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Supplier: OptiSpac, Inc.
Description: The package is made of ceramic cavity internal brazing metal hot sink, external no wire packaging structure, synchronous matching with high reliable germanium window or sapphire window cover plate. Cover plate sealing can be selected as soft and hard brazing or glass melting
- Materials: Ceramic
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Supplier: Kyocera Corporation
Description: Kyocera provides custom designed ceramic packages and components to meet specific customer requirements. Standard (open tool) products are also available for device evaluation and low volume orders.
- Mounting: SMT
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Supplier: Advanced Technical Ceramics Company
Description: AdTech prides itself on being the innovation leader in the ceramic package business. Co-fired ceramic technology was invented in our Chattanooga facility over 35 years ago, and numerous patents have been issued over the years. Today, the company remains the leading US-owned non
- Backend Processing: Soldering / Pasting, Hermetic Sealing, Dicing, Other
- IC Package Type: BGA, MCM, LCCC, Other
- Location: North America, United States Only, Southern US Only
- Package Material: Ceramic, Other
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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! Microwave Packages Application
- Materials: Aluminum, AlSiC, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! HIC Packages
- Materials: Aluminum, AlSiC, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! Fiber Optics Packages
- Materials: Aluminum, AlSiC, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Supplier: Materion Corporation
Description: Materion Corporation provides ceramic air cavity packages that are industry standard outlines for RF Power Transistors. These packages offer proven performance and reliability. The cost-effective packages are excellent platforms for wireless applications in the 500 MHz to
- Applications: Other
- Shape / Form: Bar Stock
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Description: According to the demands of customers,printing the circuit on the Al2O3/AIN ceramic tapes,after lamination, slicing, high temperature co-firing, brazing, gold plating and other processes, a ceramic and metal integrated package structure with a certain high air tightness is
- Material Type: Alumina / Aluminum Oxide
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Description: have increased the durability of implantable medical devices. Kryoflex®: A family of polycrystalline ceramics developed to hermetically sealing together materials used in electrical feedthroughs and is very effective at prohibiting the influx of any fluids or gases into the a package’s
- Materials: Other
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Description: Optoelectronic packages serve as the critical interface for photonic components. We deliver end-to-end precision packaging solutions from design to mass production. Leveraging advanced materials and automated processes, our products ensure superior optical signal integrity and
- Applications: Ceramics / Glass Manufacturing, Electronics / RF-Microwave, Other
- Performance Features: Hard, Specialty / Other
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Description: Feeling as the polished jade, fine and smooth texture. Chemical corrosion resistance, water resistance, oxidation resistance. Powerful wear resistance, long-term maintenance of appearance. No metal ions emit, No reaction with cosmetics. Carefully designed tip according to human engineering,
- Material Type: Alumina / Aluminum Oxide, Alumina-Zirconia, Zirconia, Specialty Ceramic
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Supplier: Materion Corporation
Description: Materion Microelectronics & Services offers metalized substrates developed from Beryllium Oxide (BeO) or alumina (Al2O3). The metallization can be thick film MoMn followed by plating, or direct bond copper (DBCu).
- Material Type: Alumina / Aluminum Oxide, Beryllia / Beryllium Oxide
- Shape / Form: Bar Stock
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Description: Advanced Electronic Packaging, Second Edition reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition in 1999. Like the First Edition, each chapter is authored by one or more
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Supplier: Materion Corporation
Description: , as well as an alumina ceramic ringframe. CuPacks™ are electrolytically plated with nickel and gold and are compatible with a wide range of die attach materials. CuPacks™ are surface mount packages with leads that can be formed in straight, gull wing or J-shaped configurations.
- Electroceramic Type: Other
- Shape / Form: Bar Stock
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Supplier: PAC Machinery Group
Description: temperature controls for precise results; and a cool-down thermostat to protect components after the machine is shut down. Ceramic chamber insulation maintains heat in the chamber while providing a cool exterior surface for greater operator control and safety. These compact machines are user
- Goods: Consumer Packaging
- Industry: Industrial / General Use, Automotive, Electronics / Semiconductor, Food / Beverage, Garment, Household Product / Merchandise, Music / Video / Software, Pharmaceutical, Stationary, Tobacco
- Machine Type: Shrink Machines
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Supplier: Accuris
Description: Ceramic Package Specification for Microelectronic Packages
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Supplier: Skyworks Solutions, Inc.
Description: The SMV1405–SMV1413 series of bare die, epoxy and hermetic packaged silicon abrupt junction varactor diodes is designed for use in VCOs requiring tight capacitance tolerances. The low resistance of these varactors makes them appropriate for high Q resonators in wireless system VCOs to
- Diode Type: Varactor Diodes
- VR: 30 volts
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Supplier: Skyworks Solutions, Inc.
Description: The SMV1405–SMV1413 series of bare die, epoxy and hermetic packaged silicon abrupt junction varactor diodes is designed for use in VCOs requiring tight capacitance tolerances. The low resistance of these varactors makes them appropriate for high Q resonators in wireless system VCOs to
- Diode Type: Varactor Diodes
- VR: 30 volts
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Supplier: Skyworks Solutions, Inc.
Description: The SMV1405–SMV1413 series of bare die, epoxy and hermetic packaged silicon abrupt junction varactor diodes is designed for use in VCOs requiring tight capacitance tolerances. The low resistance of these varactors makes them appropriate for high Q resonators in wireless system VCOs to
- VR: 30 volts
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Supplier: Skyworks Solutions, Inc.
Description: The SMV1493 and SMV1494 bare die and hermetic packaged silicon abrupt junction varactor diodes are designed for use in VCOs requiring tight capacitance tolerances. The low resistance of these varactors makes them appropriate for high Q resonators in wireless system VCOs from RF to beyond 56
- VR: 12 volts
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Description: With over 70 years of experience and extensive manufacturing capability, Qnnect, formerly Hermetic Solutions Group has the largest selection of open tooling, plus custom capabilities for any size package, including JEDEC outlines such as TO-18, TO-39, TO-8, TO-3, TO-37, TO-66 and more
- Materials: Aluminum, Stainless Steel, Other
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Description: -thermal-conduct ivity electronic packages. Electrical feedthrough pins can be hermetically sealed directly into the titanium using Qnnect, formerly Hermetic Solutions Group’s proprietary Kryoflex® ceramic to metal seals. Alternately, hermetic connectors made from explosively bonded
- Materials: Other
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Supplier: Win Source Electronics
Description: Manufacturer: Murata Category: Ceramic Capacitors Capacitance: 18 pF Voltage Rating DC: 50 VDC Dielectric: C0G (NP0) Tolerance: 1 % Termination: Standard Series: GRM Packaging: Cut Tape Length: 1 mm
- Capacitance Range: 1.80E-5 microF
- Capacitance Tolerance: 1 (+/- %)
- DC Rated Voltage Range (WVDC): 50 volts
- Electrostatic Capacitors: Ceramic
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Supplier: CoorsTek
Description: From luxury cosmetics to perfected bearing balls, our designers collaborate with you to bring simple elegance and functional beauty to your modern luxury & leisure product. Luxury Cosmetic Application and Packaging Components CoorsTek applies cutting edge ceramic
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1381217-885362211015 1 Category: Capacitors>Ceramic Capacitors Series: WCAP-CSSA Package: Tape & Reel Size / Dimension: 0.177" L x 0.126" W (4.50mm x 3.20mm) Applications: Safety Standard Package: 500 pcs Capacitance: 2200 p
- Capacitance Range: 0.0022 microF
- Capacitance Tolerance: 10 (+/- %)
- DC Rated Voltage Range (WVDC): 250 volts
- Electrostatic Capacitors: Ceramic
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1381216-885012005041 Category: Capacitors>Ceramic Capacitors Series: WCAP-CSGP Package: Tape & Reel Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm) Applications: General Purpose Standard Package: 10,000 pcs Capacitance: 15
- Capacitance Range: 1.50E-5 microF
- Capacitance Tolerance: 5 (+/- %)
- DC Rated Voltage Range (WVDC): 25 volts
- Electrostatic Capacitors: Ceramic
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Supplier: Materion Corporation
Description: High purity copper sheets 0.010" or 0.012" (250 or 300 microns) thick can be directly bonded to BeO or alumina substrates by the direct bond copper process, which involves the materials being bonded by a ternary phase of Be-Cu-O and Al-Cu-O. The result is a strong, hermetic bond of thick copper for
- Applications: Other
- Electroceramic Type: Other
- Shape / Form: Bar Stock
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Supplier: KEMET Electronics Corporation
Description: , telecommunications, automotive, military, medical and consumer electronics. Primary applications include decoupling, filtering, bypassing and smoothing. Ceramics are non-polar devices which offer unsurpassed volumetric efficiency, delivering the highest capacitance in the smallest
- Capacitance Range: 5.00E-7 to 100 microF
- Capacitance Tolerance: 20 (+/- %)
- Capacitance Type: Fixed
- Configuration / Form Factor: Leaded Capacitor, Surface Mount / Chip Capacitor
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Supplier: AVX Corporation
Description: ceramics are available in molded or conformally coated packaging options for applications ranging from commercial electronics to space level systems. Leaded capacitors offer robust mechanical shock and vibration characteristics, exceptional thermal resistance and proven reliability and
- Configuration / Form Factor: Leaded Capacitor
- Electrostatic Capacitors: Ceramic
- Technology: Multilayer
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Supplier: Haida International Equipment Co., Ltd.
Description: 1. The Usage The machine which simulates a transporation environment, is applicable to the vibration test of toys, electronics, furnitures, gifts, ceramics, communications, packagings, equipment, computer and automobile components, etc. 2. Features: 1). Low
- Force / Load Capacity: 220 lbs
- Mechanical Test: Specialty / Other
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1338731-111TG101M100 TT Category: Capacitors - Ceramic Capacitors Series: ATC 111 Package: Tray Size / Dimension: 0.025" L x 0.025" W (0.64mm x 0.64mm) Applications: General Purpose Standard Package: 100 Capacitance: 100 pF Tolerance
- Capacitance Range: 1.00E-4 microF
- Capacitance Tolerance: 20 (+/- %)
- DC Rated Voltage Range (WVDC): 100 volts
- Electrostatic Capacitors: Ceramic
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Supplier: CoorsTek
Description: Navigation and communication are critical elements when flying. With up to 35 antennas per aircraft in major airliners, reducing weight while ensuring unquestionable reliability are critical factors for aerospace communication. Our ceramic components can be found in many on-board
- Materials of Construction: Specialty / Other
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Supplier: Advanced Technical Ceramics Company
Description: AdTech’s line of Platinum co-fired packages combines the HTCC material system with platinum metal conductors. Screen printing Pt with hermetic vias using multilayer capability addresses harsh environmental and biocompatible applications.
- Materials: Ceramic
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Supplier: Utmel Electronic Limited
Description: Ceramic Resonator, 7.99MHz Nom, CERAMIC PACKAGE-3
- Resonator Type: Ceramic
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Supplier: QuartzCom AG
Description: Nominal Frequency: 21.4000 MHz Pole No.: 2 Pass Band: 3 dB / ±3.75 kHz Attenuation Band: 18 dB / ±18 kHz Loss: 1.5 dB
- Cutoff or Center Frequency (Fc): 21400 kHz
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Featured Products Top
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As an important component of LED, packaging substrates are also changing with the development of LED chip technology. At present, metal and ceramic substrates are mainly used in LED heat dissipation substrates. Metal substrates are made of aluminum or copper. Because of their mature technology (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Products Metal packaging The integrated circuit package shell provides a sealed, stable, and efficient heat dissipation operating environment for the chip through glass-metal and ceramic-metal packaging, protecting the device from humidity, temperature (read more)
Browse Glass Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Our semiconductor ceramic packaging technology provides exceptional benefits for professional engineers and buyers seeking long-lasting, high-performance solutions. These packages ensure superior physical, electrical, and thermal properties, making them ideal for (read more)
Browse Ceramic Tube and Ceramic Rod Products Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
products in high-reliability packaging. Moreover, compared with other ceramic materials, it has numerous advantages and enjoys extensive practical value in industrial applications. The core advantages of black alumina in ceramic packaging: (1) Excellent light-blocking and anti (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Advanced Ceramics for High-End Cosmetic Packaging by Suntech Suntech Applied Materials (Hefei) Co., Ltd. delivers advanced ceramic solutions tailored for luxury cosmetic (read more)
Browse Zirconium Oxide and Zirconia Ceramics Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
: Ceramic Substrate Materials Zirconia reinforced aluminum nitride composite ceramics balance thermal conductivity and mechanical strength. An effective compromise between aluminum nitride and silicon nitride, providing a reliable substrate material (read more)
Browse Industrial Ceramic Materials Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
its superior performance in electronic substrates and packaging materials. As the demand for high-performance integrated circuits increases, AlN is meeting the industry’s need for advanced materials (read more)
Browse Specialty Ceramics Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
Our Advanced Al2O3/AIN Ceramic Packages are engineered to deliver precision, durability, and superior sealing in demanding electronic environments. These packages offer (read more)
Browse Industrial Ceramic Materials Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
Holy Stone introduces X1/Y1 Safety Certified Multilayer Ceramic Capacitors (MLCCs) in compact SMD packages. These capacitors are rated for 250Vac, 300Vac, and 400Vac, with capacitance ranges from 10pF to 1800pF in NPO and X7R T.C. options. Designed to meet stringent X1/Y1 safety standards, they (read more)
Browse Ceramic Capacitors Datasheets for New Yorker Electronics Co., Inc. -
efficiency, electromagnetic anti-interference capability, and dimensional processing accuracy are all subject to higher technical standards. High-precision alumina ceramic packaging enclosures, relying on their outstanding inherent material properties, mature and controllable manufacturing processes, as (read more)
Browse Electroceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd.
Conduct Research Top
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Al2O3/AIN Ceramic Package
Al2O3/AIN ceramic packages are applicated in bonding of semiconductors,involving wireless communication, military, medical, industrial and other fields.
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Why Is Ceramic Metallization Layer Important In Electronic Device Packaging
In the midst of the information age, as industries such as communication and microelectronics experience rapid growth, high-frequency and high-power electronic devices have become the cornerstone of the market. Ceramic materials have emerged as a favored choice for electronic device packaging due
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Ceramic Metallized Insulators for RF Package
In a development that could have a significant impact on the electronics industry, the latest ceramic metallized insulators are making strides in enhancing semiconductor packaging and related applications. These insulators offer a range of practical benefits that can improve the performance
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Multi-lead Organic Air-Cavity Package for High Power High Frequency RFICs
A new air cavity package has been developed and. qualified for packaging high power RF components. The. package uses the standard outline of a conventional ceramic. package. The ceramic dielectric is replaced with a high. performance thermoplastic called QuantechTM (which is a. modified Liquid
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Alumina Ceramic Substrate
Ceramic substrates are the future of the power electronics industry, mainly due to the fact that utilization of ceramic substrates is part of ultimate solution to the increasingly serious heat dissipation and hermetic sealing problems of polymeric packaging materials.
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What Is The Best Ceramic Substrate Material?
The ceramic substrate material in an electronic packaging system is the key to getting rid of heat efficiently. It should also be strong and reliable so it can handle the complexity of the work environment. The ceramic substrates that have been mass-produced and widely used in recent years
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What's the Ceramic Heater for Soldering Iron
alloy heating wire and PTC heating element.And then taking a look at the structure of the ceramic heating core. The outer diameter of the heating core is 3.8mm, which is suitable for a variety of internal heating soldering irons. There is a groove in the outer packaging ceramics, which is beneficial
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Application of Cosmetics Package
Suntech Advanced Ceramics uses cutting-edge ceramic technology for high-end cosmetic applications and packaging components to complement cosmetic applications.
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For an update of this information, please go to the package website.
Flanged ceramic package ; 2 mounting holes; 6 leads 2 - 49 .
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RF and Microwave Microelectronics Packaging
Design of Ceramic Packages . . . . . . . . . . . . . .
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Fluid Dynamics of Packed Columns
The 1990s were marked by further developments in the area of random metal pack- ings, such as Raschig Super rings [33] and Mc-Pac packing [34] as well as ceramic pack- ings R-Pac and SR-Pac and structured glass packings such…
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Solder Joint Reliability Prediction for Multiple Environments
In ce- ramic packages , the first level packaging is reliable for encapsulated wire bonds or underfilled flip chips due to the low CTE mismatch between the chip and ceramic substrate.
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Ceramic Packages .
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Integrated Circuit Packaging, Assembly and Interconnections
MCM-C Cofired Ceramic Package ...................................................66 Figure 5-5(c).
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Thermal transient evaluation and optical characterization of packaged light-emitting diodes
Abstract The study signifies the simultaneous thermal and optical characterizations of pre-molded and ceramic package light-emitting diodes (LEDs) at an increasing driving current.
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Advanced Ceramic Technologies & Products
139 7.2 Ceramic Package (Mid 1960s)........................................................................