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Supplier: Win Source Electronics
Description: Alternative Parts (Cross-Reference): Cross Manufacturer: AMIS Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Packaging: Bulk Part Status: Obsolete Number of Bits: 19 Number of DAC's: 1 Sampling Rate (Per Second): 53.5 Data Interface: SPI, Parallel, DSP Settling
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, PC BOARD, PROCESSOR, RESISTIVE NETWORK, ON-BOARD IC CHIPS. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Accuris
Description: GUIDELINES FOR CHIP ON BOARD TECHNOLOGY IMPLEMENTATION
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Supplier: Accuris
Description: Guidelines for Chip-on- Board Technology Implementation
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, PC BOARD INSERT CHIP/CARD. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, PC BOARD, MONITOR CARD, CHIPS, VGA MONITOR. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Radwell International
Description: PC BOARD W/MULTIPLE IC CHIPS. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Cirrus Logic, Inc.
Description: The EP9315 is a highly integrated system-on-chip processor that paves the way for next-generation consumer and industrial electronic products. The EP9315 features an advanced 200 MHz ARM920T processor design with a memory management unit (MMU) that supports Linux®, Windows
- Clock Frequency: 200 MHz
- Data Bus: 32 Bit
- Interface: I2S, SPI, UART, USB
- Number of I/Os: 16 #
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Supplier: Nordic Semiconductor ASA
Description: The nRF52811 is built around a 64 MHz Arm® Cortex™-M4 CPU, and has a range of digital peripherals and interfaces such as PDM, PWM, UART, SPI and TWI. It also has a capable 12-bit ADC. Exceptionally low energy consumption is achieved using a sophisticated on-chip adaptive power
- Clock Frequency: 64 MHz
- Data Bus: 128 Bit
- Interface: UART
- RAM Size: 0.0240 MB
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Supplier: Nordic Semiconductor ASA
Description: The nRF52805 System-on-Chip (SoC) augments the industry-leading nRF52 Series with an SoC in a WLCSP optimized for small two-layer PCB designs, ideal for cost-constrained applications. It is the perfect choice for applications such as beacons, disposable medical devices, sensors, styluses and
- Clock Frequency: 64 MHz
- Data Bus: 128 Bit
- Interface: UART
- RAM Size: 0.0240 MB
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Supplier: Nordic Semiconductor ASA
Description: The nRF52820 is a System-on-Chip (SoC) offering USB and advanced wireless connectivity in a small package, for HID, smart home, commercial, and industrial applications. The nRF52820 features an Arm Cortex-M4 processor, clocked at 64 MHz. It has 256 KB Flash and 32 KB RAM, and a range of
- Clock Frequency: 64 MHz
- Data Bus: 128 Bit
- Interface: UART, USB
- Processor Core: ARM
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Supplier: Critical Link, LLC
Description: The MitySOM-A5E is a system on module featuring an Intel / Altera Agilex 5E SoC (System on a Chip) and includes up to 656KLE FPGA fabric, dual core Cortex-A55 + dual core Cortex-A76, on-board power supplies, and memory subsystems. The Agilex 5 delivers 2.5x the
- Form Factor: Other
- Memory Type: Other
- Ports / Buses: I2C, SPI, USB, Other
- Processor / CPU Type: Other
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Supplier: Cirrus Logic, Inc.
Description: The EP9312 is an ARM920T-based system-on-chip that paves the way for next-generation consumer and industrial electronic products. The agile performance provided by the 200 MHz ARM920T processor and the breadth of peripheral interfaces, including an integrated IDE interface, suit the EP9312
- Clock Frequency: 200 MHz
- Data Bus: 32 Bit
- Interface: I2S, SPI, UART, USB
- Number of I/Os: 16 #
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Supplier: Nordic Semiconductor ASA
Description: is the software development kit for the nRF5340 SoC, offering a complete solution that integrates the Zephyr RTOS, protocol stacks, application samples and hardware drivers. The is the development kit for the nRF5340 SoC, and has everything needed for development on a single board.
- Processor Core: ARM
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Single Board Computers (SBC) - VME Board with Freescale MPC8540 System-on-chip Processor -- MVME3100Supplier: Artesyn Embedded Power
Description: The Artesyn Embedded Technologies MVME3100, featuring the system-on-chip Freescale MPC8540 processor, offers a growth path for VMEbus customers with applications on the previous generation of VME, specifically the MPC8240 and similar (MPC603 family) processors. The
- CPU Speed: 833 MHz
- Communication Networks: Ethernet
- Features: Watchdog Timer?
- Flash Memory (RAM): 64000 to 128000 KB
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Supplier: Lingto Electronic Limited
Description: BCM54811S REFERENCE BOARD
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Supplier: Critical Link, LLC
Description: The MitySOM-A5E Mini is a system on module featuring an Altera Agilex 5E SoC (System on a Chip) and includes up to 656KLE FPGA fabric, dual core Cortex-A55 + dual core Cortex-A76, on-board power supplies, and memory subsystems. The Altera Agilex 5 delivers 2.5x the
- Capacity: 8000 MB
- Form Factor: Other
- Memory Type: Other
- Operating Temperature: -40 to 185 F
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Supplier: Telit IoT Solutions, Inc.
Description: ATOP 2.5G is Telit’s platform for automotive telematics on-board units (OBU‘s). It simplifies creating applications such as road pricing and eCall by including all required technologies: 2G cellular for voice and data communication, Quad band GSM assures global
- Features: RoHS Compliant
- Supply Voltage: Other
- TJ: -40 to 85 C
- Technology: GSM, GPRS, GPS
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Supplier: ARM Inc.
Description: The Versatile™ Express family of development platforms provides the right environment for prototyping the next generation of system-on-chip designs. Thanks to its flexible, modular architecture, and high-speed interfaces, hardware and software applications can be
- Category: Development Board
- Manufacturer: ARM
- Signal Type: Digital
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Supplier: OSRAM Opto Semiconductors
Description: SOLERIQ® S 13, 2700 K - 4000 K (white), CRI min. 90, typ. 710 lm @ 3000 K, 85 °C, typ. 102 lm/W @ 3000 K, 85 °C Product Features Color: 2700 K - 4000 K (white) Color Rendering Index: min. 90 Luminous Flux: typ. 710 lm @ 3000 K, 85 °C Luminous efficacy: typ. 102 lm/W @ 3000 K, 85 °C Viewing angle at
- Color: White
- Color Temperature: 2700 to 4000 K
- Viewing Angle: 120 degrees
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Supplier: OSRAM Opto Semiconductors
Description: SOLERIQ® S 9, 2700 K - 6500 K (white), CRI min. 80, typ. 958 lm @ 3000 K, 85 °C, typ. 1.#INF lm/W @ 3000 K, 85 °C Product Features Color: 2700 K - 6500 K (white) Color Rendering Index: min. 80 Luminous Flux: typ. 958 lm @ 3000 K, 85 °C Luminous efficacy: typ. 1.#INF lm/W @ 3000 K, 85 °C Viewing
- Color: White
- Color Temperature: 2700 to 6500 K
- Viewing Angle: 120 degrees
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Supplier: OSRAM Opto Semiconductors
Description: This “Brilliant Color” version is designed for shop lighting applications. It features a high color quality which is similar to high intensity discharge lamps ( HID). Its brilliant light not only provides a high quality of white but also enables rich and saturated colors which have only been
- Color: White
- Color Temperature: 3250 K
- Viewing Angle: 120 degrees
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Supplier: OSRAM Opto Semiconductors
Description: SOLERIQ® S 9, 2700 K - 4000 K (white), CRI min. 90, typ. 1035 lm @ 3000 K, 85 °C, typ. 99 lm/W @ 3000 K, 85 °C Product Features Color: 2700 K - 4000 K (white) Color Rendering Index: min. 90 Luminous Flux: typ. 1035 lm @ 3000 K, 85 °C Luminous efficacy: typ. 99 lm/W @ 3000 K, 85 °C Viewing angle at
- Color: White
- Color Temperature: 2700 to 4000 K
- Viewing Angle: 120 degrees
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Supplier: Telit IoT Solutions, Inc.
Description: The ATOP 3.5G is the new Telit platform for automotive telematics on-board units (OBU-s). It simplifies creating applications such as road pricing and eCall by integrating all required technologies, including: 3G cellular for voice and data communication GPS/GLONASS for
- Features: RoHS Compliant
- Supply Voltage: Other
- TJ: -40 to 85 C
- Technology: GSM, GPRS, GPS
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Supplier: Utmel Electronic Limited
Description: LED LIGHTING CHIP-ON-BOARD (COB)
- Color: White, Other
- Forward Current: 2160 milliamps
- Forward Voltage: 34 volts
- Lens Type: Flat Lens
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Supplier: Accuris
Description: Printed boards and printed boards assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
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Supplier: Accuris
Description: Printed Boards and Printed Board Assemblies - Design and Use - Part 5-6: Attachment (Land/Joint) Considerations - Chip Carriers with J-Leads on Four Sides
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Supplier: Infineon Technologies AG
Description: with an NFET driver. This System-on-Chip solution includes four fully integrated NFET drivers optimized to drive a 2-phase motor via four external power NFETs, a charge pump enabling low voltage operation and programmable current along with current slope control for optimized EMC behavior.
- Clock Frequency: 40 MHz
- Interface: Other Interface
- Operating Temperature: 347 F
- Operating Voltage: 5.5 to 28 volts
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Supplier: Infineon Technologies AG
Description: Cortex®-M0 core with an NFET driver. This System-on-Chip solution includes four fully integrated NFET drivers optimized to drive a 2-phase motor via four external power NFETs, a charge pump enabling low voltage operation and programmable current along with current slope control for optimized
- Clock Frequency: 40 MHz
- Interface: Other Interface
- Operating Temperature: 302 F
- Operating Voltage: 5.5 to 28 volts
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Supplier: Infineon Technologies AG
Description: an NFET driver. This System-on-Chip solution includes four fully integrated NFET drivers optimized to drive a 2-phase motor via four external power NFETs, a charge pump enabling low voltage operation and programmable current along with current slope control for optimized EMC behavior. Its
- Clock Frequency: 40 MHz
- Interface: Other Interface
- Operating Temperature: 302 F
- Operating Voltage: 5.5 to 28 volts
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Supplier: Infineon Technologies AG
Description: driver. This system-on-chip solution includes four fully integrated NFET drivers optimized to drive a 2-phase motor via four external power NFETs, a charge pump enabling low voltage operation and programmable current along with current slope control for optimized EMC behavior. Its peripheral
- Clock Frequency: 40 MHz
- Interface: Other Interface
- Operating Temperature: 302 F
- Operating Voltage: 5.5 to 28 volts
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Supplier: VOXMICRO
Description: in the market the new-generation, low-power, resilient multi-gigabit Wi-Fi 6 connectivity, fully leveraging Qualcomm's new innovative QCA6391 connectivity Chip-on-Board (CoB). Building on VoxMicro's history of delivering advanced Wi-Fi solutions, the E63 Class provides an 18 modules
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Supplier: TOP-electronics USA
Description: LM780-0223, BT2.1 Module, Class 2, On-board Antenna LM has announced the EOL for this part. It will be replaced by the LM961 due to be releasded in April 2018. Short Range surface mount Bluetooth Module with on-board chip antenna for 3 V to 5.5 V voltage operations. This module
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Supplier: VAST STOCK CO., LIMITED
Description: Development Boards & Kits - Wireless System-On-A-Chip Development Kit
- Category: Development Board, Development Suite / Kit
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1081874-NCV74715V1GE VB Category: Development Boards, Kits, Programmers>Evaluati on and Demonstration Boards and Kits Type: Interface Package: Box Standard Package: 1 Function: System Basis Chip (SBC) Supplied Contents: Board(s
- Category: Development Board
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Featured Products Top
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Automated Test Equipment (ATE) boards are used for testing highly complex semiconductor chips. ATE board designs are typically highly complexity with an emphasis on high performance, The boards have an extremely high-layer count (40 to 60 ). Specialized testing Summit is a (read more)
Browse Printed Circuit Board (PCB) Fabrication Services Datasheets for Summit Interconnect -
-power LEDs, and advanced heat dissipation components. Features • High thermal conductivity (170~230W/m.K), up to 9.5 times than alumina; • Thermal expansion coefficient close to silicon wafer, achieve high reliability of Silicon chip and thermal (read more)
Browse Ceramic Sheets and Boards Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
: 1.96 Alumina (Al?O?) Features: Low warpage, High thermal shock resistance, low warpage, high-temperature and resistant to acid and alkali corrosion, and excellent processability. Applications: Thick/thin-film chip resistors, low-power LEDs (read more)
Browse Ceramic Sheets and Boards Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
reliability of semiconductors and electronics components. As our devices become smarter, our reliance on them grows. Every electronic device we encounter contains one or more chips made from semiconductors. Smart phones, tablets, laptops, game consoles, household appliances, automotive components (read more)
Browse Polymers and Plastic Resins Datasheets for AGC Chemicals Americas, Inc. -
Rego’s chip coolers are a series of cooling solutions for multi-functional chips. These products are well designed in thermal performance based on our professional manufacturing know how. We have the sophisticated equipment to precisely measure its performance to meet your requirements (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
-reliability fixed chip attenuators optimised to combine high frequency and power in a small package. As the global demand for faster data transmission and broadband connectivity contiues to grow, engineers face increasing challenges around space, power, and performance. The new HR TSX WB2 (read more)
Browse Chip Resistors Datasheets for Molex Signal Tech Industrial Ltd. -
back the curtain on the most common ways these vital components bite the dust. Heat: The Invisible Incinerator Excessive heat is perhaps the number one enemy of circuit boards. Components generate heat during operation, and (read more)
Browse Safety Labels and Signs Datasheets for ODG (Origin Data Global) -
chip-on-board, chip-on-flex, chip-on-glass, and wire bonding assemblies, this material provides excellent flexibility, enhanced durability, and superior resistance on PCBs. 9014 encapsulant provides moisture and corrosion protection of critical components found in electronic applications. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
optical inspection RoHS2 compliant (Directive 2015/863/EU) Applications Ideal for chip-on-board, chip-on-flex, multi-chip modules, and wire-bond encapsulation. Compatible with Dymax UV/LED spot lamps, flood lamps, and conveyor systems that provide balanced UV and visible wavelengths for fast, deep cures. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
High-speed circuit design is rapidly moving to include miniaturization and high density as new chip materials and sensors provide highly mobile and remote data acquisition devices. COB, chip on board circuitry offers ruggedized circuits that support military and space designs through to everyday (read more)
Browse Micro Connectors and Nano Connectors Datasheets for Omnetics Connector Corporation
Conduct Research Top
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Rimba Chip Board Industry
The drum chipper is feed by a dosing conveyor with following vibratory conveyor.
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Protecting Chip on Board (COB) Devices with Glob Top Encapsulants
Glob tops enhance reliability of space saving bare chip assemblies.
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Micro-D Connectors Match Standard Board Pad-Designs to Support High Speed Data
High-speed circuit design is rapidly moving to include miniaturization and high density as new chip materials and sensors provide highly mobile and remote data acquisition devices. COB, chip on board circuitry offers ruggedized circuits that support military and space designs through to everyday
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How to find the right chip bonding adhesive for smart card chip and microchip
In flip chip mounting, the chip has to be inverted so that the adhesive is in contact directly with the circuit board. This allows smaller chip assembly as well as direct signal density. In chip assembly, we can use electrically conductive adessives to act as a replacement for solder where
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Thermal Enhancement of Systems using Organic Flip-Chip Packages (FC-PBGA) with an Alternate Cooling Path through the Printed Wiring Board
an effective thermal path to the printed wiring board (PWB) for high heat dissipation applications. The improvement in thermal impedance of dense core substrates vs. standard core substrates is quantified and shown to be approximately 2x. A package size of 50mm and a chip size of 18mm are assumed
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Smart Computing Article - Members Of The Board
AT is a replaceable plate for the rear panel of the computer. Because motherboard manufacturers can include a tailored metal plate with each board, they can mount (connectors such as USB [Universal Serial Bus]) and audio jacks on the rear of the board any way they like. ATX boards and power supplies also have
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Flip Chip Packaging Underfill Bonding Adhesive Die Attach And Its Advantages
pads of the substrate. During flip chip mounting, the inverted chip brings the chip adhesive into contact with circuit board directly, thus allowing smaller chip assembly and higher and direct signal density.
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Explanation : Thermal Performance Plots for Chip Power Resistors (.pdf)
the chip power resistor (usually an absolute best case scenario), which can be very misleading considering the wide variety of board design and construction limitations that can push the effective thermal resistance of the board/heat-sink interface far from the best case scenario.
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Integrated Circuit Packaging, Assembly and Interconnections
7 Packaging Options— Chip on Board ..........................................
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VIBRATION ANALYSIS OF TEST CHIPS WITH INTEGRATED PIEZORESISTIVE
STRESS SENSORS
19 Chapter 3 TEST CHIP ON BOARD ASSEMBLY ..........................................................
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Scheduling Algorithms for Minimizing Tardiness of Orders at the Burn-in Workstation in a Semiconductor Manufacturing System
Scheduling decisions at the L/U workstation should be made: 1) when a sorter becomes available (case A); 2) when chips arrive at the workstation for loading from an upstream workstation (case B); or 3) when chips on boards arrive at the workstation…
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Conductive adhesives for high-frequency applications
He joined IVF, M¨olndal, Sweden, in 1994, where he works on flip-chip assembly and chip on board .
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Advanced Flip Chip Packaging
Milestones for this progress have been Surface Mount Technology (SMT), Flip Chip in Package (FCIP), Flip Chip on Board (FCOB), and Wafer Level Packaging (WLP) which is evolving to System in Package (SiP) and Heterogeneous Integration (HI) by three-dimensional (3D) packaging…
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LED Manufacturer Profiles - World - 2013
Chip on Board : High Power LED Modules COB product .
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Materials for Advanced Packaging
Fig. 3.1 Illustration of (a) chip-to-substrate wire bonding, (b) chip-to-substrate flip-chip interconnection, and (c) chip on board flip chip connection .
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Advanced Millimeter-wave Technologies: Antennas Packaging and Circuits Complete Document
…BEOL Back-end-of-the-line BGA Ball grid array BiCMOS Bipolar CMOS BIST Built-in self-test BT Bismaleide-triazine C4 Controlled collapse chip connection CLCC Ceramic leaded chip carrier CMOS Complementary metal–oxide–semiconductor CNC Computer numerical control COB Chip on board .