride (AlN) potting compound with high thermal conductivity into PMSM heat dissipation.
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Design Considerations of a Brushless Open-Slot Radial-Flux PM Hub Motor
The complete stator/winding assembly is encapsulated using a high - thermal - conductivity potting compound .
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Evaluation of SiC BJTs for High-Power DC–DC Converters
The magnetic devices use Finemet nanocrystalline amorphous metal cores with copper foil wind- ings, and for good thermal management, they are encapsulated together in an aluminium case using a high - thermal - conductivity potting compound .
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Non-uniform thermal properties of an alumina granule/epoxy potting compound
The higher thermal conductivity of the potting compound helps to remove the heat generated by the device.
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Heat Pipe Cooled Induction Motor
The use of a higher thermal conductivity , filled potting compound was re- quired because of the reorientation 'of the heat flow paths.
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The discrepancy between human peripheral nerve chronaxie times as measured using magnetic and electric field stimuli: the relevance to MRI gradient coil safety
To reduce heating, the coil was completely potted within a high thermal conductivity epoxy compound (Cotronics Corp., DurapotTM 865 Epoxy, Brooklyn, New York).
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Sensory and motor stimulation thresholds of the ulnar nerve from electric and magnetic field stimuli: Implications to gradient coil operation
The coil was com- pletely potted within a high thermal conductivity epoxy compound (Cotronics Corp., DurapotTM 865 Epoxy, .
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Thermally enhanced SMT power components
The thermal enhancement is done by filling the air gap between the winding and can by pitch or potting compound and inserting a high thermal conductivity centre rod in the middle of the winding.