Products & Services
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Supplier: Kyocera Corporation
Description: Kyocera provides custom designed ceramic packages and components to meet specific customer requirements. Standard (open tool) products are also available for device evaluation and low volume orders.
- Mounting: SMT
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Supplier: Advanced Technical Ceramics Company
Description: Ceramic pedestal may be used in the package design to allow for self-jigging of metal or ceramic Seal-Ring. Microwave Design Assistance AdTech Ceramics produces HTCC and AlN packages for microwave applications in the X through K band frequency ranges.
- Type: BGA, LCCC, MCM
- Material: Ceramic
- Backend Processing: Dicing, Hermetic Sealing, Soldering / Pasting
- Features: North America, Other, Southern US Only, United States Only
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Supplier: OptiSpac, Inc.
Description: kind of ceramic package products meet the requirements of specific indicators, compared with metal package products have more miniaturization, thermal insulation and cost advantages.
- Package Material: Ceramic
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Supplier: Accuris
Description: Ceramic Package Specification for Microelectronic Packages
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Supplier: Skyworks Solutions, Inc.
Description: The SMV1405–SMV1413 series of bare die, epoxy and hermetic packaged silicon abrupt junction varactor diodes is designed for use in VCOs requiring tight capacitance tolerances. The low resistance of these varactors makes them appropriate for high Q resonators in wireless system VCOs to frequencies
- VR: 30 volts
- Features: Varactor Diodes
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Supplier: Materion Corporation
Description: ceramic ringframe. CuPacks™ are electrolytically plated with nickel and gold and are compatible with a wide range of die attach materials. CuPacks™ are surface mount packages with leads that can be formed in straight, gull wing or J-shaped configurations.
- Shape / Form: Bar Stock
- Features: Other
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Supplier: Skyworks Solutions, Inc.
Description: Skyworks silicon hyperabrupt junction varactor diode chips are processed using established ion-implantation technology resulting in low RS wide tuning ratio devices with high Q values. These planar chips have a small outline size (12 x 12 mils nominal) and are fully passivated resulting in low
- VR: 22 volts
- Features: Varactor Diodes
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Supplier: Skyworks Solutions, Inc.
Description: Skyworks silicon hyperabrupt junction varactor diode chips are processed using established ion-implantation technology resulting in low RS wide tuning ratio devices with high Q values. These planar chips have a small outline size (12 x 12 mils nominal) and are fully passivated resulting in low
- VR: 22 volts
- Features: Varactor Diodes
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Supplier: Materion Corporation
Description: Materion Corporation provides ceramic air cavity packages that are industry standard outlines for RF Power Transistors. These packages offer proven performance and reliability. The cost-effective packages are excellent platforms for wireless applications in the 500 MHz to
- Shape / Form: Bar Stock
- Features: Other
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Supplier: Allied Electronics, Inc.
Description: Photoconductive Cell, Plastic Encapsulated, Ceramic Package, TO-18
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Description: According to the demands of customers,printing the circuit on the Al₂O₃/AIN ceramic tapes,after lamination, slicing, high temperature co-firing, brazing, gold plating and other processes, a ceramic and metal integrated package structure with a certain high air tightness is
- Material Type: Alumina / Aluminum Oxide
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Supplier: Utmel Electronic Limited
Description: Ceramic Resonator, 7.99MHz Nom, CERAMIC PACKAGE-3
- Resonator Type: Ceramic
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Supplier: QuartzCom AG
Description: Nominal Frequency: 45.0000 MHz Pole No.: 4 Pass Band: 3 dB / ±6.0 kHz Attenuation Band: 30 dB / ±20 kHz Loss: 3.0 dB
- Cutoff or Center Frequency (Fc): 45,000 kHz
- Filter Category: Quartz / Crystal Filter
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Supplier: CoorsTek
Description: From luxury cosmetics to perfected bearing balls, our designers collaborate with you to bring simple elegance and functional beauty to your modern luxury & leisure product. Luxury Cosmetic Application and Packaging Components CoorsTek applies cutting edge ceramic technology for perfecting
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Description: Qnnect, formerly Hermetic Solutions Group leads the way in overcoming some of the challenges faced by medical implant designers. We developed a ceramic-to-metal joining technology to make medical components smaller without sacrificing performance. Our RF transparent ceramic case
- Features: Other
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Supplier: Accuris
Description: RESISTOR, FIXED, FILM, CHIP, 1.5 WATT (MELF), FLAT CERAMIC PACKAGE STYLE 2512
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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! HIC Packages The application
- Package Material: AlSiC, Aluminum, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! Microwave Packages Application
- Package Material: AlSiC, Aluminum, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Supplier: Accuris
Description: RESISTOR, FIXED, FILM, CHIP, 1.5 WATT (MELF), FLAT CERAMIC PACKAGE, STYLE 2512
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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! Fiber Optics Packages The
- Package Material: AlSiC, Aluminum, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Description: electronic packages. Electrical feedthrough pins can be hermetically sealed directly into the titanium using Qnnect, formerly Hermetic Solutions Group’s proprietary Kryoflex® ceramic to metal seals. Alternately, hermetic connectors made from explosively bonded dissimilar metals can be
- Features: Other
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Description: With over 70 years of experience and extensive manufacturing capability, Qnnect, formerly Hermetic Solutions Group has the largest selection of open tooling, plus custom capabilities for any size package, including JEDEC outlines such as TO-18, TO-39, TO-8, TO-3, TO-37, TO-66 and more. Our
- Package Material: Aluminum, Stainless Steel
- Features: Other
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Supplier: PAC Machinery Group
Description: controls for precise results; and a cool-down thermostat to protect components after the machine is shut down. Ceramic chamber insulation maintains heat in the chamber while providing a cool exterior surface for greater operator control and safety. These compact machines are user friendly and
- Industry: Automotive, Electronics / Semiconductor, Food / Beverage, Garment, Household Product / Merchandise, Industrial / General Use, Music / Video / Software, Pharmaceutical, Stationary, Tobacco
- Goods: Consumer Packaging
- Machine Type: Shrink Machines
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Description: Feeling as the polished jade, fine and smooth texture. Chemical corrosion resistance, water resistance, oxidation resistance. Powerful wear resistance, long-term maintenance of appearance. No metal ions emit, No reaction with cosmetics. Carefully designed tip according to human engineering,
- Features: Alumina / Aluminum Oxide, Alumina-Zirconia, Specialty Ceramic
- Specialty Ceramic Type: Zirconia
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Description: Optoelectronic packages serve as the critical interface for photonic components. We deliver end-to-end precision packaging solutions from design to mass production. Leveraging advanced materials and automated processes, our products ensure superior optical signal integrity and long-term
- Applications: Ceramics / Glass Manufacturing, Electronics / RF-Microwave
- Performance Features: Hard
- Features: Other, Specialty / Other
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Supplier: CoorsTek
Description: systems, such as: Altimeters L1 and L2 GPS RF Communications (UHF/VHF) Traffic Avoidance Collision Systems (TCAS) Broadband WiFi Ceramic Components for Antennas, RF, & Microwave Metallized Antenna Components Severe-service ceramic-metal and metallized antenna components and arrays
- Features: Specialty / Other
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Supplier: Utmel Electronic Limited
Description: Trans Voltage Suppressor Diode, Unidirectional, 1 Element, Silicon, HALOGEN FREE AND ROHS COMPLIANT, CERAMIC PACKAGE-2
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Description: experts and then carefully edited to ensure a consistent level of quality and approach throughout. Readers familiar with the First Edition will note several key changes. For example, organic and ceramic substrates are now covered in separate chapters. There are new chapters on passive
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Supplier: Anatech Electronics, Inc.
Description: 338 MHz Ceramic Band Pass Filter in a SMA-F Connectorized package
- Frequency (Fc): 338 MHz
- Bandwidth: 20,000 kHz
- Insertion Loss: 3 dB
- Filter Type: Bandpass
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Supplier: Accuris
Description: CAPACITORS, CERAMIC, SINGLE IN-LINE PACKAGE, NETWORK, (7 CAPACITOR SECTIONS) CG
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Supplier: Newark, An Avnet Company
Description: RESISTOR, CERAMIC, JUMPER, 0 OHM, 250mW, 5%; Resistor Case / Package:Axial Leaded; Resistor Technology:Carbon Film; Power Rating:250mW; Current Rating:-; Product Range:MCZ Series; Product Length:6.8mm; Product Width:- RoHS Compliant: Yes
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Supplier: Utmel Electronic Limited
Description: 10µF Surface Mount, MLCC 1206 (3216 Metric) Package Ceramic Capacitors
- Capacitance Range: 10.000000000000002 microF
- Capacitance Tolerance: 10 (+/- %)
- DC Rated Voltage Range (WVDC): 25 volts
- Operating Temperature: -55 C
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Supplier: Newark, An Avnet Company
Description: Capacitor Case / Package:0603 [1608 Metric]; Capacitance Tolerance:± 2%; Product Range:-; Product Length:1.6mm; Product Width:0.85mm; Qualification:-; MSL:-; Case Size:0603; Ceramic Capacitor Case:0603 [1608 Metric] RoHS Compliant: Yes
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Supplier: Haida International Equipment Co., Ltd.
Description: 1. The Usage The machine which simulates a transporation environment, is applicable to the vibration test of toys, electronics, furnitures, gifts, ceramics, communications, packagings, equipment, computer and automobile components, etc. 2. Features: 1). Low price, which is only 10% of the
- Force / Load Capacity: 220.5 lbs
- Features: Specialty / Other
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Featured Products Top
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As an important component of LED, packaging substrates are also changing with the development of LED chip technology. At present, metal and ceramic substrates are mainly used in LED heat dissipation substrates. Metal substrates are made of aluminum or copper. Because of their mature technology (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Our semiconductor ceramic packaging technology provides exceptional benefits for professional engineers and buyers seeking long-lasting, high-performance solutions. These packages ensure superior physical, electrical, and thermal properties, making them ideal for (read more)
Browse Ceramic Tube and Ceramic Rod Products Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
products in high-reliability packaging. Moreover, compared with other ceramic materials, it has numerous advantages and enjoys extensive practical value in industrial applications. The core advantages of black alumina in ceramic packaging: (1) Excellent light-blocking and anti (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Advanced Ceramics for High-End Cosmetic Packaging by Suntech Suntech Applied Materials (Hefei) Co., Ltd. delivers advanced ceramic solutions tailored for luxury cosmetic (read more)
Browse Zirconium Oxide and Zirconia Ceramics Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
: Ceramic Substrate Materials Zirconia reinforced aluminum nitride composite ceramics balance thermal conductivity and mechanical strength. An effective compromise between aluminum nitride and silicon nitride, providing a reliable substrate material (read more)
Browse Industrial Ceramic Materials Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
its superior performance in electronic substrates and packaging materials. As the demand for high-performance integrated circuits increases, AlN is meeting the industry’s need for advanced materials (read more)
Browse Specialty Ceramics Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
Our Advanced Al2O3/AIN Ceramic Packages are engineered to deliver precision, durability, and superior sealing in demanding electronic environments. These packages offer (read more)
Browse Industrial Ceramic Materials Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
Holy Stone introduces X1/Y1 Safety Certified Multilayer Ceramic Capacitors (MLCCs) in compact SMD packages. These capacitors are rated for 250Vac, 300Vac, and 400Vac, with capacitance ranges from 10pF to 1800pF in NPO and X7R T.C. options. Designed to meet stringent X1/Y1 safety standards, they (read more)
Browse Ceramic Capacitors Datasheets for New Yorker Electronics Co., Inc. -
; custom sizes available Applications: Laboratory filtration, gas diffusion experiments, catalyst support, material testing, research & development projects. Packaging: Each set includes 5 ceramic blocks per package, carefully packed to ensure safe delivery and prevent damage. (read more)
Browse Ceramic Sheets and Boards Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Nickel plating Installation Welding Inspect the packaging Applications of ceramic-metal assemblies: Relay insulator Capacitor Magnetron (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited
Conduct Research Top
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Al2O3/AIN Ceramic Package
Al2O3/AIN ceramic packages are applicated in bonding of semiconductors,involving wireless communication, military, medical, industrial and other fields.
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Why Is Ceramic Metallization Layer Important In Electronic Device Packaging
In the midst of the information age, as industries such as communication and microelectronics experience rapid growth, high-frequency and high-power electronic devices have become the cornerstone of the market. Ceramic materials have emerged as a favored choice for electronic device packaging due
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Ceramic Metallized Insulators for RF Package
In a development that could have a significant impact on the electronics industry, the latest ceramic metallized insulators are making strides in enhancing semiconductor packaging and related applications. These insulators offer a range of practical benefits that can improve the performance
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Multi-lead Organic Air-Cavity Package for High Power High Frequency RFICs
A new air cavity package has been developed and. qualified for packaging high power RF components. The. package uses the standard outline of a conventional ceramic. package. The ceramic dielectric is replaced with a high. performance thermoplastic called QuantechTM (which is a. modified Liquid
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Alumina Ceramic Substrate
Ceramic substrates are the future of the power electronics industry, mainly due to the fact that utilization of ceramic substrates is part of ultimate solution to the increasingly serious heat dissipation and hermetic sealing problems of polymeric packaging materials.
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What Is The Best Ceramic Substrate Material?
The ceramic substrate material in an electronic packaging system is the key to getting rid of heat efficiently. It should also be strong and reliable so it can handle the complexity of the work environment. The ceramic substrates that have been mass-produced and widely used in recent years
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What's the Ceramic Heater for Soldering Iron
alloy heating wire and PTC heating element.And then taking a look at the structure of the ceramic heating core. The outer diameter of the heating core is 3.8mm, which is suitable for a variety of internal heating soldering irons. There is a groove in the outer packaging ceramics, which is beneficial
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Application of Cosmetics Package
Suntech Advanced Ceramics uses cutting-edge ceramic technology for high-end cosmetic applications and packaging components to complement cosmetic applications.
More Information Top
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For an update of this information, please go to the package website.
Flanged ceramic package ; 2 mounting holes; 6 leads 2 - 49 .
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RF and Microwave Microelectronics Packaging
Design of Ceramic Packages . . . . . . . . . . . . . .
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Fluid Dynamics of Packed Columns
The 1990s were marked by further developments in the area of random metal pack- ings, such as Raschig Super rings [33] and Mc-Pac packing [34] as well as ceramic pack- ings R-Pac and SR-Pac and structured glass packings such…
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Solder Joint Reliability Prediction for Multiple Environments
In ce- ramic packages , the first level packaging is reliable for encapsulated wire bonds or underfilled flip chips due to the low CTE mismatch between the chip and ceramic substrate.
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Ceramic Packages .
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Integrated Circuit Packaging, Assembly and Interconnections
MCM-C Cofired Ceramic Package ...................................................66 Figure 5-5(c).
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Thermal transient evaluation and optical characterization of packaged light-emitting diodes
Abstract The study signifies the simultaneous thermal and optical characterizations of pre-molded and ceramic package light-emitting diodes (LEDs) at an increasing driving current.
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Advanced Ceramic Technologies & Products
139 7.2 Ceramic Package (Mid 1960s)........................................................................