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Supplier: Ironwood Electronics, Inc.
Description: Swivel sockt lid, ROHS compliant
- Number of Contacts: 128
- Contacts Pitch: 0.4 mm
- Contact Plating: Gold Plating
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: Sockets & Adapters SO Prototyp Adaptor
- Product Type: IC Socket
- Features: Package Adapters / Converters
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Supplier: Ironwood Electronics, Inc.
Description: 1.25in 1.0in 1.25in; mso-header-margin:.5in; mso-footer-margin:.5in; mso-paper-source:0;} div.Section1 {page:Section1;} --> Ironwood's QFP Carrier Adapters are two-piece systems that allow for the probing and socketing of QFP devices. The bottom assembly is a surface mount foot
- Number of Contacts: 240
- Contacts Pitch: 0.5 mm
- Contact Plating: Gold Plating
- Product Type: IC Socket
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Supplier: Utmel Electronic Limited
Description: Sockets & Adapters Socketed Mini Mod SPC560P QFP64
- Product Type: IC Socket
- Features: Other, Package Adapters / Converters
- Socket Type: QFP
- RoHS Compliant: RoHS Compliant
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Supplier: JC Cherry, Inc.
Description: For QFP, SOP Latch Lock type or Screw Lock type The test socket that enables high-speed transmission signal measurement by adopting the contact method that directly presses the device lead against the board. Application ●Mounting on PCB for mass-production ●Final test and inspection at
- Operating Temperature: -40 to 150 C
- Contacts Pitch: 0.4 mm
- Product Type: IC Socket
- Socket Type: QFP, SOIC / SOP
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Supplier: Ironwood Electronics, Inc.
Description: Ironwood's QFP Probing Adapters, or "Carrier Adapters", are two-piece systems that allow probing and socketing of QFP devices. The socketed probe board plugs into an SMT emulator base, or "foot", that is soldered to the target board. The QFP Clip allows probing of an SMT mounted
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Supplier: Sensata Technologies
Description: Open Top Reduced Lid Activation Force Auto Load Compatible Package Alignment 0.4mm pitch Corner Lead Guide plus Alignment Rails 0.5mm pitch Corner Lead Guide Modular tooling provides maximum flexibility to meet most lead form and pin count combinations Thru Hole Design with staggered tails to ease
- Contact Resistance: 65 milliohms
- Operating Temperature: 150 C
- Contact Plating: Gold Plating
- Product Type: IC Socket
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Supplier: RS Components, Ltd.
Description: 100 way QFP to PGA 1piece socket,0.5mm
- Contacts Pitch: 0.5 to 2.54 mm
- Contact Plating: Nickel Plating
- Features: Other
- Product Type: Package Adapters / Converters
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Supplier: Sensata Technologies
Description: Open top, Zero Insertion Force design for automatic loading Compact outline for maximum board density Highly reliable Dual Beam contact design. "H" version. Lid actuation force peaks during stroke and drops off at full deflection for ease of use Thru hole design
- Insulation Resistance: 5,000 Mohms
- Contact Resistance: 50 milliohms
- Operating Temperature: 150 C
- Contact Plating: Gold Plating
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Supplier: Aries Electronics, Inc.
Description: FEATURES Mates common QFP packages to standard breadboard and breakout boards for rapid and easy prototyping Panelized adapters available upon request GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL 94V-0 with 1/2-oz. Cu traces PIN INSULATOR: Polyester, UL 94V-0 PINS: 360
- Operating Temperature: -55 to 125 C
- Number of Contacts: 32 to 80
- Contacts Pitch: 2.54 mm
- Contact Plating: Gold Plating
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Supplier: DigiKey
Description: 132 (4 x 33) Pos QFP Socket Tin-Lead Through Hole
- Features: Board Mount Connector
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Supplier: Aries Electronics, Inc.
Description: FEATURES Convert surface-mount QFP packages to a 15x15 PGA footprint Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical
- Operating Temperature: 105 C
- Number of Contacts: 160
- Contacts Pitch: 2.54 mm
- Contact Plating: Nickel Plating
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Supplier: Aries Electronics, Inc.
Description: FEATURES Pressure-mount plunge to board interposer Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more Very low inductance per contact site High cycle life with easy maintenance Manual or Automated Handler applications GENERAL SPECIFICATIONS INSERTION LOSS: less than -1dB
- Current Rating: 4 amps
- Contact Resistance: 20 milliohms
- Operating Temperature: -40 to 65.55555555555556 C
- Contacts Pitch: 0.32 mm
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Supplier: DigiKey
Description: IC Socket Adapter QFP To PGA Through Hole
- Features: Board Mount Connector
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Supplier: DigiKey
Description: Xeltek Programmers - Socket Module - QFP
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Supplier: Aries Electronics, Inc.
Description: up to 27mm square Small overall socket size/profile allows max. number of sockets per BIB and BIB’s per oven, while being operator friendly GENERAL SPECIFICATIONS MOLDED SOCKET COMPONENTS: UL 94V-0 PEEK and/or Ultem 1dB BANDWIDTH: 1GHz (0.80mm pitch) (large probe) ESTIMATED
- Operating Temperature: -55 to 150 C
- Contacts Pitch: 5.08 to 20.32 mm
- Socket Type: BGA, CSP, Test / Prototyping Socket
- Features: Clamshell Socket, Other, Solderless
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IC Sockets and Headers - Connectors, Interconnects - Rectangular Connectors - Headers, Specialty PinSupplier: Win Source Electronics
Description: Features: HCS12X series Microcontroller IC 16-Bit 80MHz 128KB (128K x 8) FLASH 80-QFP (14x14)
- Product Type: IC Headers
- Features: Other
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: IC TELECOM INTERFACE 208QFP / Telecom IC Line Interface Unit (LIU) 208-PQFP (28x28) Product overview: 82V2088DRG from Renesas Electronics Corporation is an Electronic Connector for board-to-board, wire-to-board, backplane, terminal, cable, and industrial interconnect applications. It
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Supplier: ValueTronics International, Inc.
Description: (Bi-Polar PROMs 866C, & 867C) Device libraries - over 32,000 Interface - USB 2.0 / USB 1.1 Compatible Programming Socket - DIL40 pin ZIF Socket, ISP for in-circuit programming Buffer Features - Erase, Random Data Fill, Fill Block, Copy Block, Move Block, Swap Block, Buffer Print, Find
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The Levan Elastomeric socket family is engineered specifically with precision. The elastomeric grid of Levan features conductive columns that guarantee accurate and consistent test results across a spectrum of devices. The conductive columns in the elastomeric grid ensure accurate and (read more)
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IC201-1004-008 Yamaichi Electronics | Mouser
QFP IC Sockets .
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IC234-1604-032P Yamaichi Electronics | Mouser
QFP IC Sockets .
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IC51-0444-400 Yamaichi Electronics | Mouser
QFP IC Sockets .
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IC51-1004-809 RoHS Compliant | Mouser
IC & Component Sockets 100Pin QFP Burn-in Skt 0.50 pitch .
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Property of impedance matching of novel QFP socket contactor by 3D electro-magnetic simulation
The use mostly in the QFP socket as the contact between IC lead frame and PCB contact pad is the pogo pin.
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Moveable Ground Pin in QFP Test & Burn-In Socket
Yamaichi Electronics introduces the moveable ground pin for its popular Open Top socket series IC357 for QFP type IC packages with exposed pad in test & burn-in applications.
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Hardware and software infrastructure for a family of floating-gate based FPAAs
… of two custom PCB designs which include a main board used to program and control an FPAA IC and an FPAA IC adaptor board used to interface a QFP packaged FPAA IC with the 100 pin ZIF socket on the main programming …
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Packaging of low cost electronic multichip module-laminate (MCM-L) assemblies for hermetic-equivalent performance in high reliability avionics applications
Connection to the madde was provided through one hundred and twelve edge-clip leads in a footprint configuration identi4 to a standard Quad FhtPack ( QFP ) IC package, which fit a standard QFT test socket The chip sets for both MCMs are listed …
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Measurement of on-chip I/O power supply noise and correlation verification between noise magnitude and delay increase due to SSO
After fabri- cation, the chip was mounted on a QFP package and put on a PCB board through an IC socket .
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Design of Very High-Frequency Multirate Switched-Capacitor Circuits
[7.6] Yamaichi Electronics, IC 198 Series (SMT) Socket data sheet: Quad Flat Package ( QFP ) - 44 pins.