Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Palomar Technologies, Inc
Description: Overview The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder with optional interchangeable clamps for 45-60° and 90° deep access bonding on a single machine. The large 304 x 152mm work area provides users flexibility to work with many different work
- Automation: Automatic
- Wire Bonder Type: Wedge Bonder
-
Supplier: Accuris
Description: DETERMINATION OF BOND STRENGTH USING THE WEDGE METHOD
-
Supplier: Palomar Technologies, Inc
Description: The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next
- Automation: Automatic
- Wire Bonder Type: Thermosonic Ball Bonder
-
-
Description: integrity under high thermal and mechanical stress makes them ideal for precise, high-performance applications. Applications: Wire bonding, die attach, and molding in the semiconductor industry.
- Wire Bonder Type: Wedge Bonder
-
Description: EFO wands are polished base on over decade years special experience. So it make the spark consistent and the direction from the same point always. Application Die bonding process, Wire Bonding, flip-chip bonding and MEMS packaging , High-Precision Electronics such as in LED.
- Automation: Automatic
- Wire Bonder Type: Wedge Bonder
-
Description: Standardizes the first order modeling of bond wires and the way bond wires are modeled in three dimensional electromagnetic field solvers. Describes the modeling of a bond wire from an integrated circuit die to a package lead in a ball or wedge type wire bond configuration.
-
Supplier: Visual Sound, Inc.
Description: Stewart Filmscreen Corp. The Wedge frame structure is designed to hold specially modified acrylic or flexible screen materials from behind the image plane, making the system invisible when viewed from the front. This system will work with both optical and diffusion type acrylic screen
- Features: Flat Panel Monitor
-
Supplier: Visual Sound, Inc.
Description: Stewart Filmscreen Corp. The Wedge frame structure is designed to hold specially modified acrylic or flexible screen materials from behind the image plane, making the system invisible when viewed from the front. This system will work with both optical and diffusion type acrylic screen
- Features: Flat Panel Monitor
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 739 Plastic Adhesive White is a one component, room temperature curing, silicone adhesive that is used for sealing, wedge bonding, repairs, and general purpose applications. It offers high elongation, no flow, fast in-line processing, flame resistance, and requires no
- Tensile Strength (Break): 205 psi
- Elongation: 500 %
- Dielectric Strength: 625 kV/in
- Chemical System: Silicone
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 739 Plastic Adhesive Black is a one component, room temperature curing, silicone adhesive that is used for sealing, wedge bonding, repairs, and general purpose applications. It offers high elongation, no flow, fast in-line processing, flame resistant, and requires no
- Tensile Strength (Break): 205 psi
- Elongation: 500 %
- Dielectric Strength: 625 kV/in
- Chemical System: Silicone
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 739 Plastic Adhesive White is a one component, room temperature curing, silicone adhesive that is used for sealing, wedge bonding, repairs, and general purpose applications. It offers high elongation, no flow, fast in-line processing, flame resistant, and requires no
- Tensile Strength (Break): 205 psi
- Elongation: 500 %
- Dielectric Strength: 625 kV/in
- Chemical System: Silicone
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 739 Plastic Adhesive Black is a one component, room temperature curing, silicone adhesive that is used for sealing, wedge bonding, repairs, and general purpose applications. It offers high elongation, no flow, fast in-line processing, flame resistant, and requires no
- Tensile Strength (Break): 205 psi
- Elongation: 500 %
- Dielectric Strength: 625 kV/in
- Chemical System: Silicone
-
Description: Simulates in a qualitative manner the forces and effects on an adhesive-bonded joint at a metal-adhesive/primer interface. It can also be used as a method of checking the surface preparation of substrates. The test is applicable at the present time to the bonding of aluminium and titanium
-
Supplier: ASTM International
Description: 1.1 This test method 2,3 simulates in a qualitative manner the forces and effects on an adhesive bond joint at metal-adhesive/primer interface. It has proven to be highly reliable in determining and predicting the environmental durability of adherend surface preparations. The method has proven to
-
Supplier: ASTM International
Description: 1.1 This test method , simulates in a qualitative manner the forces and effects on an adhesive bond joint at metal-adhesive/primer interface. It has proven to be highly reliable in determining and predicting the environmental durability of adherend surface preparations. The method has proven to be
-
Supplier: AVK International A/S
Description: The wedge is the heart of a gate valve and the quality of the wedge rubber is crucial for the valve function and durability. AVK wedges are fully vulcanized with AVK’s rubber compound with outstanding characteristics. The double bonding vulcanization process ensures
- Valve Size: 1.5 to 24 inch
- Media Temperature: 158 F
- Features: Bolt Flange
- Primary Material: Ductile Iron
-
Supplier: AVK International A/S
Description: original shape, the double bonding vulcanization process and the sturdy wedge design. The triple safety stem sealing system replaceable under pressure, the high strength stem and the thorough corrosion protection safeguard the unmatched reliability.
- Valve Size: 2 to 36 inch
- Media Temperature: 158 F
- Features: Bolt Flange, Butt Weld, Metal Seated
- Primary Material: Ductile Iron
-
Supplier: ASTM International
Description: This specification covers all-purpose, taping and finishing joint compounds, paper joint tape and glass-mesh joint tape. No cracks in the thinner half of the wedge and no deep fissure cracks in the thicker half of the wedge. Other physical properties such as putrefaction, shrinkage,
-
Supplier: Sugatsune America, Inc.
Description: Easy push-in installation. No screws are needed. Subtle clean look. Processed wood surface cannot be seen through the hole. Has ramped wedges inside to reduce the gap and prevent doors from rattling. Can be used with GS-GL5 and 1310GL locks. If the installation is loose, please use adhesive
- Features: Other, Recessed
- Materials: Plastic
-
Supplier: Sugatsune America, Inc.
Description: Easy push-in installation. No screws are needed. Subtle clean look. Processed wood surface cannot be seen through the hole. Has ramped wedges inside to reduce the gap and prevent doors from rattling. Can be used with GS-GL5 and 1310GL locks. If the installation is loose, please use adhesive
- Features: Other, Recessed
- Materials: Plastic
-
Supplier: ASTM International
Description: under the wire. 1.3 The precision of these methods has been evaluated for aluminum ultra-sonic wedge bonds; however, these methods can be used for aluminum ball bonds and gold wedge or ball bonds, as aluminum wedge bonds are the most sensitive to manufacturing variations (such
-
Supplier: WORLD electronics
Description: package types Chip Scale Package (CSP) BGA and uBGA double-sided/mirrored BGA assembly COB and MCM Direct and multiple chip attach High pin count press fit Gold and aluminum wedge-bonding Wire-bonding Flex Circuits Wave solder Selective soldering Aqueous cleaning
- Industry / Application: Aerospace / Avionics, Automotive, Consumer / Retail, Electronics / Semiconductors, Energy / Utility, Food / Beverage, Industrial / Commercial, Instruments / Sensors, Marine, Material Handling, Medical / Health Care, Military / Defense, Pharmaceutical / Biotech, Telecommunications
- Capabilities: Ceramic Manufacturing, Electrical and Electromechanical Assembly, Electronic Manufacturing, Mechanical Assembly
- Services: Computer Aided Design (CAD) / Solid Modeling, Design / Development, High Volume Production, Just-in-Time Delivery, Kitting, Low Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Testing / Inspection, Turnkey Product Manufacturing, Warehousing / Stocking
- Features: North America, Northeast US Only, United States Only
-
Supplier: HG Optronics, Inc.
Description: finder 6)High power laser system etc. Why Choose HGO ? HG OPTRONICS.,INC. is one of the earliest diffusion bonding crystals manufactures in China. Based on advanced bonding technology , wide experiences and techniques upgrading in the past over 13 years, HGO have become a top diffusion
- Surface Flatness: λ/10
- Surface Quality: 10-5 Scratch / Dig
- Features: AR-Coated, Other
-
Supplier: Innovation Polymers
Description: normal working temperatures. The tacky texture makes it an effective pressure sensitive adhesive i.e. it forms a bond when pressure is applied. One drop covering the wedge to probe contact surface can provide continuous coupling for several months.
- Viscosity: 190,000 cP
- Type: Elastomer / Rubber
- Form / Shape: Liquid
- Features: Molding Resin, Other
-
Supplier: IRD Glass
Description: count on IRD to build it to your specifications, meet your specific tolerances and deliver it within your timetable. IRD Glass provides their clients with a complete line of custom optic manufacturing capabilities, including cylindrical and spherical lenses, prisms, wedges, windows, mirrors,
- Size Capabilities: 0.3149608 to 20 inch
- Materials Processed: Aluminosilicate, Borosilicate, Dichroic, Fluoride Glass, Glass Ceramic, Quartz, Silicate / Fused Silica, Soda Lime
- Secondary Operations: Anti-Reflective Coating, Chemical Treating, Etching / Blasting, Glass to Ceramic Bonding, Glass to Metal Bonding, Heat Treating, Hermetic Sealing, Lapping / Polishing, Screen Coating, Silvering / Metallizing
- Services: Design Assistance, Glass Cutting / Profiling, Glass Part Fabrication, Inspection / Testing, Material Selection
-
Supplier: Insaco, Inc.
Description: Since 1947 Insaco® has been a precision machining and polishing fabricator of parts from all technical ceramics, sapphire, glass and quartz. We machine these materials to very precise tolerances (many times measured in millionths of an inch) for dimension, flatness, wedge and roundness or
- Materials: Alumina (Al2O3), Glass Ceramic, Metal Boride (TiB2, ZrB2), Metal Carbide / Hard Metal (WC, TiC), Nitride (AlN, BN), Porcelain, Sapphire, Silicate / Fused Silica, Silicon Carbide (SiC), Silicon Nitride (Si3N4), Zirconia
- Services: Bonding / Assembly, Design Assistance, Material Selection
- Application / Industries Served: Chemical Processing, Electronics / RF-Microwave, Optical Components, Structural Components, Wear Parts / Tooling
- Process: Grinding, Machining
-
Description: extreme to chemical corrosion and abrasions. Sapphire windows might be produced into thin optics without fracturing because of the tight internal covalent bonding of single crystal sapphire while demonstrating good thermal stabilities due to its high thermal conduction. Shalom EO offers
- Features: Other, Other Mirror Coating
- Mirror Coatings: Uncoated
-
Supplier: Velan, Inc.
Description: Bidirectional, zero-leakage, triple-offset butterfly valves Features and benefits The Torqseal's advanced design features three-way eccentricity and unique elliptical seat geometry ensuring compressive sealing around the entire seat and a "tightâ€, bubble-free valve. • CoCr alloy hardfaced seat:
- Valve Size: 3 to 48 inch
- Features: ASME, Bolt Flange, Butt Weld, Other
- Valve Type: Butterfly Valves
-
Supplier: Micross Components, Inc.
Description: b. Ultrasonic or Wedge c. Flip-Chip d. Beam Lead 2 (0) X X 6 Die-Shear Strength 2 (0) X X 7 Solderability 1 (0) X X 8 Seal: a. Fine b. Gross 15 (0) X 9 ESD: a. Electrical Parameters b. ESDS c. Electrical Parameter 3 (0) X X MIL-PRF-38534 Group C Testing Sub Group - Parameters - Quantity
- Type: DC/DC Converter
-
Supplier: Titebond
Description: 991 PROvantage SHOULD NOT BE FLASHED. Begin laying the wood flooring immediately after troweling the adhesive with the correct trowel. To reduce slippage, secure the first two starter rows with starting blocks fastened to the substrate or wedges against starting wall. Work in small sections
- Viscosity: 125,000 cP
- Features: Specialty / Other
-
Description: their dielectric equivalents because of the solid internal covalent bonding of sapphire. For instance, sapphire windows are often chosen in deepwater and navigation scenarios. Sapphire is also heat-resistant, with a maximum working temperature of 1600°C and a maximum melting temperature of
- Thickness: 0.5 to 3.1799999999999997 mm
- Surface Flatness: λ/2
- Surface Quality: 40-20 Scratch / Dig, 60-40 Scratch / Dig
- Window Shape: Circular, Square
-
Supplier: Titebond
Description: starter rows with starting blocks fastened to the substrate or wedges against starting wall. Remaining planks must be placed firmly into adhesive. Planks that are not flat should be weighted for several hours. Be sure to cover entire area to be installed. Remember Titebond 771-Step is a rapid
- Viscosity: 125,000 cP
- Features: Specialty / Other
-
Supplier: Titebond
Description: troweled, the wood flooring may be installed immediately into the wet adhesive. To reduce slippage, secure the first two starter rows with starting blocks fastened to the substrate or wedges against starting wall. Remaining planks must be placed firmly into adhesive. Planks which are not flat
- Viscosity: 100,000 cP
- Features: Specialty / Other
-
Supplier: Titebond
Description: the adhesive. Once the adhesive has been troweled, the wood flooring may be installed immediately into the wet adhesive. To reduce slippage, secure the first two starter rows with starting blocks fastened to the substrate or wedges against starting wall. Remaining planks must be placed firmly
- Viscosity: 100,000 cP
- Features: Specialty / Other
Find Suppliers by Category Top
Featured Products Top
-
devices, through ball-wedge or wedge-wedge Au-wire bonding. Customized adaptations are available on request. Learn more: Bondsens temperature sensor | IST AG Contact your IST team to get sensor chip implementation support for your project. (read more)
Browse Resistive Temperature Devices (RTD) Elements Datasheets for Innovative Sensor Technology IST USA Division -
have today. Some of our more standardized Optographic products include: Reticles, Resolution Targets (including USAF & Sayce), Gratings, Step Wedges, Optical Rulers Field Finders, Rapid Comparators, Encoder Discs & Scales, Apertures and Grids (read more)
Browse Reticles Datasheets for Gurley Precision Instruments -
produced by sintering, reaction bonding, crystal growth, and chemical vapor deposition (CVD). Silicon carbide offers low density and high stiffness, as well as extreme hardness and wear resistance. The CVD material can be produced with such low electrical resistance (around one ohm cm) that (read more)
Browse Ultra-hard Materials Machining Datasheets for Insaco, Inc.
Conduct Research Top
-
Introduction of Wedge Capillary for Wire Bonding
Wire bonding is currently the mainstream connection method for semiconductors packaging. Commonly used wire bonding welding methods include thermocompression welding, ultrasonic welding and ultrasonic thermocompression welding. Wire bonding can be categorised as ball bonding and wedge bonding
-
Reliable Wire Bonding Through Quality Data Collection for Industry 4.0
methods in small device manufacturing due to its cost effectiveness and reliability. Initial iterations of wire bonding began in the mid twentieth century where it was used to connect early silicon semiconductor devices to their ceramic packaging. These wire bonds, typically wedge bonded, were
-
EETimes.com | Electronics Industry News for EEs & Engineering Managers
. announced that chip-equipment veteran Brad Mattson has been elected chairman. K &S sells wedge bonder technology to Orthodyne Continuing to shed its non-core businesses, backend assembly equipment specialist Kulicke & Soffa Industries Inc. (K &S) announced the sale of its wedge bonder technology
More Information Top
-
Advanced Wirebond Interconnection Technology
1.1: Wire Bonding Technologies 1.1.1: Thermosonic Bonding 1.1.2: Ultrasonic Wedge Bonding 1.2: Advantages of Ball-Wedge Bonding 1.2.1: Disadvantages of Thermosonic Ball- Wedge Bonding 1.3: Advantages ofAluminum Wedge Bonding 1.3.1: Disadvantages …
-
Force Sensors for Microelectronic Packaging Applications
38 2.3 Wedge Bond Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
-
Wire Bonding in Microelectronics, Third Edition > Wire Bond Testing
While the pull test is valid for wedge bonds , it is necessary to use a shear test, or, in some cases, a thermal stress test to evaluate Au ball bonds (on Al pads) adequately.
-
Power Electronic Packaging
304 8.4.3 Optimization of Wedge Bonding for a Power Package ....
-
Wire Bonding in Microelectronics, Third Edition > Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism
Wedge bonding –tool vibration modes for 60 kHz excitation.
-
Wire Bonding in Microelectronics, Third Edition > Advanced and Specialized Wire Bonding Technologies
One approach to achieve bond-production control with small sample sizes used the deformed width of wedge bonds (which fitted a normal distribution as determined by the Chi-square statistic) in conjunction with reliability test data.
-
Materials for Advanced Packaging
Fig. 4.3 Ultrasonic bonds ( wedge bonds ).
-
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Ultrasonic bonds ( wedge bonds ).
-
Integrated Circuit Packaging, Assembly and Interconnections
8.4 — Bonding Wire: Au, Al, and Cu............................................................106 8.5 — Bonding Methods................................................................................108 8.6 — Types of Bonds ...................................................................................110 8.7 — The Ball Bonding Process...................................................................110 8.8 — Wedge Bonding ...................................................................................111 8.9 — Obstacles to …
Indicates content that may require registration and/or purchase.