Electronic and IC Packaging Services Information
Electronic packaging and IC packaging services perform the final stage of semiconductor device fabrication, which is to place dies, or boards, inside of a protective package that provides connectors or pins for connecting to other devices. Protective IC packaging is produced via integrated circuit encapsulation, the last stage of the semiconductor device fabrication process.
Types of Electronic and IC Packaging Services
Today, electronic packaging and IC packaging services provide many different types of IC packages.
- Single in-line package or system in package (SIP)
- Dual in-line package (DIP)
- Mini small-outline package (MSOP)
- Micro leadframe package (MLP)
- Shrink small outline package (SSOP)
- Thin shrink small outline package (TSSOP)
- Very small outline package (VSOP)
Electronic component packaging includes tinning, tape and reel packaging, lead forming, baking, lead straightening, and programming.
Integrated circuit packaging is specified according to the number of pins in the chip. For example, an SOP may have 8 to 44 pins while a DIP may have 8 to 48 pins. IC packaging tape is used to stock ICs so that they can be handled.
Electronic packaging materials include wafer and substrate bumping pastes, sphere attach fluxes, ultra-spheres (solder spheres), reflow encapsulants (no flow underfills), capillary underfills, thermal interface material, and flip-chip attach fluxes. These electronic packaging materials provide greater versatility and durability than traditional materials such as ceramics and silicon.
Electronic and IC packaging services that specialize in custom packaging can meet a customer’s specialized requirements. Many types of IC packaging equipment are used in the designing and manufacturing of integrated circuits. For example, IC packaging equipment is used to perform die attaching, IC bonding, and IC encapsulation.
Electronic packaging and IC packaging services are used in many applications and adhere to demanding quality standards. Application examples include signal and power transmission, heat dissipation, electromagnetic interference (EMI) shielding, and protection from environmental factors such as moisture, contamination, hostile chemicals, and radiation. Many electronic and IC packaging services adhere to the Institute for Interconnecting and Packaging Electronic Circuits (IPC) 610 and IPC 7711/7721 standards.
Electronics 360—Using Inkjet Printing to Build Intelligent Flexible Hybrid Circuits
Sengokucannon / CC BY 3.0
- wire bonding
- BGA packages
- ultrasonic bonding
- carbon steel ball valve
- ceramic package
- chip on board
- flip chip bonder
- hermetic package
- IC packaging
- micro leadframe package
- silicon wafer dicing
- wedge bonding
- wire bonding digital x-ray
- hermetICally sealed IC
- hermetically sealed microelectronics
- military hermetic packaging