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Supplier: Accuris
Description: Guidelines for Chip-on- Board Technology Implementation
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Standards and Technical Documents - Guidelines for Chip-on-Board Technology Implementation -- SM-784Supplier: IPC International, Inc.
Description: DESCRIPTION Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives,
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Supplier: Accuris
Description: GUIDELINES FOR CHIP ON BOARD TECHNOLOGY IMPLEMENTATION
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Supplier: OSRAM Opto Semiconductors
Description: SOLERIQ® S 19, 2700 K - 4000 K (white), CRI min. 90, typ. 2700 lm @ 3000 K, 85 °C, typ. 111 lm/W @ 3000 K, 85 °C Product Features Color: 2700 K - 4000 K (white) Color Rendering Index: min. 90 Luminous Flux: typ. 2700 lm @ 3000 K, 85 °C Luminous efficacy: typ. 111 lm/W @ 3000 K, 85 °C Viewing angle
- Viewing Angle: 120 degrees
- Color Temperature: 2,700 to 4,000 K
- LED Type: White
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Supplier: Utmel Electronic Limited
Description: LED LIGHTING CHIP-ON-BOARD (COB)
- Forward Voltage: 34 volts
- Forward Current: 2,160 milliamps
- Viewing Angle: 115 degrees
- Lens Type: Flat Lens
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, PC BOARD, PROCESSOR, RESISTIVE NETWORK, ON-BOARD IC CHIPS. FREE 2 YEAR RADWELL WARRANTY
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Supplier: LCSC Electronics Technology (HK) Limited
Description: SMD,12.5x12.5mm Chip On Board (COB) Light Sources ROHS
- Lamp Type: LED Lamps
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Supplier: VOXMICRO
Description: market the new-generation, low-power, resilient multi-gigabit Wi-Fi 6 connectivity, fully leveraging Qualcomm's new innovative QCA6391 connectivity Chip-on-Board (CoB). Building on VoxMicro's history of delivering advanced Wi-Fi solutions, the E63 Class provides an 18
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Supplier: Radwell International
Description: MICROPROCESSOR BOARD. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Telit IoT Solutions, Inc.
Description: ATOP 2.5G is Telit’s platform for automotive telematics on-board units (OBU‘s). It simplifies creating applications such as road pricing and eCall by including all required technologies: 2G cellular for voice and data communication, Quad band GSM assures global network coverage, GPS
- Bias / Operating Current: 3 mA
- TJ: -40 to 85 C
- Technology: GPRS, GPS, GSM
- Interface: I2C, USB
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Supplier: Newark, An Avnet Company
Description: DEV BOARD, WIRELESS SYSTEM-ON-CHIP ROHS COMPLIANT: YES
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Supplier: TOP-electronics USA
Description: LM780-0223, BT2.1 Module, Class 2, On-board Antenna LM has announced the EOL for this part. It will be replaced by the LM961 due to be releasded in April 2018. Short Range surface mount Bluetooth Module with on-board chip antenna for 3 V to 5.5 V voltage
- Technology: Bluetooth
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Supplier: Artesyn Embedded Power
Description: The Artesyn Embedded Technologies MVME3100, featuring the system-on-chip Freescale MPC8540 processor, offers a growth path for VMEbus customers with applications on the previous generation of VME, specifically the MPC8240 and similar (MPC603 family) processors. The
- Clock Speed: 833 MHz
- Main Memory (RAM): 512 MB
- CE / FCC Certified: Card is CE / FCC Certified
- Features: Controller / Processor, Other
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Supplier: Newark, An Avnet Company
Description: DEV BOARD, EFR32 WIRELESS SYSTEM-ON-CHIP; Silicon Manufacturer:Silicon Laboratories; No. of Bits:32bit; Silicon Family Name:EFR32; Core Architecture:ARM; Core Sub-Architecture:Cortex-M4; Silicon Core Number:EFR32FG1P133F256GM48; Kit RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: JM, S08JM, CAN TRANSCEIVER-TXRX, ON CHIP USB, DEMO BOARD; Silicon Manufacturer:NXP; No. of Bits:8 / 32bit; Silicon Family Name:Flexis - MCF51JM, Flexis - S08JM; Core Architecture:ColdFire, HCS08; Silicon Core Number:MCF51 RoHS Compliant: Yes
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Supplier: Nordic Semiconductor ASA
Description: The nRF52820 is a System-on-Chip (SoC) offering USB and advanced wireless connectivity in a small package, for HID, smart home, commercial, and industrial applications. The nRF52820 features an Arm Cortex-M4 processor, clocked at 64 MHz. It has 256 KB Flash and 32 KB RAM, and a range
- Clock Frequency: 64 MHz
- ROM Size: 256 KB
- RAM Size: 0.032 MB
- Operating Voltage: 1.7 to 5.5 volts
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Supplier: Nordic Semiconductor ASA
Description: The nRF52805 System-on-Chip (SoC) augments the industry-leading nRF52 Series with an SoC in a WLCSP optimized for small two-layer PCB designs, ideal for cost-constrained applications. It is the perfect choice for applications such as beacons, disposable medical devices, sensors,
- Clock Frequency: 64 MHz
- ROM Size: 192 KB
- RAM Size: 0.024 MB
- Operating Voltage: 1.7 to 3.6 volts
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Supplier: Nordic Semiconductor ASA
Description: The nRF52811 is built around a 64 MHz Arm® Cortex™-M4 CPU, and has a range of digital peripherals and interfaces such as PDM, PWM, UART, SPI and TWI. It also has a capable 12-bit ADC. Exceptionally low energy consumption is achieved using a sophisticated on-chip adaptive power
- Clock Frequency: 64 MHz
- ROM Size: 192 KB
- RAM Size: 0.024 MB
- Operating Voltage: 1.7 to 3.6 volts
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Supplier: Nordic Semiconductor ASA
Description: solution that integrates the Zephyr RTOS, protocol stacks, application samples and hardware drivers. The is the development kit for the nRF5340 SoC, and has everything needed for development on a single board.
- RAM Size: 0.512 MB
- Operating Voltage: 1.7 to 5.5 volts
- Operating Temperature: -40 to 221 F
- Processor Core: ARM
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Supplier: Accuris
Description: Surface mounting technology Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
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Supplier: Accuris
Description: Printed Boards and Printed Board Assemblies - Design and Use - Part 5-6: Attachment (Land/Joint) Considerations - Chip Carriers with J-Leads on Four Sides
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Supplier: Newark, An Avnet Company
Description: RF, TXRX, MOD, COMBO, WIFI 802.11AC/A/B/G/N, BT 4.2, CERTIFIED, ON BOARD CHIP ANTENNA ROHS COMPLIANT: YES
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Supplier: Critical Link, LLC
Description: The MitySBC-A5E is a single board computer featuring an Intel / Altera Agilex 5E SoC (System on a Chip) and includes up to 656KLE FPGA fabric, dual core Cortex-A55 + dual core Cortex-A76, on-board power supplies, and memory subsystems. The Agilex 5 delivers 2.5x
- RAM: 8,000 MB
- Communication Networks: Ethernet
- Chipset: Intel® Chipset
- Features: Other
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Supplier: Cirrus Logic, Inc.
Description: The EP9315 is a highly integrated system-on-chip processor that paves the way for next-generation consumer and industrial electronic products. The EP9315 features an advanced 200 MHz ARM920T processor design with a memory management unit (MMU) that supports Linux®, Windows CE® and many
- Clock Frequency: 200 MHz
- Number of I/Os: 16 #
- Data Bus: 32 Bit
- Processor Core: ARM
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Supplier: Lingto Electronic Limited
Description: BCM54811S REFERENCE BOARD
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Supplier: ASAP Semiconductor LLC
Description: EVAL MODULE FOR AM/DM37X Digital Media System-on-Chip (DMSoC) DM3730 DM3725 AM3715 AM3703 Board Software and Documentation
- Category: Development Board
- Signal Type: Digital
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Supplier: Critical Link, LLC
Description: The MitySOM-A5E is a system on module featuring an Intel / Altera Agilex 5E SoC (System on a Chip) and includes up to 656KLE FPGA fabric, dual core Cortex-A55 + dual core Cortex-A76, on-board power supplies, and memory subsystems. The Agilex 5 delivers 2.5x the
- Ports / Buses: I2C, SPI, USB
- Features: Other
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Description: IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the
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Supplier: CSA Group
Description: Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and
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Description: Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and
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Supplier: Critical Link, LLC
Description: The MitySOM-A5E Mini is a system on module featuring an Altera Agilex 5E SoC (System on a Chip) and includes up to 656KLE FPGA fabric, dual core Cortex-A55 + dual core Cortex-A76, on-board power supplies, and memory subsystems. The Altera Agilex 5 delivers 2.5x the
- Capacity: 8,000 MB
- Operating Temperature: -40 to 185 F
- Ports / Buses: I2C, SPI, USB
- Features: Other
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Supplier: Celera Motion
Description: the price performance barrier to open new possibilities for your motion control designs Integrates with other components on your PC board for lowest total system cost; designed for low cost automated PC board assembly High resolution with on-board interpolation and
- Resolution (counts per revolution): 3,000 to 327,000 (counts/revolution)
- Positional Accuracy: 2 arcsec
- Diameter or Width: 7.086618 inch
- Maximum Mechanical Shaft Speed: 26,000 rpm
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Supplier: ASAP Semiconductor LLC
Description: EVAL MODULE FOR DM814X/AM387X Digital Media System-on-Chip (DMSoC) AM3871 AM3872 AM3874 DM8146 DM8147 DM8148 Board Cables Documentation Mouse Power Supply SD Card with Software
- Category: Development Board
- Signal Type: Digital
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Supplier: Infineon Technologies AG
Description: Analog Inputs, 5 HV Monitor inputs and battery sense) On chip oscillator & PLL PWM signal generator and 16 bit timers Benefits: Complete system-on-chip Minimum number of external components reduces BOM cost VQFN package with 7x7 mm footprint enables PCB space saving
- Clock Frequency: 25 MHz
- RAM Size: 0.002 MB
- Operating Voltage: 5.5 to 28 volts
- Operating Temperature: 302 F
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Description: encoder/decoder and distribution architecture through which instructions and test data are communicated. The standard leverages the languages of IEEE Std 1149.1(TM) to describe and operate the on-chip circuits.
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Automated Test Equipment (ATE) boards are used for testing highly complex semiconductor chips. ATE board designs are typically highly complexity with an emphasis on high performance, The boards have an extremely high-layer count (40 to 60 ). Specialized testing Summit is a (read more)
Browse Printed Circuit Board (PCB) Fabrication Services Datasheets for Summit Interconnect -
-power LEDs, and advanced heat dissipation components. Features • High thermal conductivity (170~230W/m.K), up to 9.5 times than alumina; • Thermal expansion coefficient close to silicon wafer, achieve high reliability of Silicon chip and thermal (read more)
Browse Ceramic Sheets and Boards Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
: 1.96 Alumina (Al?O?) Features: Low warpage, High thermal shock resistance, low warpage, high-temperature and resistant to acid and alkali corrosion, and excellent processability. Applications: Thick/thin-film chip resistors, low-power LEDs (read more)
Browse Ceramic Sheets and Boards Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
reliability of semiconductors and electronics components. As our devices become smarter, our reliance on them grows. Every electronic device we encounter contains one or more chips made from semiconductors. Smart phones, tablets, laptops, game consoles, household appliances, automotive components (read more)
Browse Polymers and Plastic Resins Datasheets for AGC Chemicals Americas, Inc. -
Rego’s chip coolers are a series of cooling solutions for multi-functional chips. These products are well designed in thermal performance based on our professional manufacturing know how. We have the sophisticated equipment to precisely measure its performance to meet your requirements (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
-reliability fixed chip attenuators optimised to combine high frequency and power in a small package. As the global demand for faster data transmission and broadband connectivity contiues to grow, engineers face increasing challenges around space, power, and performance. The new HR TSX WB2 (read more)
Browse Chip Resistors Datasheets for Molex Signal Tech Industrial Ltd. -
chip-on-board, chip-on-flex, chip-on-glass, and wire bonding assemblies, this material provides excellent flexibility, enhanced durability, and superior resistance on PCBs. 9014 encapsulant provides moisture and corrosion protection of critical components found in electronic applications. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
optical inspection RoHS2 compliant (Directive 2015/863/EU) Applications Ideal for chip-on-board, chip-on-flex, multi-chip modules, and wire-bond encapsulation. Compatible with Dymax UV/LED spot lamps, flood lamps, and conveyor systems that provide balanced UV and visible wavelengths for fast, deep cures. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
High-speed circuit design is rapidly moving to include miniaturization and high density as new chip materials and sensors provide highly mobile and remote data acquisition devices. COB, chip on board circuitry offers ruggedized circuits that support military and space designs through to everyday (read more)
Browse Micro Connectors and Nano Connectors Datasheets for Omnetics Connector Corporation -
This white paper describes the value chain in the electronics industry. The value chain encompasses the manufacturing of semiconductor chips based on silicon wafers and electronic components like connectors and capacitors, their placement on printed circuit boards, and the mounting of (read more)
Browse RFID Readers Datasheets for SICK
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Rimba Chip Board Industry
The drum chipper is feed by a dosing conveyor with following vibratory conveyor.
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Protecting Chip on Board (COB) Devices with Glob Top Encapsulants
Glob tops enhance reliability of space saving bare chip assemblies.
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Micro-D Connectors Match Standard Board Pad-Designs to Support High Speed Data
High-speed circuit design is rapidly moving to include miniaturization and high density as new chip materials and sensors provide highly mobile and remote data acquisition devices. COB, chip on board circuitry offers ruggedized circuits that support military and space designs through to everyday
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How to find the right chip bonding adhesive for smart card chip and microchip
In flip chip mounting, the chip has to be inverted so that the adhesive is in contact directly with the circuit board. This allows smaller chip assembly as well as direct signal density. In chip assembly, we can use electrically conductive adessives to act as a replacement for solder where
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Thermal Enhancement of Systems using Organic Flip-Chip Packages (FC-PBGA) with an Alternate Cooling Path through the Printed Wiring Board
an effective thermal path to the printed wiring board (PWB) for high heat dissipation applications. The improvement in thermal impedance of dense core substrates vs. standard core substrates is quantified and shown to be approximately 2x. A package size of 50mm and a chip size of 18mm are assumed
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Smart Computing Article - Members Of The Board
AT is a replaceable plate for the rear panel of the computer. Because motherboard manufacturers can include a tailored metal plate with each board, they can mount (connectors such as USB [Universal Serial Bus]) and audio jacks on the rear of the board any way they like. ATX boards and power supplies also have
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Flip Chip Packaging Underfill Bonding Adhesive Die Attach And Its Advantages
pads of the substrate. During flip chip mounting, the inverted chip brings the chip adhesive into contact with circuit board directly, thus allowing smaller chip assembly and higher and direct signal density.
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Explanation : Thermal Performance Plots for Chip Power Resistors (.pdf)
the chip power resistor (usually an absolute best case scenario), which can be very misleading considering the wide variety of board design and construction limitations that can push the effective thermal resistance of the board/heat-sink interface far from the best case scenario.
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Integrated Circuit Packaging, Assembly and Interconnections
7 Packaging Options— Chip on Board ..........................................
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VIBRATION ANALYSIS OF TEST CHIPS WITH INTEGRATED PIEZORESISTIVE
STRESS SENSORS
19 Chapter 3 TEST CHIP ON BOARD ASSEMBLY ..........................................................
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Scheduling Algorithms for Minimizing Tardiness of Orders at the Burn-in Workstation in a Semiconductor Manufacturing System
Scheduling decisions at the L/U workstation should be made: 1) when a sorter becomes available (case A); 2) when chips arrive at the workstation for loading from an upstream workstation (case B); or 3) when chips on boards arrive at the workstation…
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Conductive adhesives for high-frequency applications
He joined IVF, M¨olndal, Sweden, in 1994, where he works on flip-chip assembly and chip on board .
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Advanced Flip Chip Packaging
Milestones for this progress have been Surface Mount Technology (SMT), Flip Chip in Package (FCIP), Flip Chip on Board (FCOB), and Wafer Level Packaging (WLP) which is evolving to System in Package (SiP) and Heterogeneous Integration (HI) by three-dimensional (3D) packaging…
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LED Manufacturer Profiles - World - 2013
Chip on Board : High Power LED Modules COB product .
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Materials for Advanced Packaging
Fig. 3.1 Illustration of (a) chip-to-substrate wire bonding, (b) chip-to-substrate flip-chip interconnection, and (c) chip on board flip chip connection .
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Advanced Millimeter-wave Technologies: Antennas Packaging and Circuits Complete Document
…BEOL Back-end-of-the-line BGA Ball grid array BiCMOS Bipolar CMOS BIST Built-in self-test BT Bismaleide-triazine C4 Controlled collapse chip connection CLCC Ceramic leaded chip carrier CMOS Complementary metal–oxide–semiconductor CNC Computer numerical control COB Chip on board .