Wire Bonding

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  • Introduction of Wedge Capillary for Wire Bonding
    Wire bonding is currently the mainstream connection method for semiconductors packaging. Commonly used wire bonding welding methods include thermocompression welding, ultrasonic welding and ultrasonic thermocompression welding. Wire bonding can be categorised as ball bonding and wedge bonding
  • Advanced Motion Control for Wire Bonding
    This application note describes the LED/IC wire bonder ecosystem (market drivers, architectures, timings...) and focus specifically on the main technical challenges for the motion control part. The selection of the control architecture and its position encoders have a significant contribution
  • Ceramics Capillary for Copper Wire Bonding
    Wire bonding is to weld the two ends of the lead to the chip pad and the lead frame respectively in a certain environment by means of thermal ultrasonic pressure, so as to realize the connection between the internal circuit and the external circuit of the chip. Up to now, the lead metal materials
  • Ceramics Capillary for Improving Wire Bonding Efficiency
    Wire bonding technology in semiconductors packaging, developed in the 1950's is one of the oldest and lowest cost interconnection solutions. It uses wire to bond by machines made from ASM Pacific, K&S, etc. similar to high-tech sewing machines; thin threads sew one chip onto another chip
  • Justifying the Purchase of Die or Wire Bonder Equipment
    performing significantly better than the old equipment. To get the final approval, those engineers need to convert their technical ideas into a monetary calculator and provide proof that the company's investment in new die bonding or wire bonding equipment is essentially worth its weight in gold.
  • Reliable Wire Bonding Through Quality Data Collection for Industry 4.0
    Wire bonding and sintering are critical processes involved in the manufacture of a majority of electronic devices. These processes are used to connect silicon chips, integrated circuits (ICs), and electrical components to their housings and boards. Wire bonding has become one of the most widespread
  • Improve Wire Bond Capability and Reliability through Use of Auxiliary Wires
    Palomar Technologies offers a variety of Auxiliary wire options for our Wire/Ball bonder. Auxiliary wires are commonly defined as an additional wire outside of a normal ball-to-stitch wire bond. Whether it be a pre-wire, generally referred to as stand-off stitch, or a post-wire, also known
  • Brief Introduction for Gold Wire Bonding and Laser Welding of Pressure Sensors
    It is necessary to introduce in advance that all operations performed by the Micro Sensor must be completed in a clean and dust-free environment in the purification workshop, and have very high requirements for the level of technology. First of all, let's introduce gold wire bonding, also known
  • Ceramics Capillary for Alloy Wire Bonding
    The miniaturization, large-scale and highly integrated development of electronic products require bonding wires with excellent electrical conductivity, thermal conductivity, oxidation resistance and plasticity.

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