Hot Melt Potting Compounds

Description: Techsil HM 2277 is a amber colored potting & encapsulating polyamide adhesive. HM 2277 has a very low viscosity that sets very hard. It is used for two main applications; the first is for potting and encapsulation in the electronics industry; secondly it is an ideal substance for knot

• Features: Encapsulanting / Potting
• Cure / Technology: Thermoplastic / Hot Melt

Description: TECHNOMELT AS 8998, Hot Melt Polyolefin, Masking TECHNOMELT® AS 8998 peelable hot melt adhesive is recommended for use for masking off areas that needs protection before conformal coating applications. It is formulated to have excellent slump resistance up to 100 °C.

• Viscosity: 4,000 cP
• Features: Encapsulanting / Potting
• Cure / Technology: Thermoplastic / Hot Melt

Description: Henkel Loctite Technomelt PA 687, formerly known as Macromelt OM 687, polyamide that is formulated for very low water vapor transmission for the most demanding high humidity applications such as on the inside of an automobile tire.

• Elongation: 800 %
• Features: Encapsulant / Potting Compound
• Cure / Technology: Thermoplastic / Hot Melt

Description: Henkel Loctite Technomelt PA 641, formerly known as Macromelt OM 641, is a low viscosity, high performance thermoplastic polyamide that is designed to meet low pressure molding process requirements. It is useful for applications that require increased strength and hardness such as memory sticks and

• Elongation: 400 %
• Dielectric Strength: 635.0000000000014 kV/in
• Viscosity: 4,500 cP
• Features: Encapsulant / Potting Compound

Description: Henkel Loctite Technomelt PA 633, formerly known as Macromelt OM 633, is a low viscosity, high performance thermoplastic polyamide that is designed to meet low pressure molding process requirements. It is suitable for automotive firewall applications where 125 °C service temperatures are required.

• Elongation: 400 %
• Dielectric Strength: 609.6000000000013 kV/in
• Viscosity: 3,500 cP
• Industry: Automotive

Description: Henkel Loctite Technomelt PA 638, formerly known as Macromelt OM 638, is a low viscosity, high performance thermoplastic polyamide that is designed to meet low pressure molding process requirements. It is suitable for automotive firewall applications where 125 °C service temperatures are required.

• Dielectric Strength: 482.600000000001 kV/in
• Viscosity: 3,400 cP
• Industry: Automotive
• Features: Encapsulant / Potting Compound

Description: OverTec 5 FR is a polyamide resin specifically designed for over-molding. It has UL-VO flammability rating and excellent electrical properties. Components can be electrically insulated and sealed from water without the need of housing or the use of slow and wasteful 2- component

• Cure / Technology: Thermoplastic / Hot Melt

Description: Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,

• Use Temperature: -40 to 257 F
• Elongation: 400 %
• Dielectric Strength: 609.6000000000013 kV/in
• Dielectric Constant (Relative Permittivity): 2.6 to 3.8

Description: Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,

• Use Temperature: -40 to 257 F
• Elongation: 800 %
• Dielectric Strength: 558.8000000000012 kV/in
• Dielectric Constant (Relative Permittivity): 2.6 to 3.4

Description: Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,

• Use Temperature: -40 to 284 F
• Elongation: 600 %
• Water Absorption: 0.4 %
• Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive

Description: Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,

• Use Temperature: -40 to 302 F
• Elongation: 600 %
• Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
• Features: Electronics, Encapsulant / Potting Compound, Pellets / Solid Form, UL Approved