-
Encapsulants and Potting Compounds - Techsil HM 2277 12 Amber Potting Hot melt Adhesive -- PAHM20218Supplier: Techsil Limited
Description: Techsil HM 2277 is a amber colored potting & encapsulating polyamide adhesive. HM 2277 has a very low viscosity that sets very hard. It is used for two main applications; the first is for potting and encapsulation in the electronics industry; secondly it is an ideal substance for knot
- Cure Type / Technology: Thermoplastic / Hot Melt
- Form / Function: Encapsulant / Potting Compound
-
Supplier: Henkel Corporation - Industrial
Description: TECHNOMELT AS 8998, Hot Melt Polyolefin, Masking TECHNOMELT® AS 8998 peelable hot melt adhesive is recommended for use for masking off areas that needs protection before conformal coating applications. It is formulated to have excellent slump resistance up to 100 °C.
- Cure Type / Technology: Thermoplastic / Hot Melt
- Form / Function: Encapsulant / Potting Compound
- Viscosity: Up to 4000 cP
-
Supplier: Henkel Corporation - Industrial
Description: TECHNOMELT PA 6344, Polyamide, Encapsulation TECHNOMELT® PA 6344 UV resistance, polyamide-based, thermoplastic, hot melt adhesive is designed for molding compound applications. This material adheres well to a variety of substrates including plastic, glass, metals and ABS. UV
- Cure Type / Technology: Thermoplastic / Hot Melt
-
-
Supplier: Techsil Limited
Description: OverTec 5 FR is a polyamide resin specifically designed for over-molding. It has UL-VO flammability rating and excellent electrical properties. Components can be electrically insulated and sealed from water without the need of housing or the use of slow and wasteful 2- component
- Cure Type / Technology: Thermoplastic / Hot Melt
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite Technomelt PA 646, formerly known as Macromelt OM 646, is a low viscosity, high performance thermoplastic polyamide that is designed to meet low pressure molding process requirements. It is useful for applications that require increased strength and hardness such as memory sticks and
- Cure Type / Technology: Thermoplastic / Hot Melt
- Dielectric Strength: 559 kV/in
- Elongation: 800 %
- Form / Function: Encapsulant / Potting Compound
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite Technomelt PA 641, formerly known as Macromelt OM 641, is a low viscosity, high performance thermoplastic polyamide that is designed to meet low pressure molding process requirements. It is useful for applications that require increased strength and hardness such as memory sticks and
- Cure Type / Technology: Thermoplastic / Hot Melt
- Dielectric Strength: 635 kV/in
- Elongation: 400 %
- Form / Function: Encapsulant / Potting Compound
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite Technomelt PA 687, formerly known as Macromelt OM 687, polyamide that is formulated for very low water vapor transmission for the most demanding high humidity applications such as on the inside of an automobile tire.
- Cure Type / Technology: Thermoplastic / Hot Melt
- Elongation: 800 %
- Form / Function: Encapsulant / Potting Compound
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite Technomelt PA 638, formerly known as Macromelt OM 638, is a low viscosity, high performance thermoplastic polyamide that is designed to meet low pressure molding process requirements. It is suitable for automotive firewall applications where 125 °C service temperatures are required.
- Cure Type / Technology: Thermoplastic / Hot Melt
- Dielectric Strength: 483 kV/in
- Form / Function: Encapsulant / Potting Compound
- Industry Applications: Automotive
-
Supplier: Henkel Corporation - Electronics
Description: Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,
- Chemical / Polymer System Type: Specialty / Other
- Elongation: 300 %
- Features: Thermal Compound / Thermally Conductive, UL Approved, Electrically Insulating / Dielectric
- Industry: Electronics, Encapsulanting / Potting
-
Supplier: Henkel Corporation - Electronics
Description: Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,
- Chemical / Polymer System Type: Specialty / Other
- Cure Type / Technology: Thermoplastic / Hot Melt
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Elongation: 733 %
-
Supplier: Henkel Corporation - Electronics
Description: Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,
- Chemical / Polymer System Type: Polyamide
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermoplastic / Hot Melt
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
-
Supplier: Henkel Corporation - Electronics
Description: Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,
- Chemical / Polymer System Type: Polyamide
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermoplastic / Hot Melt
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
Find Suppliers by Category Top
Featured Products Top
-
during startup and shutdown cycles. Controlled melt delivery Ultra Hot Runners maintain consistent temperature control and deliver precise melt flow to each cavity. By preventing leaks and ensuring even flow (read more)
Browse Hot Runner Controllers Datasheets for Husky Technologies™ -
deposition method: the volatile compounds of aluminum react with nitrogen or ammonia to precipitate aluminum nitride powder from the gas phase; According to different aluminum sources, it can be divided into inorganic (aluminum halide) and organic (alkyl aluminum) chemical vapor deposition (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited
More Information Top
Indicates content that may require registration and/or purchase.
-
Fluorescent Light Fixture - Self Help Forums
When they begin to fail, they get quite hot and melt and leak the potting compound (tar like stuff).
-
Fluorescent Light Fixture - Self Help Forums
When they begin to fail, they get quite hot and melt and leak the potting compound (tar like stuff).
-
States > Iowa > Polk County > Regulations > [IA Polk Reg 05] 05 - Air Pollution
44) Application of hot melt adhesives from closed- pot systems using polyolefin compounds , polyamides, acrylics, ethylene vinyl acetate and urethane material when stored and applied at the manufacturer’s recommended temperatures.
-
States > Iowa > State > Regulations > Title 567 - Environmental Protection Commission > Title II - Air Quality > [IA AC 567 chapter 22] 022 - Controlling Pollu...
27) Application of hot melt adhesives from closed- pot systems using polyolefin compounds , polyamides, acrylics, ethylene vinyl acetate and urethane material when stored and applied at the manufacturer's recommended temperatures.
-
States > Iowa > State > Administrative Bulletin > 2005 > [2005 IA Register 1109] 11/09/2005
Amend paragraph 22.1(2)“x” by adopting the following new subparagraph: (27) Application of hot melt adhesives from closed- pot systems using polyolefin compounds , polyamides, acrylics, ethylene vinyl acetate and urethane material when stored and applied at the manufacturer’s recommended temperatures.
-
States > Iowa > State > Proposed Regulations > 2005 Documents > November 9, 2005 > [2005 IA Proposed ia-20051109-0071-0006997] 567-20 and567-22 - Equipment and...
27) Application of hot melt adhesives from closed- pot systems using polyolefin compounds , polyamides, acrylics, ethylene vinyl acetate and urethane material when stored and applied at the manufacturer's recommended temperatures.
-
States > Iowa > State > Administrative Bulletin > 2006 > [2006 IA Register 315] 03/15/2006
Amend paragraph 22.1(2)“x” by adopting the following new subparagraph: (27) Application of hot melt adhesives from closed- pot systems using polyolefin compounds , polyamides, acrylics, ethylene vinyl acetate and urethane material when stored and applied at the manufacturer’s recommended temperatures.
-
EARLY ENTRANCE COPRODUCTION PLANT
It is expected that these physical properties would make the refined EECP F-T synthetic paraffinic hard-wax product an ideal candidate for several applications such as hot melt adhesives, coatings, hardening additives, potting , cable compounds , graphic arts applications, printing inks, plastics …
-
EARLY ENTRANCE COPRODUCTION PLANT
It is expected that these physical properties would make the refined EECP F-T synthetic paraffinic hard-wax product an ideal candidate for several applications such as hot melt adhesives, coatings, hardening additives, potting and cable compounds , graphic arts applications, printing inks …
-
Encyclopedia of Industrial Additives, Volume 4
… polyesters; in graphic arts for rub- resistant and slip agent in printing inks, compound in carbon paper inks, and back coating; in electrical and elec- tronics for insulating compounds , pot- ting agents, nuclear reactor shielding; in hot - melt adhesives in paper coatings …