Products & Services
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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! Microwave Packages Application
- Materials: Aluminum, AlSiC, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! HIC Packages
- Materials: Aluminum, AlSiC, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! Fiber Optics Packages
- Materials: Aluminum, AlSiC, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Supplier: OptiSpac, Inc.
Description: The package is made of ceramic cavity internal brazing metal hot sink, external no wire packaging structure, synchronous matching with high reliable germanium window or sapphire window cover plate. Cover plate sealing can be selected as soft and hard brazing or glass melting sealing
- Materials: Ceramic
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Description: Optoelectronic packages serve as the critical interface for photonic components. We deliver end-to-end precision packaging solutions from design to mass production. Leveraging advanced materials and automated processes, our products ensure superior optical signal integrity and
- Applications: Ceramics / Glass Manufacturing, Electronics / RF-Microwave, Other
- Performance Features: Hard, Specialty / Other
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Supplier: Douglas Electrical Components
Description: integrate it into the circuit board or flex circuit offering a moisture tight seal as well as connector headers and receptacles. CircuitSeal hermetic packages create cost-effective solutions be enabling customers to use smaller mechanical packages to protect electronics. The
- Additional Services: Design Assistance
- Industry: Electrical / Electronics, Military / Law Enforcement
- Location: North America, United States Only, Northeast US Only
- Sealing Method Capabilities: Epoxies
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Supplier: Palomar Technologies, Inc
Description: world. With today’s rapidly changing technology, time-to-market is one of the most important factors for product success. With over 40 years of experience in the industry assembling microelectronic and photonic chip packages, Palomar Technologies Innovation Centers are full
- Backend Processing: Wire Bonding, Flip Chip Technology, Hermetic Sealing, Bonding, Other
- Location: North America, United States Only, Southwest US Only, East Asia / Pacific Only
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Supplier: Light in Motion LLC
Description: Description: The BPW36/37 are silicon phototransistors mounted in narrow angle TO-18 package. Features: Hermetically sealed package Narrow reception angle European "Pro Electron" registered
- Collector Current: 0.5000 milliamps
- Dome Lens: Yes
- Mounting Option: Through Hole (Plug-in)
- Operating Temperature: -65 to 125 C
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Supplier: Light in Motion LLC
Description: Description: The BPW38 is silicon photodarlington mounted in narrow angle, TO-18 package. Features: Hermetically sealed package Narrow reception angle European "Pro Electron" registered
- Collector Current: 7.5 milliamps
- Dome Lens: Yes
- Mounting Option: Through Hole (Plug-in)
- Operating Temperature: -65 to 125 C
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Description: At Qnnect, formerly Hermetic Solutions Group", we are fully dedicated to providing the highest quality environment for the welding and sealing of your high-reliability electronic packages and medical implant devices. We have an ISO Class 7 cleanroom equipped with state-of-the-art laser
- Additional Services: Testing / Inspection
- Industry: Electrical / Electronics, Medical
- Location: North America, United States Only, Northeast US Only
- Sealing Method Capabilities: Laser Welding
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Supplier: Light in Motion LLC
Description: four output options. The TTL/LSTTL compatible output can drive up to ten TTL loads over supply current from 4.5 to 16.0volts. The monolithic die packaged in a narrow angle, hermetically sealed, TO-18 metal can package. Features: High noise immunity. Direct TTL/LSTTL interface
- Output Type: Current Output
- Photosensor Type: PN Photodiode
- Supply Voltage: 18 volts
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Description: Qnnect, formerly Hermetic Solutions Group manufactures custom fiber optic and telecommunications packages for a variety of applications including: WADM modules Modulators Attenuators Pump lasers Switches Amplifiers This
- Materials: Aluminum, Tungsten, Other
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Description: With over 70 years of experience and extensive manufacturing capability, Qnnect, formerly Hermetic Solutions Group has the largest selection of open tooling, plus custom capabilities for any size package, including JEDEC outlines such as TO-18, TO-39, TO-8, TO-3, TO-37, TO-66 and more
- Materials: Aluminum, Stainless Steel, Other
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Description: Qnnect, formerly Hermetic Solutions Group manufactures both custom and standard drop-in microwave packages for multiple industries including defense and aerospace. These components are used in higher-end applications, such as satellite, missiles, and aircraft guidance; electronic
- Materials: Aluminum, Copper, Stainless Steel, Other
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Supplier: Douglas Electrical Components
Description: Douglas Electrical Components manufactures hermetic rectangular connectors, typically for signal transmission, for various applications and industries. This includes commercial connectors including USB and HDMI connectors, providing fast signal transmission in a hermetic
- Feedthrough Type: Electrical
- Temperature Range: -40 to 107 C
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Supplier: Douglas Electrical Components
Description: Douglas Electrical Components manufactures hermetic rectangular connectors, typically for signal transmission, for various applications and industries. This includes commercial connectors including USB and HDMI connectors, providing fast signal transmission in a hermetic
- Feedthrough Type: Electrical
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Supplier: Light in Motion LLC
Description: Description: The L14F1/L14F2 are silicon photodarlingtons mounted in narrow angle, TO-18 package. Features: Hermetically sealed package Narrow reception angle
- Collector Current: 2.5 milliamps
- Dome Lens: Yes
- Mounting Option: Through Hole (Plug-in)
- Operating Temperature: -65 to 125 C
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Supplier: Douglas Electrical Components
Description: seals feature solid copper, heavy-current conductors sealed in NPT and face seal packages housing styles and stainless steel materials, with a hermetic, moisture-tight epoxy to seal between the conductor and housing. They are compatible with a wide range of liquids and gases, including
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Supplier: Advanced Technical Ceramics Company
Description: AdTech prides itself on being the innovation leader in the ceramic package business. Co-fired ceramic technology was invented in our Chattanooga facility over 35 years ago, and numerous patents have been issued over the years. Today, the company remains the leading US-owned non
- Backend Processing: Soldering / Pasting, Hermetic Sealing, Dicing, Other
- IC Package Type: BGA, MCM, LCCC, Other
- Location: North America, United States Only, Southern US Only
- Package Material: Ceramic, Other
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Supplier: Crane Aerospace & Electronics
Description: 1. The PEP-4S series of voltage variable Phase Shifters is offered in three popular IF center frequency ranges (30, 60 and 70 MHz) with other frequencies optional. 2. Each provides 0° to 360° phase shift and 10% bandwidth within the 10 to 400 MHz frequency range. The voltage controlled design has
- Control Voltage (for Analog Phase Shifters): 0.5000 to 30 volts
- Frequency Range: 10 to 400 MHz
- Input Power: 0.0 dBm
- Input VSWR: 1.6 :1
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Supplier: Silicon Designs, Inc.
Description: cold extremes for extended periods of time where environmental conditions require a hermetic package. ?The SDI Models 2240 and 2480 contain a single or three orthogonally mounted, proprietary SDI Model 1522 accelerometer LCC chips, making them even less sensitive to temperature changes
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Supplier: Broadcom Inc.
Description: compared with the traditional solutions such as current transformers and Hall-effect sensors. This device consists of a sigma-delta analog-to-digital converter optically coupled to a digital-to-analog converter in a hermetically sealed 8-Pin ceramic DIP package with gold plated leads.
- Mounting Option: Surface Mount
- Operating Temperature: -55 to 125 C
- Optocoupler Input: AC, DC
- Rise Time: 3.4 µs
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Supplier: Crane Aerospace & Electronics
Description: 1. Dual I & Q networks are integrated devices that produce two pairs of quadrature-phased, equal amplitude signals when fed by two IF signals and an LO signal as shown in the schematic above. 2. Merrimac’s IDP-2S series combines two matched circuits in one package. Both lumped and
- Input Frequency Range: 20 to 500 MHz
- Package Type: Through Hole Technology (THT)
- Power Level: 14 dBm
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Supplier: Crane Aerospace & Electronics
Description: -directional couplers provides direct access to both coupled ports. 3. Merrimac couplers may be ordered with specific coupling values up to 30 dB and over selected frequency bands up to 18 GHz in microwave packages. 4. These units comply with the applicable portions of MIL-C-15370 and
- Average Power: 1 watts
- Coupler Type: Uni-Directional
- Coupling: 10 to 20 dB
- Directivity: 18 to 20 dB
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Supplier: Materion Corporation
Description: stamped from base materials of Kovar, A42, Copper or Nickel that are then plated with Ni and/or Ni and Au. This type of preform is an excellent "heat spreader" within an electronic package. It’s available in size from 0.005” thick to 0.015” in length and width. Shapes include squares,
- Applications: Electronics / RF-Microwave
- Clad / Bimetal: Yes
- Metal / Alloy Types: Other / Miscellaneous Nonferrous (UNS M)
- Shape / Form: Semi-finished Shape / Mill Stock, Bar Stock, Squares / Square Bar
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Supplier: Utmel Electronic Limited
Description: DIODE 47 V, 0.4 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Voltage Regulator Diode
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Supplier: Utmel Electronic Limited
Description: Rectifier Diode, Schottky, 1 Phase, 2 Element, 30A, 45V V(RRM), Silicon, TO-254AA, HERMETIC SEALED PACKAGE-3
- Diode Type: Schottky Barrier Diodes
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Description: The CEO hermetically-sealed package is designed to withstand a variety of environmental conditions. It is impervious to dust and moisture, both of which can cause degradation or failure to unprotected laser diode arrays. Available with output powers of up to 2.4 kW (QCW) or 40W (CW),
- CDRH Classification: Class IV
- Laser Output: Pulsed
- Laser Power: 1.60E6 milliwatts
- Laser Type: Laser Diodes
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Supplier: Palomar Technologies, Inc
Description: , which can load parts onto the wire bonder while it is bonding. High Vacuum Furnace Applications MEMS Package Sealing Infrared Sensor Package Sealing Crystal Oscillator Package Sealing Hermetic Package Sealing Wafer Level Packaging Void-Free Eutectic Die
- Coating System Type: Factory / Free Standing
- Features: Integral Process Controller?
- Technology / Process: Other
- Vacuum / Pressure Range: High Vacuum (< 10-3, >10-8 torr)
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Supplier: Materion Corporation
Description: High purity copper sheets 0.010" or 0.012" (250 or 300 microns) thick can be directly bonded to BeO or alumina substrates by the direct bond copper process, which involves the materials being bonded by a ternary phase of Be-Cu-O and Al-Cu-O. The result is a strong, hermetic bond of thick
- Applications: Other
- Electroceramic Type: Other
- Shape / Form: Bar Stock
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Supplier: ProPhotonix, Ltd.
Description: communications. The universal adaptors are fitted with a split sleeve alignment mechanism, which gives better than 1dB repeatability on coupling. The packaged laser diodes are multi-quantum-well structure (MQW), have a built-in InGaAs monitor photodiode and a hermetically sealed active
- Laser Output: Continuous Wave
- Laser Type: Alignment Lasers, Laser Diodes
- Laser Wavelength: Red
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Supplier: Accuris
Description: Standard Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding
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Supplier: Syntegon Packaging Technology, Inc.
Description: The Pack 301 LD horizontal flow wrapper is equipped with a long dwell sealing head to produce hermetically sealed packages that provide optimal product protection and longer shelf life. With speeds up to 150 packages per minute, this innovative packaging machine can be
- Automation: Automatic
- Closing Method: Wrapped
- Features: Aseptic / Sanitary
- Goods: Consumer Packaging
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Supplier: Skyworks Solutions, Inc.
Description: The SMV1405–SMV1413 series of bare die, epoxy and hermetic packaged silicon abrupt junction varactor diodes is designed for use in VCOs requiring tight capacitance tolerances. The low resistance of these varactors makes them appropriate for high Q resonators in wireless system VCOs to
- Diode Type: Varactor Diodes
- VR: 30 volts
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Supplier: All Packaging Machinery Corporation
Description: Portable USDA approved rotary table model sealing system 3/8" wide hermetic seal without a trim. Designed on swivel base for sealing from vertical to 45 degrees position.
- Automation: Semi-Automatic
- Closing Method: Heat Seal
- Features: Portable
- Goods: Powder / Granular, Consumer Packaging, Bulk / OEM Packaging
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Featured Products Top
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-High-power laser TO packages -Automotive relay sealing -Discrete semiconductor devices -Multilayer Ceramic Substrates -Surface-Mount Power Packages -Optical Communications: 400G transceiver hermetic sealing -Automotive Electronics: LiDAR emitter packaging for autonomous driving -Optical Communications: 400G transceiver hermetic sealing -New Energy: Insulation terminals for battery management systems (BMS) (read more)
Browse Glass Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
, and durability in mission-critical applications such as navigation, communication, and scientific data collection. Douglas Electrical Components provides hermetic feedthroughs and sealed packages designed for aerospace applications, helping reduce size and weight while improving (read more)
Browse Hermetic Sealing Services Datasheets for Douglas Electrical Components -
for epoxy-based custom hermetic connectors and feedthroughs, while EPI advances hermetic packaging solutions using glass-to-metal and ceramic technologies. Under Trezza’s leadership, the company is well positioned to balance growth with its longstanding commitment to quality, reliability, and service in mission-critical environments. (read more)
Browse Hermetic Sealing Services Datasheets for Douglas Electrical Components -
compact, lightweight packages while shielding electronics from moisture, condensation, corrosion, and electrical shorts. The process enables greater design flexibility by allowing non-hermetic connectors to be sealed and directly integrated into circuits, delivering cost-effective solutions (read more)
Browse Wire to Board Connectors Datasheets for Douglas Electrical Components -
conveyor and crank handle head height adjustment. Materials: PE, PP, Kraft/PE, Tyvek, Polymylar, Foil/PE, Cryovac, Coextrusions, Polylaminates, Military Specs, Nylon 3/8" wide hermetic seal Synchronized lower support conveyor makes pouch loading easy. Speeds up to 35 (read more)
Browse Sealing Machines Datasheets for All Packaging Machinery Corporation -
fields including integrated circuits, optical communications, microwave devices, and automotive electronics, the performance requirements for packaging enclosures are becoming increasingly rigorous and demanding. Specific indicators such as hermeticity, electrical insulation, thermal dissipation (read more)
Browse Electroceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
delivers 10mA of forward current, and a reverse recovery time of 100nS. Starting with VMI's standard glass-body, hermetically sealed diodes, these devices are over-molded in a rigid epoxy. The leads are then (read more)
Browse High Voltage Diodes Datasheets for Voltage Multipliers, Inc. -
Our Advanced Al2O3/AIN Ceramic Packages are engineered to deliver precision, durability, and superior sealing in demanding electronic environments. These packages offer (read more)
Browse Industrial Ceramic Materials Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
Our ceramic filters are manufactured in two basic styles for both commercial and military applications. The high-volume, cost-effective units in open frame, non-hermetic packages are most often used in commercial applications. The lower volume, custom designed hermetic packages find wide usages in military applications. Both styles are available in various mounting configurations. (read more)
Browse RF Filters and Microwave Filters Datasheets for Molex Signal Tech Industrial Ltd. -
High volume and various mounting configurations Ceramic Filters are manufactured in two basic styles for both commercial and military applications. The high-volume, cost-effective units in open frame, non-hermetic packages (read more)
Browse RF Filters and Microwave Filters Datasheets for Molex Signal Tech Industrial Ltd.
Conduct Research Top
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Rochester Electronics Qualifies Hermetic Packages for MC68040FE Microcontrollers
A valued Rochester customer required an ongoing supply of the MC68040FE processor to produce medical ventilators to be used in the fight against COVID-19.
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Package Hermeticity and Gas Analysis
processing or may be generated internally after seal from material outgassing or decomposition, a primary source is the ingress of moisture that occurs because of a non-hermetic package seal. Usually, to evaluate overall package integrity, both fine and gross leak tests are required to test the full
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How Getters Improve Reliability of Hermetically Sealed Electronic Packages
Electronic components may fail if they are exposed to corrosive agents or chemical attack by moisture or other reactive gases that may be present within an electronic package or enclosure. The reliability of sensitive electronic components can be improved by hermetically sealing them within
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Providing a Continuous Source of Supply for Critical Processors
Rochester Electronics worked with an OCM supplier partner to provide an assembly solution for their 240 lead CQFP hermetic package, which was no longer available in the market.
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HR1 Getter for Removal of Hydrogen from Hermetic Microelectronic Packaging
Outlines methodology for quantifying a getter's performance related to hydrogen (H2) absorption performance in uptake capacity and uptake rate, and provide a fundamental understanding on how to select a getter for keeping microelectronic packages free from an H2 outgassing induced failure mode.
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Two Solutions to Static Problems in Semiconductor Die Bonder Operation
to opposing leads on the hermetic package. Eventually, this hermetic package encases the entire die or chip. These leads are the link from the semiconductor die to the rest of the circuit when it is mounted on a circuit board or flex circuit substrate.
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Moisture-resistant sealing materials for downhole HPHT electrical feedthrough packages
Downhole logging tools and electrical circuits are packaged in a hermetically-sealed metal enclosure, which is either sealed and pressurized, or filled with fluid, to protect the circuits from downhole corrosive environment and humidity. The sealed tool enclosure uses an electrical feedthrough
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Hermetic Solutions DiaCool TM Materials offer Superior Thermal Management for the Next Generation of Higher Power Density
Electronic systems are rapidly evolving, where electronic circuits and components are being designed to handle greater amounts of power in smaller packages. The amount of power used or transmitted per unit mass, area or volume is often referred to as the "power density. "
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Implantable Neural Prostheses 2
The techniques covered include biocompatibility and biostability, hermetic packaging , electrochemical techniques for neural stimulation applications, novel electrode materials and testing, thin-film flexible microelectrode arrays, in situ charac- terization of microelectrode arrays, chip-size thin-film device encapsulation, microchip-embedded capacitors and …
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MEMS Materials and Processes Handbook
He, C.J. Kim: On-chip hermetic packaging enabled by post-deposition electro- chemical etching of polysilicon.
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Springer Handbook of Nanotechnology
He, C.J. Kim: On-chip hermetic packaging en- abled by post-deposition electrochemical etching of polysilicon, Proc. 18th Int. Conf.
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Springer Handbook of Nanotechnology
He, C. J. Kim: On-Chip Hermetic Packaging En- abled by Post-Deposition Electrochemical Etching of Polysilicon, Proceedings of the 18th Inter- national Conference on Microelectromechanical Systems (IEEE, Piscataway NJ 2005) pp. 544–547 10.20 S. K. Ghandhi: VLSI Fabrication Principles – …
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RF MEMS: Theory Design and Technology
… DC-Contact Series Switches, 161 Fabrication of Lateral DC-Contact Switches, 164 MEMS Release Procedures, 165 Substrate Transfer Process, 167 Fabrication, Substrate Transfer, and Packaging of the Omron DC-Contact Series Switch, 169 6.8 Conventional Hermetic Packaging of MEMS Switches, 171 …
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Springer Handbook of Nanotechnology
Fig. 36.7 DMD products in hermetic packages .
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Microsystems and Nanotechnology
Hermetic packaging is desirable in most cases because it provides a moisture free environment to avoid charge separation in capacitive devices, corrosion in metallization, or electrolytic conduction, in order to prolong the lifetime of the electronic circuitry.
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Fundamentals of Microsystems Packaging > FUNDAMENTALS OF SEALING AND ENCAPSULATION
Finally, the difference in hermetic vs. non- hermetic packaging , and how to achieve reliability without hermeticity, is indicated.