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  • Introduction of Wedge Capillary for Wire Bonding
    Wire bonding is currently the mainstream connection method for semiconductors packaging. Commonly used wire bonding welding methods include thermocompression welding, ultrasonic welding and ultrasonic thermocompression welding. Wire bonding can be categorised as ball bonding and wedge bonding
  • Reliable Wire Bonding Through Quality Data Collection for Industry 4.0
    methods in small device manufacturing due to its cost effectiveness and reliability. Initial iterations of wire bonding began in the mid twentieth century where it was used to connect early silicon semiconductor devices to their ceramic packaging. These wire bonds, typically wedge bonded, were
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    . announced that chip-equipment veteran Brad Mattson has been elected chairman. K &S sells wedge bonder technology to Orthodyne Continuing to shed its non-core businesses, backend assembly equipment specialist Kulicke & Soffa Industries Inc. (K &S) announced the sale of its wedge bonder technology

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