BGA Packages

Description: FEATURES Reduce high-density interconnect (HDI) construction by adapting smaller pitch devices to larger footprints Convert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch (Please contact factory for other pitch requirements) Enable the use of standard line and trace spacing Eliminate the

• Output (Bottom) Side Package: BGA
• Product Type: Package Adapters / Converters
• Top (Input) Side Package: BGA

Description: BGA Socketing Systems from Advanced offer an economical and dependable alternative to direct device attach. Our patented SMT designs are field-proven in production, development, programming and test applications. Compact designs and patented features offer you cost effective solutions for

• Features: Machined Pins, Open Top Socket
• Output (Bottom) Side Package: BGA, LGA
• Product Type: Package Adapters / Converters, Programming Adapters
• RoHS Compliant: Yes

Description: Using our exclusive, field-proven eutectic solder ball terminal design, the SMT Adapter from Advanced provides a reliable solution for mounting or socketing LGA or re-worked BGA devices. Use in connection with our BGA Sockets for LGA to BGA conversion or board to board

• Features: Machined Pins
• Output (Bottom) Side Package: BGA, LGA
• Product Type: Package Adapters / Converters
• RoHS Compliant: Yes

Description: Package converters provide an electrical and mechanical conversion from one package type to another. We use gold plated interconnects for our pin and through hole converters. We offer products for each of the following package conversions. The part families are listed in "top

• Product Type: Package Adapters / Converters
• RoHS Compliant: Yes

Description: BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles.

Description: EVALUATION MOD FOR CDCM7005-BGA Timing Clock Synchronizer - CDCM7005 BGA Package

• Category: Development Board

Description: FEATURES Solderless Spring-Probes pressure mount to the test board and device solder ball or pad Only 0.077 [1.96] signal path Very low inductance and capacitance Small footprint allows max. use of test board area Chip guides allow accurate device location Spring loaded contacts provide high cycle

• Features: Solderless, Clamshell Socket
• Military Standards: Other
• Product Type: IC Probing / Analysis Adapters

Description: package, this compact solution is perfect for development and validation of BGA and LGA devices, production level socketing, and SMT board to board connector applications.

• Features: Machined Pins, Open Top Socket
• Output (Bottom) Side Package: BGA, LGA
• Product Type: Package Adapters / Converters, Programming Adapters
• RoHS Compliant: Yes

Description: When availability or performance of a given IC becomes an issue, an Ironwood device converter allows the use of a substitute device without requiring redesign of the target system. Package type, package code, even pin outs can be changed with an adapter that fits in the original

• Product Type: Package Adapters / Converters
• RoHS Compliant: Yes

Description: Ohmite now carries a line of heatsink solutions that are specifically designed for your BGA and PBGA applications. Ohmite's heatsinks provide a low-cost thermal solution for these specific packages in multiple sizes. Our heatsink solutions can be attached to devices with adhesive

• Device: Passive Heat Sink
• Height: 7.5 to 17.5 mm
• Length: 15 to 45 mm
• Material: Aluminum

Description: Aavid provides the broadest product line of heat sinks and thermal solutions for cooling integrated circuits such as Field Programmable Grid Arrays (FPGAs) and the surface mount packaging used for integrated circuits like Ball Grid Arrays (BGAs). Choose from a number of sizes, fin

• Device: Active Heat Sink

Description: Cooliance offers a wide variety of standard radial fin options ranging in diameter from .5" to 3" and from 1 to 7 fins. Radial fin heatsinks do not require any specific orientation. Our Smart-CLIP™ attach mechanism allows the fins to extend beyond the dimensions of the chip package without

• Device: Passive Heat Sink
• Heat Sink Fin Style: Other
• Height: 6.35 to 19.94 mm
• Material: Aluminum

Description: "Probe boards" refer to components that provide test points, which are usually pins suitable for use with test clips and flying leads.

• Product Type: IC Probing / Analysis Adapters
• RoHS Compliant: Yes

Description: The Ironwood Electronics line of sockets for BGA, QFN, LGA, and other SMT packages provide a selection for both laboratory test and high volume test. We presently offer 4 major contactor types to handle laboratory testing, high volume test, and temperature test. Contactor types include

• Contact / Pin Type: Other
• Contact Plating: Gold Plating
• Contacts Pitch: 0.8000 mm
• Features: Solderless, ZIF Lock, Screw Lock

Description: Manufacturer: NXP Win Source Part Number: 235203-BGA2712 Packaging: Reel - TR Test Frequency: 1GHz Frequency: 1GHz to 3.2GHz Gain: 21.3dB Noise Figure: 3.9dB P1dB: 4.8dBm (3mW) RF Type: ISM Categories: RF/IF and RFID Status: Obsolete(EOL) Case

• Applications: Terrestrial RF/Microwave Systems
• Frequency Range: 1000 to 3200 MHz
• Maximum Gain: 21.3 dB
• Minimum Gain: 21.3 dB

Description: The BGA616 is a broadband matched general purpose MMIC amplifier in a Darlington configuration. It is optimized for a typical supply current of 60 mA. The BGA616 is based on Infineon Technologies’ B7HF Silicon Germanium technology. Summary of Features: - Cascadable 50

• Frequency Range: Up to 6000 MHz
• Maximum Gain: 17.5 dB
• Minimum Gain: 17.5 dB
• Noise Figure: 2.9 dB

Description: BGA614 is a broadband matched, general purpose MMIC amplifier in a Darlington configuration. It is optimized for a typical supply current of 40 mA. The BGA614 is based on Infineon Technologies’ B7HF Silicon Germanium technology. Summary of Features: - Cascadable 50

• Frequency Range: Up to 6000 MHz
• Maximum Gain: 17 dB
• Minimum Gain: 17 dB
• Noise Figure: 2.3 dB

Description: Manufacturer: NXP Win Source Part Number: 913320-BGA6130118 Series: * Package: Bulk Categories: Integrated Circuits (ICs) Popularity: High Fake Threat In the Open Market: 76 pct. Supply and Demand Status: Balance Quantity per package: 1

Description: Manufacturer: NXP Win Source Part Number: 235227-BGA6289 Packaging: Reel - TR Test Frequency: 1.95GHz Frequency: 500MHz to 3.5GHz Gain: 13dB Noise Figure: 4dB P1dB: 16dBm (39.8mW) RF Type: PCS, CDPD, Broadcast Television Categories: RF/IF and RFID Status

• Applications: Terrestrial RF/Microwave Systems
• Frequency Range: 500 to 3500 MHz
• Maximum Gain: 13 dB
• Minimum Gain: 13 dB

Description: BGA612 is a broadband matched, general purpose MMIC amplifier in a Darlington configuration. It is optimized for a typical supply current of 20 mA. Summary of Features: - Cascadable 50 O-gain block - 3 dB-bandwidth: DC to 2.8 GHz with 17.5 dB typical gain at 1.0 GHz

• Frequency Range: Up to 6000 MHz
• Maximum Gain: 16 dB
• Minimum Gain: 16 dB
• Noise Figure: 2.35 dB

Description: AdTech prides itself on being the innovation leader in the ceramic package business. Co-fired ceramic technology was invented in our Chattanooga facility over 35 years ago, and numerous patents have been issued over the years. Today, the company remains the leading US-owned non

• Backend Processing: Soldering / Pasting, Hermetic Sealing, Dicing, Other
• IC Package Type: BGA, MCM, LCCC, Other
• Location: North America, United States Only, Southern US Only
• Package Material: Ceramic, Other

Description: Manufacturer: NXP Win Source Part Number: 235206-BGA2716 Packaging: Reel - TR Test Frequency: 1GHz Frequency: 50MHz to 3.6GHz Gain: 22.9dB Noise Figure: 5.3dB P1dB: 8.9dBm (7.8mW) RF Type: ISM Categories: RF/IF and RFID Status: Obsolete(EOL) Case

• Applications: Terrestrial RF/Microwave Systems
• Frequency Range: 50 to 3600 MHz
• Maximum Gain: 22.9 dB
• Minimum Gain: 22.9 dB

Description: Si-MMIC-Amplifier in SIEGET® 25-Technologie Summary of Features: - Cascadable 50 O-gain block - Unconditionally stable - Gain |S21|2 = 13 dB at 1.8 GHz IP3out = +13 dBm at 1.8 GHz (VD = 3 V, ID = typ. 6.7 mA) - Noise figure NF = 2.2 dB at 1.8 GHz - Reverse isolation > 28 dB and return loss IN / OUT

• Frequency Range: Up to 3000 MHz
• Maximum Gain: 13 dB
• Minimum Gain: 13 dB
• Noise Figure: 2.2 dB

Description: IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

Description: The BGA6130 is a one-stage silicon MMIC amplifier, offered in a low-cost leadless surface-mount package. At 3.6 V it delivers 29.5 dBm output power at 3 dB gain compression with efficiency higher than 55 %. Its power saving features include simple quiescent current adjustment, which

• Amplifier Type: Power Amplifier
• Frequency Range: 400 to 2700 MHz
• Maximum Gain: 17 dB
• Maximum Operating Voltage: 3.6 volts

Description: FBGA-153 Memory - Serial MCP (Multi Chip Package) ROHS

• IC Package Type: BGA

Description: Thermal standardization on semiconductor packages Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Description: Organic Package Build-up Structure FC-BGA SHDBU Structure Type CPCORE Structure Type FC-CSP Substrates

• Mounting: SMT

Description: confirm application Positive locking lid High mechanical advantage lid and latch provides low actuation force for high I/O packages - 12:1

• Product Type: IC Socket

Description: The Chemtronics Soder-Wick #80 purple rosin flux core desoldering wick or braid is sold 25 spools per package and is another quality product from Chemtronics. Comes packaged with 5 ft of material.

Description: The Chemtronics Soder-Wick #60 purple no clean flux core desoldering wick or braid is sold 25 spools per package and is another quality product from Chemtronics. Comes packaged with 5 ft of material.

• Equipment Type: Soldering Equipment

Description: World's smallest, ultra low power, fully integrated MIL-STD-1553 BGA package, complete with 1553 protocol, 2 Mb (64K x 36) RAM, transceivers, and isolation transformers inside a single package - saves board space and simplifies 1553 design and layout. Available with development

• Device Type / Applications: Transceiver, Other
• IC Package Type: BGA

Description: The HSB-910I supports Intel® Pentium® M/ Celeron® M processors up to 1.8GHz with a FSB of 400MHz. Designed for support of both BGA and socket processor packages, the HSB-910I can operate fanless with an Intel® Low Power CPU or can be configured with a socket to support end user

• Chipset Type: Intel® Chipset
• Features: Watchdog Timer?, RJ-45 Connectors?
• I/O Bus Specifications: ISA / EISA
• Operating Temperature: 32 to 140 F

Description: Operation/Applicatio n Circuit Application : Power & Signal Shielded : Yes Packaging Features Packaging Method : Carton Product Type Features

• Applications: Residential / General-Purpose
• Current Rating: 8 amps
• Mounting Style: Panel Mounted
• Standards and Certifications: RoHS Compliant