BGA Packages

Description: EVALUATION MOD FOR CDCM7005-BGA Timing Clock Synchronizer - CDCM7005 BGA Package

• Category: Development Board

Description: FEATURES Solderless Spring-Probes pressure mount to the test board and device solder ball or pad Only 0.077 [1.96] signal path Very low inductance and capacitance Small footprint allows max. use of test board area Chip guides allow accurate device location Spring loaded contacts provide high cycle

• Contact Resistance: 40 milliohms
• Contacts Pitch: 0.2 to 0.8 mm
• Socket Type: BGA, DIP, Test / Prototyping Socket
• Features: Clamshell Socket, Other, Solderless

Description: Thermal standardization on semiconductor packages Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Description: Thermal standardization on semiconductor packages \x96 Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Description: IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

Description: Manufacturer: NXP Win Source Part Number: 913320-BGA6130118 Series: * Package: Bulk Categories: Integrated Circuits (ICs) Popularity: High Fake Threat In the Open Market: 76 pct. Supply and Demand Status: Balance Quantity per package: 1

Description: BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles.

Description: Manufacturer: NXP Win Source Part Number: 235227-BGA6289 Packaging: Reel - TR Test Frequency: 1.95GHz Frequency: 500MHz to 3.5GHz Gain: 13dB Noise Figure: 4dB P1dB: 16dBm (39.8mW) RF Type: PCS, CDPD, Broadcast Television Categories: RF/IF and RFID Status: Obsolete(EOL) Case / Package:

• Frequency Range: 500 to 3,500 MHz
• Minimum Gain: 13 dB
• Maximum Gain: 13 dB
• Noise Figure: 4 dB

Description: Manufacturer: NXP Win Source Part Number: 235202-BGA2709 Packaging: Reel - TR Test Frequency: 1GHz Frequency: 1.8GHz Gain: 22.7dB Noise Figure: 4dB RF Type: ISM Family Name: BGA2709 Categories: RF/IF and RFID Status: Obsolete(EOL) Case / Package: 6-TSSOP Supply Voltage - Operating: 5 V to 6 V

• Frequency Range: 1,800 MHz
• Minimum Gain: 22.7 dB
• Maximum Gain: 22.7 dB
• Noise Figure: 4 dB

Description: Manufacturer: NXP Win Source Part Number: 235203-BGA2712 Packaging: Reel - TR Test Frequency: 1GHz Frequency: 1GHz to 3.2GHz Gain: 21.3dB Noise Figure: 3.9dB P1dB: 4.8dBm (3mW) RF Type: ISM Categories: RF/IF and RFID Status: Obsolete(EOL) Case / Package: 6-TSSOP Supply Voltage - Operating: 5

• Frequency Range: 1,000 to 3,200 MHz
• Minimum Gain: 21.3 dB
• Maximum Gain: 21.3 dB
• Noise Figure: 3.9 dB

Description: FEATURES Reduce high-density interconnect (HDI) construction by adapting smaller pitch devices to larger footprints Convert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch (Please contact factory for other pitch requirements) Enable the use of standard line and trace spacing Eliminate the

• Operating Temperature: 105 C
• Contacts Pitch: 0.4 to 1.27 mm
• Socket Type: BGA
• Contact Plating: None

Description: BGA Socketing Systems from Advanced offer an economical and dependable alternative to direct device attach. Our patented SMT designs are field-proven in production, development, programming and test applications. Compact designs and patented features offer you cost effective solutions for

• Number of Contacts: 4 to 1,936
• Contacts Pitch: 0.8 to 1.27 mm
• Socket Type: BGA, LGA, Receptacle, Test / Prototyping Socket
• Contact Plating: Gold Plating

Description: Ohmite now carries a line of heatsink solutions that are specifically designed for your BGA and PBGA applications. Ohmite's heatsinks provide a low-cost thermal solution for these specific packages in multiple sizes. Our heatsink solutions can be attached to devices with adhesive

• Length: 15 to 45 mm
• Width: 15 to 42.5 mm
• Height: 7.5 to 17.5 mm
• Weight: 3 to 25.8 g

Description: Ceramic pedestal may be used in the package design to allow for self-jigging of metal or ceramic Seal-Ring. Microwave Design Assistance AdTech Ceramics produces HTCC and AlN packages for microwave applications in the X through K band frequency ranges. Electromagnetic Simulation This

• Type: BGA, LCCC, MCM
• Material: Ceramic
• Backend Processing: Dicing, Hermetic Sealing, Soldering / Pasting
• Features: North America, Other, Southern US Only, United States Only

Description: CSP/µBGA Test & Burn-In Socket for Devices up to 13mm Square Chinese FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for QFP applications Any device pitch of 0.20mm and larger Sockets are easily mounted/removed to and from BIBs via

• Operating Temperature: -55 to 150 C
• Contacts Pitch: 5.08 to 20.32 mm
• Socket Type: BGA, CSP, Test / Prototyping Socket
• Features: Clamshell Socket, Other, Solderless

Description: Environmental and endurance testing \x96 Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Description: CONSUMER CIRCUIT, PQCC20 Product overview: BGA3031 from NXP Semiconductors is a Rf Amplifier for embedded electronics, industrial equipment, maintenance repair, OEM production, and component sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines,

• Features: Other

Description: FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device pitch from 0.20mm 4-point crown insures “scrub” on solder oxides Single Point Probes available for small land area contact pads Signal path during test only 0.077 [1.96] Socket is easily mounted and

• Operating Temperature: -55 to 150 C
• Contacts Pitch: 5.08 to 20.32 mm
• Socket Type: BGA, CSP, Test / Prototyping Socket
• Features: Clamshell Socket, Other, Solderless

Description: Aavid provides the broadest product line of heat sinks and thermal solutions for cooling integrated circuits such as Field Programmable Grid Arrays (FPGAs) and the surface mount packaging used for integrated circuits like Ball Grid Arrays (BGAs). Choose from a number of sizes, fin types, and

• Device: Active Heat Sink

Description: replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include BGA. Search-friendly keywords include connector, interconnect, header, socket, terminal block, BGA, Electronic Connector, Board to Board & Mezzanine

Description: This micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design offers the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket. At only 2.00mm larger than the device

• Number of Contacts: 4 to 900
• Contacts Pitch: 0.5 to 0.65 mm
• Socket Type: BGA, CSP, LGA, Receptacle, Test / Prototyping Socket
• Contact Plating: Gold Plating

Description: Cooliance offers a wide variety of standard radial fin options ranging in diameter from .5" to 3" and from 1 to 7 fins. Radial fin heatsinks do not require any specific orientation. Our Smart-CLIP™ attach mechanism allows the fins to extend beyond the dimensions of the chip package without

• Width: 34.924981140510184 to 50.799972568014816 mm
• Height: 6.349996571001852 to 19.938989232945815 mm
• Material: Aluminum
• Mounting: Clips

Description: replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include BGA. Search-friendly keywords include Dsp, electronic component, datasheet, replacement part, BGA. This listing supports clearer product discovery for

• Pin Count: 179
• Operating Temperature: -40 C

Description: to 2.4 GHz with 19 dB typical gain at 1.0 GHz - Compression point P-1dB = 12 dBm at 2.0 GHz - Noise figure F50Ω = 2.1 dB at 2.0 GHz - Absolute stable - 70GHz fT - Silicon Germanium technology - 1 kV HBM ESD protection (Pin-to-Pin) - Pb-free (RoHS compliant) package Target Applications: -

• Frequency Range: 6,000 MHz
• Minimum Gain: 17 dB
• Maximum Gain: 17 dB
• Output Power( P_1dB): 11.99999999999999 dBm

Description: lines, package options, lifecycle status, and procurement availability. Key searchable attributes include BGA. Search-friendly keywords include transistor, BJT, switching, amplification, BGA, Bipolar Transistor, Transistor, Photovoltaic Output Optoisolators. This listing

• I_C(max): 50 milliamps
• P_D: 150 milliwatts
• h_fe: 200
• T_J: -40 C

Description: Organic Package Build-up Structure FC-BGA SHDBU Structure Type CPCORE Structure Type FC-CSP Substrates

• Mounting: SMT

Description: HEATSINK, BGA; Thermal Resistance:23.4°C/W; Packages Cooled:BGA; External Width - Metric:23mm; External Height - Metric:18mm; External Length - Metric:23mm; External Diameter - Metric:-; Heat Sink Material:Aluminium; External Width -RoHS Compliant: Yes