Products & Services
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Supplier: Palomar Technologies, Inc
Description: Overview The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder with optional interchangeable clamps for 45-60° and 90° deep access bonding on a single machine. The large 304 x 152mm work area provides users flexibility to work with many
- Automation: Automatic
- Type: Wedge Bonder
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Supplier: Palomar Technologies, Inc
Description: The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the
- Automation: Automatic
- Type: Thermosonic Ball Bonder
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Description: structural integrity under high thermal and mechanical stress makes them ideal for precise, high-performance applications. Applications: Wire bonding, die attach, and molding in the semiconductor industry.
- Type: Wedge Bonder
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Description: Material Made up of Iridium, platinum , Iridium alloy & Stainless Steel. Features The EFO wand is essential in applications requiring high precision and controlled energy delivery for precise bonding and wire placement in microelectronic components. Superior electrode material assures the
- Automation: Automatic
- Type: Wedge Bonder
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Supplier: Accuris
Description: DETERMINATION OF BOND STRENGTH USING THE WEDGE METHOD
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Supplier: Visual Sound, Inc.
Description: Stewart Filmscreen Corp. The Wedge frame structure is designed to hold specially modified acrylic or flexible screen materials from behind the image plane, making the system invisible when viewed from the front. This system will work with both optical and diffusion type acrylic screen
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Supplier: Visual Sound, Inc.
Description: Stewart Filmscreen Corp. The Wedge frame structure is designed to hold specially modified acrylic or flexible screen materials from behind the image plane, making the system invisible when viewed from the front. This system will work with both optical and diffusion type acrylic screen
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Description: thermal transfer, at low cost are important. This sensor is typically used in energy management and thermal compensation for consumer, industrial and medical devices. It features a very small size of 0.75mm x 0.75mm with very low drift and can be packaged and integrated with semiconductor devices,
- Length: 0.0295 inch
- Nominal Resistance: 1000 R0 @ 0° C
- Operating Temperature: -58 to 302 F
- Sensor Technology: Wire Wound
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Description: Standardizes the first order modeling of bond wires and the way bond wires are modeled in three dimensional electromagnetic field solvers. Describes the modeling of a bond wire from an integrated circuit die to a package lead in a ball or wedge type wire bond
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Description: Simulates in a qualitative manner the forces and effects on an adhesive-bonded joint at a metal-adhesive/prime r interface. It can also be used as a method of checking the surface preparation of substrates. The test is applicable at the present time to the bonding of aluminium and titanium
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Supplier: ASTM International
Description: 1.1 This test method 2,3 simulates in a qualitative manner the forces and effects on an adhesive bond joint at metal-adhesive/prime r interface. It has proven to be highly reliable in determining and predicting the environmental durability of adherend surface preparations. The method has
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Supplier: ASTM International
Description: 1.1 This test method, simulates in a qualitative manner the forces and effects on an adhesive bond joint at metal-adhesive/prime r interface. It has proven to be highly reliable in determining and predicting the environmental durability of adherend surface preparations. The
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 739 Plastic Adhesive White is a one component, room temperature curing, silicone adhesive that is used for sealing, wedge bonding, repairs, and general purpose applications. It offers high elongation, no flow, fast in-line processing, flame resistance, and requires no
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Dielectric Strength: 625 kV/in
- Elongation: 500 %
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 739 Plastic Adhesive Black is a one component, room temperature curing, silicone adhesive that is used for sealing, wedge bonding, repairs, and general purpose applications. It offers high elongation, no flow, fast in-line processing, flame resistant, and requires no
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Dielectric Strength: 625 kV/in
- Elongation: 500 %
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 739 Plastic Adhesive Black is a one component, room temperature curing, silicone adhesive that is used for sealing, wedge bonding, repairs, and general purpose applications. It offers high elongation, no flow, fast in-line processing, flame resistant, and requires no
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Dielectric Strength: 625 kV/in
- Elongation: 500 %
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 739 Plastic Adhesive White is a one component, room temperature curing, silicone adhesive that is used for sealing, wedge bonding, repairs, and general purpose applications. It offers high elongation, no flow, fast in-line processing, flame resistant, and requires no
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Dielectric Strength: 625 kV/in
- Elongation: 500 %
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Supplier: ASTM International
Description: 1.1 This test method , simulates in a qualitative manner the forces and effects on an adhesive bond joint at metal-adhesive/prime r interface. It has proven to be highly reliable in determining and predicting the environmental durability of adherend surface preparations. The
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Supplier: IRD Glass
Description: made from glass, count on IRD to build it to your specifications, meet your specific tolerances and deliver it within your timetable. IRD Glass provides their clients with a complete line of custom optic manufacturing capabilities, including cylindrical and spherical lenses, prisms, wedges,
- Additional Operations: Chemical Treating, Glass to Metal Bonding, Glass to Ceramic Bonding, Etching / Blasting, Heat Treating, Hermetic Sealing, Lapping / Polishing
- Application Expertise: Electronics (Stems / Headers), Lighting, Optical / Semiconductor
- Coating Services: Anti-Reflective Coating, Silvering / Metallizing, Screen Coating
- Fabrication Services: Design Assistance, Glass Part Fabrication, Glass Cutting / Profiling, Material Selection, Photomask Fabrication, Inspection / Testing, Specialty / Other
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Supplier: IRD Glass
Description: made from glass, count on IRD to build it to your specifications, meet your specific tolerances and deliver it within your timetable. IRD Glass provides their clients with a complete line of custom optic manufacturing capabilities, including cylindrical and spherical lenses, prisms, wedges,
- Application / Industries Served: Chemical Processing, Electrical / HV, Electronics / RF-Microwave, Optical Components, Structural Components, Wear Parts / Tooling
- Fabrication Process: Grinding, Injection Molding, Machining, Sintering / Firing
- Location: North America, United States Only, Midwest US Only
- Materials: Alumina (Al2O3), Glass Ceramic, Sapphire, Zirconia (ZrO2)
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Supplier: Insaco, Inc.
Description: Since 1947 Insaco® has been a precision machining and polishing fabricator of parts from all technical ceramics, sapphire, glass and quartz. We machine these materials to very precise tolerances (many times measured in millionths of an inch) for dimension, flatness, wedge
- Application / Industries Served: Chemical Processing, Electronics / RF-Microwave, Optical Components, Structural Components, Wear Parts / Tooling, Other
- Fabrication Process: Grinding, Machining
- Location: North America, United States Only, Northeast US Only
- Materials: Alumina (Al2O3), Glass Ceramic, Metal Boride (TiB2, ZrB2), Metal Carbide / Hard Metal (WC, TiC), Nitride (AlN, BN), Porcelain, Sapphire, Silicate / Fused Silica, Silicon Carbide (SiC), Silicon Nitride (Si3N4), Zirconia (ZrO2)
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Supplier: Sugatsune America, Inc.
Description: Easy push-in installation. No screws are needed. Subtle clean look. Processed wood surface cannot be seen through the hole. Has ramped wedges inside to reduce the gap and prevent doors from rattling. Can be used with GS-GL5 and 1310GL locks
- Features: Recessed
- Materials: Plastic, Other
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Supplier: Sugatsune America, Inc.
Description: Easy push-in installation. No screws are needed. Subtle clean look. Processed wood surface cannot be seen through the hole. Has ramped wedges inside to reduce the gap and prevent doors from rattling. Can be used with GS-GL5 and 1310GL locks
- Features: Recessed
- Materials: Plastic, Other
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Supplier: AVK International A/S
Description: The wedge is the heart of a gate valve and the quality of the wedge rubber is crucial for the valve function and durability. AVK wedges are fully vulcanized with AVK’s rubber compound with outstanding characteristics. The double bonding vulcanization process ensures
- Actuation: Manual / Hand, Mechanical Device, Electric, Pneumatic
- Media: Wastewater
- Media Temperature: 158 F
- Primary Material of Construction: Ductile Iron
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Supplier: AVK International A/S
Description: its original shape, the double bonding vulcanization process and the sturdy wedge design. The triple safety stem sealing system replaceable under pressure, the high strength stem and the thorough corrosion protection safeguard the unmatched reliability.
- Actuation: Manual / Hand
- Media: Gas, LP - Gas, Natural Gas
- Media Temperature: 158 F
- Primary Material of Construction: Ductile Iron
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Supplier: ASTM International
Description: This specification covers all-purpose, taping and finishing joint compounds, paper joint tape and glass-mesh joint tape. No cracks in the thinner half of the wedge and no deep fissure cracks in the thicker half of the wedge. Other physical properties such as putrefaction, shrinkage,
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Supplier: Innovation Polymers
Description: at normal working temperatures. The tacky texture makes it an effective pressure sensitive adhesive i.e. it forms a bond when pressure is applied. One drop covering the wedge to probe contact surface can provide continuous coupling for several months.
- Compound Type: Liquid
- Industry: Other
- Material Type / Grade: Elastomer / Rubber
- Viscosity: 190000 cP
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Supplier: HG Optronics, Inc.
Description: components to make compact lasers. HGO are able to supply various standard assembly and special customized bonding crystals.These diffusion bonded composite crystals have different wedge structures, Brewster angles, etc. It is used to effectively reduce the thermal effect of
- Features: AR-Coated
- Surface Flatness: λ/10, Other
- Surface Quality: 10-5 Scratch / Dig, Other
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Supplier: WORLD electronics
Description: Direct and multiple chip attach High pin count press fit Gold and aluminum wedge-bonding Wire-bonding Flex Circuits Wave solder Selective soldering Aqueous cleaning
- Capabilities: Design Assistance, Part Procurement, Prototype / Low Production Quantities, Large Production Quantities, Subsystem Assembly, Full System Assembly (Box Build), Testing and Evaluation, Just-In-Time Capability
- Location: North America, United States Only, Northeast US Only
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Supplier: Velan, Inc.
Description: graphite layers are carefully assembled between stainless steel rings and graphite using phenolic resin bond. Solid seal rings are available for abrasive services as well as high temperature applications up to 1112°F (600°C). • ""ZERO LEAKAGE" SEAT TIGHTNESS (API 598 RESILIENT SEAT
- Valve Size: 3 to 48 inch
- Valve Type: Butterfly Valves, Other
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Supplier: Titebond
Description: Titebond® 991 PROvantage Wood Flooring Adhesive is based on proprietary VOC-compliant advanced solvent technology. This unique combination provides the installer with the benefits of excellent green grab and superior bond strength, while being environmentally responsible and complying with
- Chemical / Polymer System Type: Specialty / Other
- Viscosity: 125000 cP
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Description: Hardness of 1800-2200, making the windows made from single crystals sapphire resistant in extreme to chemical corrosion and abrasions. Sapphire windows might be produced into thin optics without fracturing because of the tight internal covalent bonding of single crystal sapphire while
- Mirror Coatings: Uncoated, Other Mirror Coating
- Surface Quality: Other
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Supplier: Titebond
Description: moisture and glue it down in one application, saving labor and time. Once cured, the product is water resistant and is not adversely affected by exposure to moisture or water. It provides a tough, flexible, and tenacious bond to a variety of substrates. Alternatively, Titebond 771-Step can be
- Chemical / Polymer System Type: Specialty / Other
- Viscosity: 125000 cP
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Supplier: Titebond
Description: Titebond 811 Advantage Urethane Wood Flooring Adhesive is ideal for the installation of all wood parquet, engineered and solid plank flooring. It is a moisture-resistant adhesive that offers enhanced strength development and an exceptional final bond. Additionally, Titebond 811 Advantage has
- Chemical / Polymer System Type: Specialty / Other
- Viscosity: 100000 cP
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Supplier: Titebond
Description: Titebond 801 Preferred Urethane Wood Flooring Adhesive is ideal for the installation of all wood parquet, engineered and solid plank flooring. It is a moisture-resistant adhesive that offers enhanced strength development and an exceptional final bond. This urethane adhesive also provides the
- Chemical / Polymer System Type: Specialty / Other
- Viscosity: 100000 cP
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Description: splattering abrasive particles, such as drilling viewport windows, protective laser processing windows, and gun sights. Due to the firm internal covalent bonding of sapphire, windows made from sapphire could be manufactured into much thinner pieces without fracture than the counterparts made
- Parallelism or Wedge Angle: 0.5000 arcmin
- Surface Quality: 20-10 Scratch / Dig, 40-20 Scratch / Dig, 60-40 Scratch / Dig, Other
- Window Shape: Square
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Description: windows are able to sustain tremendous pressure and be formed into much thinner pieces without cracking than their dielectric equivalents because of the solid internal covalent bonding of sapphire. For instance, sapphire windows are often chosen in deepwater and navigation scenarios
- Materials: Sapphire, Specialty / Other
- Surface Flatness: λ/2
- Surface Quality: 40-20 Scratch / Dig, 60-40 Scratch / Dig, Other
- Thickness: 0.5000 to 3.18 mm
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Featured Products Top
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devices, through ball-wedge or wedge-wedge Au-wire bonding. Customized adaptations are available on request. Learn more: Bondsens temperature sensor | IST AG Contact your IST team to get sensor chip implementation support for your project. (read more)
Browse Resistive Temperature Devices (RTD) Elements Datasheets for Innovative Sensor Technology IST USA Division -
have today. Some of our more standardized Optographic products include: Reticles, Resolution Targets (including USAF & Sayce), Gratings, Step Wedges, Optical Rulers Field Finders, Rapid Comparators, Encoder Discs & Scales, Apertures and Grids (read more)
Browse Reticles Datasheets for Gurley Precision Instruments -
produced by sintering, reaction bonding, crystal growth, and chemical vapor deposition (CVD). Silicon carbide offers low density and high stiffness, as well as extreme hardness and wear resistance. The CVD material can be produced with such low electrical resistance (around one ohm cm) that (read more)
Browse Ultra-hard Materials Machining Datasheets for Insaco, Inc.
Conduct Research Top
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Introduction of Wedge Capillary for Wire Bonding
Wire bonding is currently the mainstream connection method for semiconductors packaging. Commonly used wire bonding welding methods include thermocompression welding, ultrasonic welding and ultrasonic thermocompression welding. Wire bonding can be categorised as ball bonding and wedge bonding
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Reliable Wire Bonding Through Quality Data Collection for Industry 4.0
methods in small device manufacturing due to its cost effectiveness and reliability. Initial iterations of wire bonding began in the mid twentieth century where it was used to connect early silicon semiconductor devices to their ceramic packaging. These wire bonds, typically wedge bonded, were
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
. announced that chip-equipment veteran Brad Mattson has been elected chairman. K &S sells wedge bonder technology to Orthodyne Continuing to shed its non-core businesses, backend assembly equipment specialist Kulicke & Soffa Industries Inc. (K &S) announced the sale of its wedge bonder technology
More Information Top
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Advanced Wirebond Interconnection Technology
1.1: Wire Bonding Technologies 1.1.1: Thermosonic Bonding 1.1.2: Ultrasonic Wedge Bonding 1.2: Advantages of Ball-Wedge Bonding 1.2.1: Disadvantages of Thermosonic Ball- Wedge Bonding 1.3: Advantages ofAluminum Wedge Bonding 1.3.1: Disadvantages …
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Force Sensors for Microelectronic Packaging Applications
38 2.3 Wedge Bond Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Wire Bonding in Microelectronics, Third Edition > Wire Bond Testing
While the pull test is valid for wedge bonds , it is necessary to use a shear test, or, in some cases, a thermal stress test to evaluate Au ball bonds (on Al pads) adequately.
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Power Electronic Packaging
304 8.4.3 Optimization of Wedge Bonding for a Power Package ....
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Wire Bonding in Microelectronics, Third Edition > Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism
Wedge bonding –tool vibration modes for 60 kHz excitation.
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Wire Bonding in Microelectronics, Third Edition > Advanced and Specialized Wire Bonding Technologies
One approach to achieve bond-production control with small sample sizes used the deformed width of wedge bonds (which fitted a normal distribution as determined by the Chi-square statistic) in conjunction with reliability test data.
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Materials for Advanced Packaging
Fig. 4.3 Ultrasonic bonds ( wedge bonds ).
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Ultrasonic bonds ( wedge bonds ).
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Integrated Circuit Packaging, Assembly and Interconnections
8.4 — Bonding Wire: Au, Al, and Cu............................................................106 8.5 — Bonding Methods................................................................................108 8.6 — Types of Bonds ...................................................................................110 8.7 — The Ball Bonding Process...................................................................110 8.8 — Wedge Bonding ...................................................................................111 8.9 — Obstacles to …
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