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Description: With over 70 years of experience and extensive manufacturing capability, Qnnect, formerly Hermetic Solutions Group has the largest selection of open tooling, plus custom capabilities for any size package, including JEDEC outlines such as TO-18, TO-39, TO-8, TO-3, TO-37, TO-66 and more.
- Package Material: Aluminum, Stainless Steel
- Features: Other
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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! HIC Packages The application
- Package Material: AlSiC, Aluminum, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! Microwave Packages Application
- Package Material: AlSiC, Aluminum, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Supplier: OptiSpac, Inc.
Description: The package adopts metal cavity brazing or melt seal feed through assembly, optical tube structure. WSS package cavity is usually large, generally using the Kovar alloy plate 6-side welding cavity structure (if the cavity is small, low cost aluminum alloy overall processing structure
- Package Material: Aluminum, Copper, Tungsten
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Supplier: Allied Electronics, Inc.
Description: Photocell, Hermetically Packaged
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Description: Qnnect, formerly Hermetic Solutions Group manufactures both custom and standard drop-in microwave packages for multiple industries including defense and aerospace. These components are used in higher-end applications, such as satellite, missiles, and aircraft guidance; electronic
- Package Material: Aluminum, Copper, Stainless Steel
- Features: Other
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Description: Optoelectronic packages serve as the critical interface for photonic components. We deliver end-to-end precision packaging solutions from design to mass production. Leveraging advanced materials and automated processes, our products ensure superior optical signal integrity and long-term
- Applications: Ceramics / Glass Manufacturing, Electronics / RF-Microwave
- Performance Features: Hard
- Features: Other, Specialty / Other
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Description: Qnnect, formerly Hermetic Solutions Group manufactures custom fiber optic and telecommunications packages for a variety of applications including: WADM modules Modulators Attenuators Pump lasers Switches Amplifiers This market has expanded to include bio-medical detectors, blood
- Package Material: Aluminum, Tungsten
- Features: Other
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview STAYDRY HICAP3000 PSA is a high-capacity moisture absorber film with a pressure sensitive adhesive (PSA) for easy and fast assembly into electronic devices. Its primary use is in hermetic and non-hermetic applications requiring moisture absorption in electronic devices
- Configuration: Desiccator
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Supplier: Light in Motion LLC
Description: Description: The BPW36/37 are silicon phototransistors mounted in narrow angle TO-18 package. Features: Hermetically sealed package Narrow reception angle European "Pro Electron" registered
- Peak Wavelength: 940 nm
- Collector Current: 1 milliamps
- Power Dissipation: 600 milliwatts
- Operating Temperature: -65 to 125 C
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Supplier: Light in Motion LLC
Description: Description: The CQX14/16 are 940 nm LEDs in a narrow angle, TO-46 package. Features: Good optical to mechanical alignment Mechanically and wavelength matched to the TO-18 series phototransistor Hermetically sealed package High irradiance level European "Pro Electron" registered
- Peak Wavelength: 940 nm
- Forward Voltage: 1.7 volts
- Forward Current: 100 milliamps
- Lens Type: Domed Lens
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Supplier: Light in Motion LLC
Description: Description: The CQX15 and CQX17 series are 940nm LEDs in a wide angle, TO-46 package. Features: Good optical to mechanical alignment Mechanically and wavelength matched to the TO-18 series phototransistor Hermetically sealed package High irradiance level European "Pro Electron"
- Peak Wavelength: 940 nm
- Forward Voltage: 1.7 volts
- Forward Current: 100 milliamps
- Lens Type: Flat Lens
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Supplier: Light in Motion LLC
Description: Description: The L14C1/L14C2 are silicon phototransistors mounted in a wide angle, TO-18 package. Features: Hermetically sealed package Wide reception angle
- Peak Wavelength: 940 nm
- Collector Current: 0.16 milliamps
- Power Dissipation: 600 milliwatts
- Operating Temperature: -65 to 125 C
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Description: Qnnect, formerly Hermetic Solutions Group offers standard flatpack, plug-in and platform packages in all common industry configurations. Our In-house engineering & manufacturing capabilities enable Qnnect, formerly Hermetic Solutions Group to accommodate any custom requirement.
- Features: Other
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Supplier: Palomar Technologies, Inc
Description: packaging laboratories offering solutions for process development/optimization, package prototyping, die attach, wire bonding, outsourced package assembly, test, and measurement. Innovation Center applications engineers develop your process in-house or devise a Research & Development
- Backend Processing: Bonding, Flip Chip Technology, Hermetic Sealing, Wire Bonding
- Features: East Asia / Pacific Only, North America, Other, Southwest US Only, United States Only
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Supplier: Schott Japan
Description: The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components in one container. In contrast to, for instance TO packages, these packages can be used to package not only a single
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Supplier: Accuris
Description: Standard Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding
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Supplier: Advanced Technical Ceramics Company
Description: Ceramic pedestal may be used in the package design to allow for self-jigging of metal or ceramic Seal-Ring. Microwave Design Assistance AdTech Ceramics produces HTCC and AlN packages for microwave applications in the X through K band frequency ranges. Electromagnetic Simulation This
- Type: BGA, LCCC, MCM
- Material: Ceramic
- Backend Processing: Dicing, Hermetic Sealing, Soldering / Pasting
- Features: North America, Other, Southern US Only, United States Only
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Supplier: Accuris
Description: Dimensions and capacities of hermetically sealed cylindrical cans for packaging products sold by volume
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Supplier: Accuris
Description: RESISTOR NETWORK, FIXED, FILM, 20 PIN, HERMETICALLY SEALED, DUAL-IN-LINE PACKAGE (DIP)
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Supplier: Accuris
Description: Dimensions and capacities of hermetically sealed cylindrical food cansfor packaging products sold by mass Metric Units
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Supplier: Thermocold Costruzioni Srl
Description: Packaged air dynamic handling units with crossflow heat exchangers with centrifugal fans and hermetic scroll compressors. • Compressors scroll hermetic type. • Double suction centrifugal fans. • Air side heat exchanger with seamless copper tubes and plate type aluminium fins
- Application: Commercial, Residential
- System: Heat Energy Recovery
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Supplier: Skyworks Solutions, Inc.
Description: The SMV1493 and SMV1494 bare die and hermetic packaged silicon abrupt junction varactor diodes are designed for use in VCOs requiring tight capacitance tolerances. The low resistance of these varactors makes them appropriate for high Q resonators in wireless system VCOs from RF to beyond 56
- VR: 12 volts
- Features: Varactor Diodes
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Supplier: ASTM International
Description: 1.1 The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package. 1.2 This test method covers a test for leaks
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Supplier: ASTM International
Description: 1.1 The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package. 1.2 This test method covers a test for leaks
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Supplier: Utmel Electronic Limited
Description: Rectifier Diode, Schottky, 1 Phase, 2 Element, 30A, 45V V(RRM), Silicon, TO-254AA, HERMETIC SEALED PACKAGE-3
- Features: Schottky Barrier Diodes
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Supplier: ProPhotonix, Ltd.
Description: Custom receptacle packaged laser diodes can be fitted with any 5.6mm package laser diode that a customer may require for their particular application. The receptacle-packaged diodes are packaged in either SMA, FC, ST or SC receptacles or with a universal adaptor that will accept FC, ST, SC
- Laser Type: Alignment Lasers, Laser Diodes
- Laser Output: Continuous Wave
- Laser Wavelength: Red
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Supplier: Douglas Electrical Components
Description: vapor and condensation or creates a hermetic barrier between the circuit and housing assembly or enclosure. Non-hermetic connectors offer more design options and are lower cost than their hermetic counterparts. Douglas Electrical can hermetically seal a non-hermetic
- Additional Services: Design Assistance
- Industry: Electrical / Electronics, Military / Law Enforcement
- Sealing Method Capabilities: Epoxies
- Features: North America, Northeast US Only, United States Only
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Supplier: Utmel Electronic Limited
Description: DIODE 47 V, 0.4 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Voltage Regulator Diode
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Supplier: Thermocold Costruzioni Srl
Description: Packaged air dynamic handling units with crossflow heat exchangers with centrifugal fans and hermetic scroll compressors. Packaged cooling only air conditioners. • Compressors scroll hermetic type. • Double suction centrifugal fans. • Air side heat exchanger with seamless copper tubes
- Cooling Capacity: 4.8 to 22.1 kW
- Process Flow: 3,082.0072773 to 15,410.0363865 GPM
- Compressor Motor Horsepower: 1.4742424233931 to 7.90730027092664 HP
- Full Load Amperage: 13.6 to 30.2 amps
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Supplier: Utmel Electronic Limited
Description: DIODE 3.9 V, 0.4 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Voltage Regulator Diode
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Supplier: Utmel Electronic Limited
Description: DIODE 3.6 V, 0.4 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Voltage Regulator Diode
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Supplier: Thermocold Costruzioni Srl
Description: Packaged air dynamic handling units with crossflow heat exchangers with centrifugal fans and hermetic scroll compressors. Packaged air conditioners with reverse cycle for heat pump operation. • Compressors scroll hermetic type. • Double suction centrifugal fans. • Air side heat
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Supplier: Palomar Technologies, Inc
Description: bonding. High Vacuum Furnace Applications MEMS Package Sealing Infrared Sensor Package Sealing Crystal Oscillator Package Sealing Hermetic Package Sealing Wafer Level Packaging Void-Free Eutectic Die Attach Low Moisture Package Sealing Nobel Gas Miniature
- Type: Factory / Free Standing
- Vacuum / Pressure Range: High Vacuum (< 10-3, >10-8 torr)
- Features: Integral Process Controller, MEMS, Other
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, and durability in mission-critical applications such as navigation, communication, and scientific data collection. Douglas Electrical Components provides hermetic feedthroughs and sealed packages designed for aerospace applications, helping reduce size and weight while improving (read more)
Browse Hermetic Sealing Services Datasheets for Douglas Electrical Components -
for epoxy-based custom hermetic connectors and feedthroughs, while EPI advances hermetic packaging solutions using glass-to-metal and ceramic technologies. Under Trezza’s leadership, the company is well positioned to balance growth with its longstanding commitment to quality, reliability, and service in mission-critical environments. (read more)
Browse Hermetic Sealing Services Datasheets for Douglas Electrical Components -
compact, lightweight packages while shielding electronics from moisture, condensation, corrosion, and electrical shorts. The process enables greater design flexibility by allowing non-hermetic connectors to be sealed and directly integrated into circuits, delivering cost-effective solutions (read more)
Browse Wire to Board Connectors Datasheets for Douglas Electrical Components -
conveyor and crank handle head height adjustment. Materials: PE, PP, Kraft/PE, Tyvek, Polymylar, Foil/PE, Cryovac, Coextrusions, Polylaminates, Military Specs, Nylon 3/8" wide hermetic seal Synchronized lower support conveyor makes pouch loading easy. Speeds up to 35 (read more)
Browse Sealing Machines Datasheets for All Packaging Machinery Corporation -
delivers 10mA of forward current, and a reverse recovery time of 100nS. Starting with VMI's standard glass-body, hermetically sealed diodes, these devices are over-molded in a rigid epoxy. The leads are then (read more)
Browse High Voltage Diodes Datasheets for Voltage Multipliers, Inc. -
Our Advanced Al2O3/AIN Ceramic Packages are engineered to deliver precision, durability, and superior sealing in demanding electronic environments. These packages offer (read more)
Browse Industrial Ceramic Materials Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
Our ceramic filters are manufactured in two basic styles for both commercial and military applications. The high-volume, cost-effective units in open frame, non-hermetic packages are most often used in commercial applications. The lower volume, custom designed hermetic packages find wide usages in military applications. Both styles are available in various mounting configurations. (read more)
Browse RF Filters and Microwave Filters Datasheets for Molex Signal Tech Industrial Ltd. -
High volume and various mounting configurations Ceramic Filters are manufactured in two basic styles for both commercial and military applications. The high-volume, cost-effective units in open frame, non-hermetic packages (read more)
Browse RF Filters and Microwave Filters Datasheets for Molex Signal Tech Industrial Ltd. -
housings, flanges, or threaded interfaces. Unlike semi-hermetic alternatives, Douglas manufactures complete hermetic packages designed for long-term durability and system protection. In addition to power feedthroughs, Douglas manufactures hermetic wire and cable feedthroughs for signal (read more)
Browse Feedthroughs Datasheets for Douglas Electrical Components -
Cost-effective alternative to CMC and CPC materials Applications: Electronics packaging, hermetic seals, aerospace components, power (read more)
Browse Heat Pipes Datasheets for ToneCooling Technology Co., Ltd
Conduct Research Top
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Rochester Electronics Qualifies Hermetic Packages for MC68040FE Microcontrollers
A valued Rochester customer required an ongoing supply of the MC68040FE processor to produce medical ventilators to be used in the fight against COVID-19.
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Package Hermeticity and Gas Analysis
processing or may be generated internally after seal from material outgassing or decomposition, a primary source is the ingress of moisture that occurs because of a non-hermetic package seal. Usually, to evaluate overall package integrity, both fine and gross leak tests are required to test the full
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How Getters Improve Reliability of Hermetically Sealed Electronic Packages
Electronic components may fail if they are exposed to corrosive agents or chemical attack by moisture or other reactive gases that may be present within an electronic package or enclosure. The reliability of sensitive electronic components can be improved by hermetically sealing them within
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Providing a Continuous Source of Supply for Critical Processors
Rochester Electronics worked with an OCM supplier partner to provide an assembly solution for their 240 lead CQFP hermetic package, which was no longer available in the market.
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HR1 Getter for Removal of Hydrogen from Hermetic Microelectronic Packaging
Outlines methodology for quantifying a getter's performance related to hydrogen (H2) absorption performance in uptake capacity and uptake rate, and provide a fundamental understanding on how to select a getter for keeping microelectronic packages free from an H2 outgassing induced failure mode.
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Two Solutions to Static Problems in Semiconductor Die Bonder Operation
to opposing leads on the hermetic package. Eventually, this hermetic package encases the entire die or chip. These leads are the link from the semiconductor die to the rest of the circuit when it is mounted on a circuit board or flex circuit substrate.
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Moisture-resistant sealing materials for downhole HPHT electrical feedthrough packages
Downhole logging tools and electrical circuits are packaged in a hermetically-sealed metal enclosure, which is either sealed and pressurized, or filled with fluid, to protect the circuits from downhole corrosive environment and humidity. The sealed tool enclosure uses an electrical feedthrough
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Hermetic Solutions DiaCool TM Materials offer Superior Thermal Management for the Next Generation of Higher Power Density
Electronic systems are rapidly evolving, where electronic circuits and components are being designed to handle greater amounts of power in smaller packages. The amount of power used or transmitted per unit mass, area or volume is often referred to as the "power density. "
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Implantable Neural Prostheses 2
The techniques covered include biocompatibility and biostability, hermetic packaging , electrochemical techniques for neural stimulation applications, novel electrode materials and testing, thin-film flexible microelectrode arrays, in situ charac- terization of microelectrode arrays, chip-size thin-film device encapsulation, microchip-embedded capacitors and …
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MEMS Materials and Processes Handbook
He, C.J. Kim: On-chip hermetic packaging enabled by post-deposition electro- chemical etching of polysilicon.
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Springer Handbook of Nanotechnology
He, C.J. Kim: On-chip hermetic packaging en- abled by post-deposition electrochemical etching of polysilicon, Proc. 18th Int. Conf.
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Springer Handbook of Nanotechnology
He, C. J. Kim: On-Chip Hermetic Packaging En- abled by Post-Deposition Electrochemical Etching of Polysilicon, Proceedings of the 18th Inter- national Conference on Microelectromechanical Systems (IEEE, Piscataway NJ 2005) pp. 544–547 10.20 S. K. Ghandhi: VLSI Fabrication Principles – …
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RF MEMS: Theory Design and Technology
… DC-Contact Series Switches, 161 Fabrication of Lateral DC-Contact Switches, 164 MEMS Release Procedures, 165 Substrate Transfer Process, 167 Fabrication, Substrate Transfer, and Packaging of the Omron DC-Contact Series Switch, 169 6.8 Conventional Hermetic Packaging of MEMS Switches, 171 …
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Springer Handbook of Nanotechnology
Fig. 36.7 DMD products in hermetic packages .
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Microsystems and Nanotechnology
Hermetic packaging is desirable in most cases because it provides a moisture free environment to avoid charge separation in capacitive devices, corrosion in metallization, or electrolytic conduction, in order to prolong the lifetime of the electronic circuitry.
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Fundamentals of Microsystems Packaging > FUNDAMENTALS OF SEALING AND ENCAPSULATION
Finally, the difference in hermetic vs. non- hermetic packaging , and how to achieve reliability without hermeticity, is indicated.